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    • 1. 发明授权
    • Method of providing routing protocol in sensor network
    • 在传感器网络中提供路由协议的方法
    • US07460532B2
    • 2008-12-02
    • US10951987
    • 2004-09-27
    • Changmin ShinSeung Min ParkJae Hyuk RyuYong Jin LimDae Young Kim
    • Changmin ShinSeung Min ParkJae Hyuk RyuYong Jin LimDae Young Kim
    • H04L12/28
    • H04W40/08H04L45/00H04L45/26Y02D70/142Y02D70/22Y02D70/324
    • A method of providing a routing protocol in a sensor network includes the steps of: initializing a routing table and searching a network device of a node to initialize a host; opening a socket when there is a request for forwarding of an IP (Internet Protocol) packet from an upper layer or when there is a request through the network device; determining whether there is the IP packet forwarding request of the upper layer node or whether the packet is received from the network device; if there is the IP packet forwarding request of the upper layer, searching the routing table, and determining whether or not there is a destination node which intends to transmit the packet, and returning to a main loop if there is the destination node; and if the packet is received through the network device, determining types of the received packets and performing RREQ (route request) process, IDLE process, RREP (route reply) process, RERR (route error) process, and RREP_ACK (route reply acknowledgement) process.
    • 在传感器网络中提供路由协议的方法包括以下步骤:初始化路由表并搜索节点的网络设备来初始化主机; 当存在从上层转发IP(因特网协议)分组的请求或者当通过网络设备存在请求时,打开套接字; 确定是否存在上层节点的IP分组转发请求或者是否从网络设备接收分组; 如果存在上层的IP分组转发请求,则搜索路由表,并确定是否存在要发送分组的目的地节点,并且如果存在目的地节点则返回到主循环; 如果通过网络设备接收到分组,则确定接收到的分组的类型并执行RREQ(路由请求)过程,IDLE进程,RREP(路由回复)进程,RERR(路由错误)进程和RREP_ACK(路由应答确认) 处理。
    • 2. 发明申请
    • PROCESS MODULE, FABRICATING METHOD THEREOF AND SUBSTRATE PROCESSING METHOD USING THE PROCESS MODULE
    • 工艺模块,其制造方法及使用工艺模块的基板处理方法
    • US20150053336A1
    • 2015-02-26
    • US14346366
    • 2014-02-19
    • Yong Jin LimJae Jeong Kwak
    • Yong Jin LimJae Jeong Kwak
    • B32B38/10B32B37/12
    • G06F3/044B32B2457/20B32B2457/208G06F2203/04103Y10T156/10Y10T156/17
    • Disclosed are a process module, a fabrication method thereof, and a substrate processing method using the process module. The process module includes a structure in which cell substrates are fixed on a carrier member by an adhesive according to a preset alignment standard. The fabrication method includes aligning the cell substrates according to a preset alignment standard, applying an adhesive to at least one of surfaces facing each other between the cell substrates and the carrier member, and attaching the cell substrates to the carrier member by using the adhesive. The substrate processing method includes performing the substrate processing process of the cell substrates at the same time by using the process module integrated with the cell substrates. The substrate processing method selectively includes calibrating the alignment standard for the cell substrates in the substrate processing process to an alignment state of the cell substrates in the process module.
    • 公开了一种处理模块及其制造方法,以及使用该处理模块的基板处理方法。 处理模块包括根据预设的对准标准,通过粘合剂将单元基板固定在载体构件上的结构。 制造方法包括根据预设的对准标准对准单元基板,将粘合剂施加到单元基板和载体构件之间彼此相对的表面中的至少一个表面,并且通过使用粘合剂将单元基板附接到载体构件。 基板处理方法包括通过使用与单元基板一体化的处理模块同时执行单元基板的基板处理处理。 基板处理方法选择性地包括将基板处理工艺中的单元基板的对准标准校准为处理模块中的单元基板的对准状态。