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1. 发明授权

US06582982B2 Composition for wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof 有权
公开(公告)号：US06582982B2
公开(公告)日：2003-06-24
申请号：US09962210
申请日：2001-09-26
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
IPC分类号： H01L2100
CPC分类号： G02F1/1368 , G02F1/136227 , G02F1/136286 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has a low resistivity of less than 15 &mgr;&OHgr;cm and is etched to have a smooth taper angle using an Al alloy enchant or a Cr enchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor display along with an Al layer or a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can be used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using polymer layer, an etch gas system using CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas of SF6+HCl (+He) or SF6+Cl2 (+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched using the Mo or MoW layer as a mask, using an etch gas system that employs a gas such as hydrogen halide and at least one gas selected from CF4, CHF3, CHClF2, CH3F, and C2F6, yields good TFT characteristics, and H2 plasma treatment can further improve the TFT characteristics.

2. 发明授权

US06486494B2 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof 有权
标题翻译：配线用组合物，使用该组合物的布线及其制造方法，使用布线的显示器及其制造方法
公开(公告)号：US06486494B2
公开(公告)日：2002-11-26
申请号：US10035245
申请日：2002-01-04
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
IPC分类号： H01L2904
CPC分类号： G02F1/136286 , G02F1/136227 , G02F1/1368 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has a low resistivity of less than 15 &mgr;&OHgr;cm and is etched to have a smooth taper angle using an Al alloy enchant or a Cr enchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor display along with An Al layer or a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can be used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using polymer layer, an etch gas system using CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas of SF6+HCl (+He) or SF6+Cl2 (+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched using the Mo or MoW layer as a mask, using an etch gas system that employs a gas such as hydrogen halide and at least one gas selected from CF4, CHF3, CHClF2, CH3F, and C2F6, yields good TFT characteristics, and H2 plasma treatment can further improve the TFT characteristics.
摘要翻译： Mo或MoW组合物层具有小于15μOMEGAcm的低电阻率，并且使用Al合金附魔或Cr附魔被蚀刻成具有平滑的锥角，并且Mo或MoW层用于显示器或半导体显示器以及Al Al层或Cr层。由于通过调节沉积压力可以沉积Mo或MoW层以便对基底施加低应力，所以可以单独使用单个MoW层作为布线。当在钝化层或栅极绝缘层中形成接触孔时，通过使用聚合物层减少横向蚀刻，使用CF 4 + O 2的蚀刻气体系统可以防止Mo或MoW合金层的蚀刻，以及蚀刻气体 SF6 + HCl（+ He）或SF6 + Cl2（+ He）可以形成要平滑的接触孔的边缘轮廓。此外，当使用Mo或MoW层作为掩模蚀刻形成在Mo或MoW层下面的非晶硅层时，使用采用诸如卤化氢和至少一种选自CF 4，CHF 3的气体的气体的蚀刻气体系统， CHClF 2，CH 3 F和C 2 F 6，产生良好的TFT特性，并且H 2等离子体处理可以进一步提高TFT特性。

3. 发明授权

US06380098B1 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof 有权
标题翻译：配线用组合物，使用该组合物的布线及其制造方法，使用布线的显示器及其制造方法
公开(公告)号：US06380098B1
公开(公告)日：2002-04-30
申请号：US09492830
申请日：2000-01-27
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
IPC分类号： H01L21302
CPC分类号： G02F1/1368 , G02F1/136227 , G02F1/136286 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has the low resistivity less than 15 &mgr;&OHgr;cm and is etched to have a smooth taper angle using an Al alloy etchant or a Cr etchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor device along with an Al layer and a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using a polymer layer, an etch gas system CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas SF6+HCl(+He) or SF6+Cl2(+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched by using the Mo or MoW layer as a mask, to use an etch gas system such as hydrogen halide and at least one selected from CF4, CHF3, CHClF2, CH3F and C2F6 yield the good characteristics of TFT, and H2 plasma treatment can cause the characteristics of the TFT to be improved.
摘要翻译： Mo或MoW组合物层具有小于15μOMEGAcm的低电阻率，并且使用Al合金蚀刻剂或Cr蚀刻剂蚀刻以具有平滑的锥角，并且Mo或MoW层用于显示器或半导体的布线装置以及Al层和Cr层。由于可以通过调整沉积压力来沉积Mo或MoW层以对基底施加低应力，所以可以单个MoW层自身用作布线。当在钝化层或栅极绝缘层中形成接触孔时，通过使用聚合物层减少横向蚀刻，蚀刻气体系统CF4 + O2可以防止Mo或MoW合金层的蚀刻，并且蚀刻气体SF6 + HCl（+ He）或SF6 + Cl2（+ He）可以形成要平滑的接触孔的边缘轮廓。此外，当通过使用Mo或MoW层作为掩模蚀刻形成在Mo或MoW层下面的非晶硅层时，使用蚀刻气体系统如卤化氢和选自CF 4，CHF 3，CHClF 2，CH 3 F 和C2F6产生TFT的良好特性，并且H2等离子体处理可以导致TFT的特性得到改善。

4. 发明授权

US06445004B1 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof 有权
标题翻译：配线用组合物，使用该组合物的布线及其制造方法，使用布线的显示器及其制造方法
公开(公告)号：US06445004B1
公开(公告)日：2002-09-03
申请号：US09617311
申请日：2000-07-14
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
IPC分类号： H01L2904
CPC分类号： G02F1/136286 , G02F1/136227 , G02F1/1368 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has a low resistivity of less than 15 &mgr;&OHgr;cm and is etched to have a smooth taper angle using an Al alloy enchant or a Cr enchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor display along with an Al layer or a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can be used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using polymer layer, an etch gas system using CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas of SF6+HCl(+He) or SF6+Cl2(+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched using the Mo or MoW layer as a mask, using an etch gas system that employs a gas such as hydrogen halide and at least one gas selected from CF4, CHF3, CHClF2, CH3F, and C2F6, yields good TFT characteristics, and H2 plasma treatment can further improve the TFT characteristics.
摘要翻译： Mo或MoW组合物层具有小于15μOMEGAcm的低电阻率，并且使用Al合金附魔或Cr附魔被蚀刻成具有平滑的锥角，并且Mo或MoW层用于显示器或半导体显示器以及Al层或Cr层。由于通过调节沉积压力可以沉积Mo或MoW层以便对基底施加低应力，所以可以单独使用单个MoW层作为布线。当在钝化层或栅极绝缘层中形成接触孔时，通过使用聚合物层减少横向蚀刻，使用CF 4 + O 2的蚀刻气体系统可以防止Mo或MoW合金层的蚀刻，以及蚀刻气体 SF6 + HCl（+ He）或SF6 + Cl2（+ He）可以形成要平滑的接触孔的边缘轮廓。此外，当使用Mo或MoW层作为掩模蚀刻形成在Mo或MoW层下面的非晶硅层时，使用采用诸如卤化氢和至少一种选自CF 4，CHF 3的气体的气体的蚀刻气体系统， CHClF 2，CH 3 F和C 2 F 6，产生良好的TFT特性，并且H 2等离子体处理可以进一步提高TFT特性。

5. 发明授权

US06337520B1 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and manufacturing method thereof 失效
标题翻译：配线用组合物，使用该组合物的配线，其制造方法，使用配线的显示器及其制造方法
公开(公告)号：US06337520B1
公开(公告)日：2002-01-08
申请号：US09031486
申请日：1998-02-26
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Chun-Gi You
IPC分类号： H01L2348
CPC分类号： G02F1/1368 , G02F1/136227 , G02F1/136286 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has the low resistivity less than 15 &mgr;&OHgr;cm and is etched to have a smooth taper angle using an Al alloy etchant or a Cr etchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor device along with an Al layer and a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using a polymer layer, an etch gas system CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas SF6+HCl(+He) or SF6+Cl2(+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched by using the Mo or MoW layer as a mask, to use an etch gas system such as hydrogen halide and at least one selected from CF4, CHF3, CHClF2, CH3F and C2F6 yield the good characteristics of TFT, and H2 plasma treatment can cause the characteristics of the TFT to be improved.
摘要翻译： Mo或MoW组合物层具有小于15μOMEGAcm的低电阻率，并且使用Al合金蚀刻剂或Cr蚀刻剂蚀刻以具有平滑的锥角，并且Mo或MoW层用于显示器或半导体的布线装置以及Al层和Cr层。由于可以通过调整沉积压力来沉积Mo或MoW层以对基底施加低应力，所以可以单个MoW层自身用作布线。当在钝化层或栅极绝缘层中形成接触孔时，通过使用聚合物层减少横向蚀刻，蚀刻气体系统CF4 + O2可以防止Mo或MoW合金层的蚀刻，并且蚀刻气体SF6 + HCl（+ He）或SF6 + Cl2（+ He）可以形成要平滑的接触孔的边缘轮廓。此外，当通过使用Mo或MoW层作为掩模蚀刻形成在Mo或MoW层下面的非晶硅层时，使用蚀刻气体系统如卤化氢和选自CF 4，CHF 3，CHClF 2，CH 3 F 和C2F6产生TFT的良好特性，并且H2等离子体处理可以导致TFT的特性得到改善。

6. 发明授权

US06946681B2 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof 失效
标题翻译：配线用组合物，使用该组合物的布线及其制造方法，使用布线的显示器及其制造方法
公开(公告)号：US06946681B2
公开(公告)日：2005-09-20
申请号：US10732480
申请日：2003-12-11
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
IPC分类号： G02F1/1362 , G02F1/1368 , H01L21/28 , H01L23/482 , H01L29/423 , H01L29/49 , H01L29/04 , H01L31/036 , H01L31/0376
CPC分类号： G02F1/136286 , G02F1/136227 , G02F1/1368 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has a low resistivity of less than 15 μΩcm and is etched to have a smooth taper angle using an Al alloy enchant or a Cr enchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor display along with an Al layer or a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can be used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using polymer layer, an etch gas system using CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas of SF6+HCl (+He) or SF6+Cl2 (+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched using the Mo or MoW layer as a mask, using an etch gas system that employs a gas such as hydrogen halide and at least one gas selected from CF4, CHF3, CHClF2, CH3F, and C2F6, yields good TFT characteristics, and H2 plasma treatment can further improve the TFT characteristics.
摘要翻译： Mo或MoW组合物层具有小于15μOggacm的低电阻率，并且使用Al合金附魔或Cr附魔蚀刻成具有平滑的锥角，并且Mo或MoW层用于显示器或半导体显示器以及Al层或Cr层。由于通过调节沉积压力可以沉积Mo或MoW层以便对基底施加低应力，所以可以单独使用单个MoW层作为布线。当在钝化层或栅极绝缘层中形成接触孔时，通过使用聚合物层减少横向蚀刻，使用CF 4 O 2 O 2的蚀刻气体系统防止Mo或MoW合金层的蚀刻，以及SF 6+ + HCl（+ He）或SF 6 + Cl 2 2的蚀刻气体 >（+ He）可以形成要平滑的接触孔的边缘轮廓。此外，当使用Mo或MoW层作为掩模蚀刻形成在Mo或MoW层下面的非晶硅层时，使用采用诸如卤化氢的气体和选自以下的至少一种气体的蚀刻气体系统： 4，CHF 3，CHClF 2，CH 3，F和C 2 _{6 ，产生良好的TFT特性，H 2等离子体处理可进一步提高TFT特性。}

7. 发明授权

US06570182B2 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof 有权
公开(公告)号：US06570182B2
公开(公告)日：2003-05-27
申请号：US10190494
申请日：2002-07-09
申请人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
发明人： Chang-Oh Jeong , Yang-Sun Kim , Myung-Koo Hur , Young-Jae Tak , Mun-Pyo Hong , Chi-Woo Kim , Jang-Soo Kim , Chun-Gi You
IPC分类号： H01L2904
CPC分类号： G02F1/136286 , G02F1/136227 , G02F1/1368 , G02F2001/13629 , H01L21/28008 , H01L23/4827 , H01L29/42384 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The Mo or MoW composition layer has a low resistivity of less than 15 &mgr;&OHgr;cm and is etched to have a smooth taper angle using an Al alloy enchant or a Cr enchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor display along with an Al layer or a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can be used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using polymer layer, an etch gas system using CF4+O2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas of SF6+HCl (+He) or SF6+Cl2 (+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched using the Mo or MoW layer as a mask, using an etch gas system that employs a gas such as hydrogen halide and at least one gas selected from CF4, CHF3, CHClF2, CH3F, and C2F6, yields good TFT characteristics, and H2 plasma treatment can further improve the TFT characteristics.

8. 发明授权

US08785910B2 Thin film transistor, display device including the same, and method of manufacturing the display device 有权
标题翻译：薄膜晶体管，包括其的显示装置及其制造方法
公开(公告)号：US08785910B2
公开(公告)日：2014-07-22
申请号：US12926665
申请日：2010-12-02
申请人： Jong-Hyun Park , Chun-Gi You , Sun Park , Jin-Hee Kang , Yul-Kyu Lee
发明人： Jong-Hyun Park , Chun-Gi You , Sun Park , Jin-Hee Kang , Yul-Kyu Lee
IPC分类号： H01L29/04 , H01L29/10 , H01L21/84 , H01L21/00 , H01L31/00
CPC分类号： H01L29/42384 , H01L27/12 , H01L27/1281 , H01L29/04 , H01L29/78678
摘要： A thin film transistor, a display device including the same, and a method of manufacturing the display device, the thin film transistor including a substrate; a gate electrode on the substrate; a gate insulating layer on the gate electrode; a semiconductor layer on the gate insulating layer; and source/drain electrodes electrically connected with the semiconductor layer, wherein the gate electrode has a thickness of about 500 Å to about 1500 Å and the gate insulating layer has a thickness of about 1600 Å to about 2500 Å.
摘要翻译：薄膜晶体管，包括该薄膜晶体管的显示装置和制造该显示装置的方法，该薄膜晶体管包括一基板; 基板上的栅电极; 栅电极上的栅极绝缘层; 栅极绝缘层上的半导体层; 以及与半导体层电连接的源极/漏极，其中栅电极具有大约至大约的厚度，并且栅极绝缘层具有大约至大约的厚度。

9. 发明授权

US08759836B2 Thin film transistor array substrate, organic light-emitting display device including the same and method of manufacturing the thin film transistor array substrate 有权
标题翻译：薄膜晶体管阵列基板，包括该薄膜晶体管阵列基板的有机发光显示装置及其制造方法
公开(公告)号：US08759836B2
公开(公告)日：2014-06-24
申请号：US13589636
申请日：2012-08-20
申请人： Chun-Gi You , Joon-Hoo Choi
发明人： Chun-Gi You , Joon-Hoo Choi
IPC分类号： H01L29/04 , H01L29/12 , H01L29/15
CPC分类号： H01L27/1288 , H01L27/1255 , H01L27/3262 , H01L29/4908
摘要： A thin film transistor (TFT) array substrate includes a TFT including an active layer, a gate electrode, source and drain electrodes, a first insulating layer between the active layer and the gate electrode, and a second insulating layer and a third insulating layer between the gate electrode and the source and drain electrodes, the first insulating layer and the second insulating layer extending in the TFT, a pixel electrode including a transparent conductive oxide material, the pixel electrode being on the first insulating layer and the second insulating layer and being connected to the source or drain electrodes via an opening in the third insulating layer, a capacitor including a first electrode on a same layer as the gate electrode and a second electrode on a same layer as the pixel electrode; and a fourth insulating layer covering the source and drain electrodes and exposing the pixel electrode via an opening.
摘要翻译：薄膜晶体管（TFT）阵列基板包括：TFT，包括有源层，栅电极，源电极和漏电极，有源层和栅电极之间的第一绝缘层，以及第二绝缘层和第三绝缘层，所述栅电极和所述源极漏极，所述第一绝缘层和在所述TFT中延伸的所述第二绝缘层，包括透明导电氧化物材料的像素电极，所述像素电极在所述第一绝缘层和所述第二绝缘层上，并且为通过所述第三绝缘层中的开口连接到所述源电极或漏电极;电容器，包括与所述栅电极相同的层上的第一电极和与所述像素电极相同的层上的第二电极; 以及覆盖所述源电极和漏极的第四绝缘层，并且经由开口暴露所述像素电极。

10. 发明授权

US08704236B2 Thin film transistor and flat panel display device including the same 有权
标题翻译：薄膜晶体管和包括其的平板显示装置
公开(公告)号：US08704236B2
公开(公告)日：2014-04-22
申请号：US13223083
申请日：2011-08-31
申请人： Chun-Gi You , Joon-Hoo Choi
发明人： Chun-Gi You , Joon-Hoo Choi
IPC分类号： H01L27/14 , H01L29/04 , H01L29/15 , H01L31/036
CPC分类号： H01L29/4908 , H01L27/1281 , H01L29/42384 , H01L29/66765
摘要： A thin film transistor (TFT) and a flat panel display device including the same. The TFT includes a substrate, a gate electrode formed over the substrate, the gate electrode formed with silicon doped with impurities, a gate wiring connected to the gate electrode, an active layer formed over the gate electrode, and source and drain electrodes connected to the active layer. According to such a structure, since heat flow to the gate electrode during crystallization of the active layer may be prevented, stable crystallization of the active layer may be performed, and thus an error rate of a product may be decreased.
摘要翻译：薄膜晶体管（TFT）和包括该薄膜晶体管的平板显示装置。 TFT包括衬底，形成在衬底上的栅电极，形成有掺杂有杂质的硅的栅极电极，连接到栅电极的栅极布线，形成在栅电极上的有源层，以及连接到栅电极的源极和漏极活动层根据这样的结构，由于可以防止在有源层结晶时向栅电极的热流，可以进行有源层的稳定的结晶化，从而可以降低产品的误差率。

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