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1. 发明授权

US09035329B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US09035329B2
公开(公告)日：2015-05-19
申请号：US13048357
申请日：2011-03-15
申请人： Chao-Hsing Chen , Chien-Kai Chung , Hui-chen Yeh , Yi-Wen Ku
发明人： Chao-Hsing Chen , Chien-Kai Chung , Hui-chen Yeh , Yi-Wen Ku
IPC分类号： H01L33/00 , H01L25/075 , H01L27/15 , H01L33/38 , H01L33/62
CPC分类号： H01L25/0753 , H01L27/156 , H01L33/385 , H01L33/62 , H01L2224/24
摘要： The light-emitting device having an equivalent circuit, includes at least four terminals, numbered from first terminal to fourth terminal, for electrical power feeding; a first light-emitting diode, arranged between the first terminal and the second terminal, configured to not emit light when a voltage is applied between the second terminal and one of the third terminal and the fourth terminal, and configured to emit light when a. voltage is applied between the first terminal and one of the third terminal and the four the terminal; and a second light-emitting diode, arranged between the third terminal and the fourth terminal, and configured to not emit light when the voltage is applied between the third terminal and one of the first terminal and the second terminal and configured to emit light when a voltage is applied between the fourth terminal and one of the first terminal and the second terminal.
摘要翻译：具有等效电路的发光装置包括从第一端子到第四端子编号的至少四个端子，用于供电; 布置在所述第一端子和所述第二端子之间的第一发光二极管被配置为当在所述第二端子和所述第三端子和所述第四端子中的一个之间施加电压时不发光，并且被配置为当a。在第一端子和第三端子中的一个端子以及四个端子之间施加电压; 以及第二发光二极管，其配置在所述第三端子与所述第四端子之间，并且被配置为当所述第三端子与所述第一端子和所述第二端子中的一者之间施加电压时不发光，并且被配置为当第在第四端子与第一端子和第二端子之一之间施加电压。

2. 发明申请

US20120061691A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20120061691A1
公开(公告)日：2012-03-15
申请号：US13048357
申请日：2011-03-15
申请人： Chao-Hsing CHEN , Chien-Kai Chung , Hui-Chen Yeh , Yi-Wen Ku
发明人： Chao-Hsing CHEN , Chien-Kai Chung , Hui-Chen Yeh , Yi-Wen Ku
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L27/156 , H01L33/385 , H01L33/62 , H01L2224/24
摘要： This disclosure discloses a light-emitting device. The light-emitting device comprises: a light-emitting array comprising a first light-emitting unit and a second light-emitting unit electrically connected in serial with the first light-emitting unit; at least two first bonding pads formed on the first light-emitting unit; and at least two second bonding pads formed on the second light-emitting unit. One of the two first bonding pads is in a floating level, and one of the two second bonding pads is in a floating level.
摘要翻译：本公开公开了一种发光装置。发光装置包括：发光阵列，包括与第一发光单元串联电连接的第一发光单元和第二发光单元; 形成在所述第一发光单元上的至少两个第一接合焊盘; 以及形成在第二发光单元上的至少两个第二接合焊盘。两个第一接合焊盘中的一个处于浮置电平，并且两个第二接合焊盘之一处于浮置电平。

3. 发明授权

US09196605B2 Light-emitting structure 有权
标题翻译：发光结构
公开(公告)号：US09196605B2
公开(公告)日：2015-11-24
申请号：US13230988
申请日：2011-09-13
申请人： Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
发明人： Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
IPC分类号： H01L33/08 , H01L25/075 , H01L27/15 , H01L33/20 , H01L33/38 , H01L33/62
CPC分类号： H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An embodiment of the present application discloses a light-emitting structure, comprising a substrate, a first unit and a second unit separately form on the substrate; a trench formed between the first unit and the second unit, and having a bottom portion exposing the substrate, a less steep sidewall and a steeper sidewall steeper than the less steep sidewall; and an electrical connection connecting the first unit and the second unit and covering the first unit, the second unit and the less steep sidewall; wherein the sidewalls directly connect to the bottom portion, and the steeper sidewall is devoid of the electrical connection covering.
摘要翻译：本申请的一个实施例公开了一种发光结构，其包括基板，第一单元和在基板上分开形成的第二单元; 形成在所述第一单元和所述第二单元之间的沟槽，并且具有暴露所述基板的底部部分，比所述较不陡峭的侧壁更陡峭的侧壁和更陡峭的侧壁; 以及连接第一单元和第二单元并覆盖第一单元，第二单元和较不陡峭侧壁的电连接; 其中所述侧壁直接连接到所述底部部分，并且所述较陡侧壁没有电连接覆盖物。

4. 发明申请

US20110312113A1 LIGHT-EMITTING DIODE STRUCTURE WITH ELECTRODE PADS OF SIMILAR SURFACE ROUGHNESS AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：具有类似表面粗糙度的电极垫的发光二极管结构及其制造方法
公开(公告)号：US20110312113A1
公开(公告)日：2011-12-22
申请号：US13221908
申请日：2011-08-31
申请人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yen , Chien-Kai Chung
发明人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yen , Chien-Kai Chung
IPC分类号： H01L33/20
CPC分类号： H01L33/38 , H01L33/20 , H01L33/382 , H01L2933/0016
摘要： A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
摘要翻译：公开了一种用于促进LED芯片的识别率的发光二极管（LED）结构和LED结构的制造方法，其中使第一导电类型的第一电极焊盘下方的表面的粗糙程度类似于的第二导电类型的第二电极焊盘的表面，使得从第一电极焊盘示出的光泽可以类似于来自第二电极焊盘的光泽，从而解决由不同光泽引起的引线接合机的不良识别问题从第一和第二电极焊盘。

5. 发明申请

US20080157097A1 Light-emitting diode structure and method for manufacturing the same 审中-公开
标题翻译：发光二极管结构及其制造方法
公开(公告)号：US20080157097A1
公开(公告)日：2008-07-03
申请号：US11699942
申请日：2007-01-30
申请人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yeh , Chien-Kai Chung
发明人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yeh , Chien-Kai Chung
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/38 , H01L33/20 , H01L33/382 , H01L2933/0016
摘要： A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
摘要翻译：公开了一种用于促进LED芯片的识别率的发光二极管（LED）结构和LED结构的制造方法，其中使第一导电类型的第一电极焊盘下方的表面的粗糙程度类似于的第二导电类型的第二电极焊盘的表面，使得从第一电极焊盘示出的光泽可以类似于来自第二电极焊盘的光泽，从而解决由不同光泽引起的引线接合机的不良识别问题从第一和第二电极焊盘。

6. 发明授权

US09231158B2 Light-emitting diode structure with electrode pads of similar surface roughness and method for manufacturing the same 有权
标题翻译：具有类似表面粗糙度的电极焊盘的发光二极管结构及其制造方法
公开(公告)号：US09231158B2
公开(公告)日：2016-01-05
申请号：US13221908
申请日：2011-08-31
申请人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yen , Chien-Kai Chung
发明人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yen , Chien-Kai Chung
IPC分类号： H01L21/00 , H01L33/38 , H01L33/20
CPC分类号： H01L33/38 , H01L33/20 , H01L33/382 , H01L2933/0016
摘要： A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
摘要翻译：公开了一种用于促进LED芯片的识别率的发光二极管（LED）结构和LED结构的制造方法，其中使第一导电类型的第一电极焊盘下方的表面的粗糙程度类似于的第二导电类型的第二电极焊盘的表面，使得从第一电极焊盘示出的光泽可以类似于来自第二电极焊盘的光泽，从而解决由不同光泽引起的引线接合机的不良识别问题从第一和第二电极焊盘。

7. 发明授权

US08759848B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US08759848B2
公开(公告)日：2014-06-24
申请号：US13545354
申请日：2012-07-10
申请人： Chao-Hsing Chen , Chien-Kai Chung , Hsin-Mao Liu , Chiu-Lin Yao , Chien-Fu Huang
发明人： Chao-Hsing Chen , Chien-Kai Chung , Hsin-Mao Liu , Chiu-Lin Yao , Chien-Fu Huang
IPC分类号： H01L33/08 , H01L25/075 , H01L33/62 , H01L33/38
CPC分类号： H01L25/0753 , H01L25/0756 , H01L33/385 , H01L33/62 , H01L2224/16
摘要： The application provides a light-emitting device, comprising a substrate; a plurality of first light-emitting diode units on the substrate, wherein every first light-emitting diode unit has a first electrode structure; and a plurality of second light-emitting diode units among the plurality of first light-emitting diode units, wherein every second light-emitting diode unit has a second electrode structure. The second electrode structure of the second light-emitting diode unit is flipped over and electrically connected with the adjacent first electrode structure of the first light-emitting diode unit.
摘要翻译：本发明提供一种发光装置，其包括基板; 多个第一发光二极管单元，其中每个第一发光二极管单元具有第一电极结构; 以及多个第一发光二极管单元中的多个第二发光二极管单元，其中每个第二发光二极管单元具有第二电极结构。第二发光二极管单元的第二电极结构被翻转并与第一发光二极管单元的相邻的第一电极结构电连接。

8. 发明申请

US20120061667A1 LIGHT-EMITTING ELEMENT 有权
标题翻译：发光元件
公开(公告)号：US20120061667A1
公开(公告)日：2012-03-15
申请号：US13231250
申请日：2011-09-13
申请人： Chein-Fu Huang , Chao-Hsing CHEN , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
发明人： Chein-Fu Huang , Chao-Hsing CHEN , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
IPC分类号： H01L33/32 , H01L33/26
CPC分类号： H01L27/153 , H01L33/20 , H01L33/22 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting element includes: a substrate including a first surface and a second surface different from the first surface; a plurality of light-emitting structure units disposed on the second surface; and a trench formed on the first surface and between the plurality of light-emitting structure units.
摘要翻译：发光元件包括：基板，包括第一表面和与第一表面不同的第二表面; 设置在所述第二表面上的多个发光结构单元; 以及形成在所述第一表面上和所述多个发光结构单元之间的沟槽。

9. 发明授权

US08890178B2 Light-emitting element 有权
标题翻译：发光元件
公开(公告)号：US08890178B2
公开(公告)日：2014-11-18
申请号：US13231250
申请日：2011-09-13
申请人： Chien-Fu Huang , Chao-Hsing Chen , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
发明人： Chien-Fu Huang , Chao-Hsing Chen , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
IPC分类号： H01L29/18 , H01L27/15 , H01L33/22 , H01L33/20 , H01L33/62
CPC分类号： H01L27/153 , H01L33/20 , H01L33/22 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting element includes a monolithic understructure including a first surface and a second surface different from the first surface; a plurality of light-emitting structure units disposed on the second surface; and a trench formed on a portion of the first surface and between the plurality of light-emitting structure units, wherein a height of the portion of the first surface is greater than a height of the second surface measured from a bottom of the monolithic understructure, and the portion of the first surface is exposed by the trench.
摘要翻译：发光元件包括：整体式下结构，包括第一表面和与第一表面不同的第二表面; 设置在所述第二表面上的多个发光结构单元; 以及形成在所述第一表面的一部分上并且在所述多个发光结构单元之间的沟槽，其中所述第一表面的所述部分的高度大于从所述整体式下部结构的底部测量的所述第二表面的高度，并且第一表面的部分被沟槽暴露。

10. 发明授权

US08592827B2 Light-emitting device and the manufacturing method thereof 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08592827B2
公开(公告)日：2013-11-26
申请号：US13225640
申请日：2011-09-06
申请人： Chien-Fu Huang , Chao-Hsing Chen , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
发明人： Chien-Fu Huang , Chao-Hsing Chen , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
IPC分类号： H01L27/15
CPC分类号： H01L27/15 , H01L27/153 , H01L33/0079 , H01L33/382 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting device includes: a carrier; a light-emitting structure formed on the carrier, wherein the light-emitting structure has a first surface facing the carrier, a second surface opposite to the first surface, and an active layer between the first surface and the second surface; a plurality of first trenches extended from the first surface and passing through the active layer so a plurality of light-emitting units is defined; and a plurality of second trenches extended from the second surface and passing through the active layer of each of the plurality of light-emitting units.
摘要翻译：发光装置包括：载体; 形成在所述载体上的发光结构，其中所述发光结构具有面向所述载体的第一表面，与所述第一表面相对的第二表面，以及在所述第一表面和所述第二表面之间的有源层; 从所述第一表面延伸并穿过所述有源层的多个第一沟槽，以限定多个发光单元; 以及从所述第二表面延伸并穿过所述多个发光单元中的每一个的有源层的多个第二沟槽。

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