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    • 7. 发明授权
    • Beam scanner and surface measurement apparatus
    • 光束扫描仪和表面测量仪器
    • US08098382B2
    • 2012-01-17
    • US12613212
    • 2009-11-05
    • Tak Gyum KimBae Kyun Kim
    • Tak Gyum KimBae Kyun Kim
    • G01N21/00
    • G01B11/24G01N21/94G01N21/9501G01N2201/1042G02B26/12
    • Disclosed are a beam scanner and a surface measurement apparatus. The beam scanner includes a spinning mirror having top and bottom reflective surfaces and a plurality of side reflective surfaces between the top and bottom reflective surfaces, and rotating about a rotary shaft penetrating the top and bottom reflective surfaces to scan beams, falling onto the side reflective surface, in one direction, a first light source emitting first beams to the side reflective surface, a second light source emitting second beams to at least one of the top and bottom reflective surfaces, and a detector receiving beams reflected by the spinning mirror, among the second beams. The beam scanner and the surface measurement apparatus can achieve high-speed, high resolution surface measurement since errors caused by the movement of the spinning mirror for beam scanning are minimized.
    • 公开了一种光束扫描器和表面测量装置。 光束扫描器包括具有顶部反射表面和底部反射表面的旋转镜和位于顶部和底部反射表面之间的多个侧面反射表面,并且绕着穿过顶部和底部反射表面的旋转轴旋转以扫描光束, 在一个方向上表面向第一反射表面发射第一光束的第一光源,向第一和第二反射表面中的至少一个发射第二光束的第二光源和接收由该纺镜反射的光束的检测器, 第二个梁。 光束扫描器和表面测量装置可以实现高速,高分辨率的表面测量,因为用于光束扫描的旋转镜的移动引起的误差最小化。
    • 8. 发明授权
    • Method of inspecting defects in circuit pattern of substrate
    • 检查基板电路图形缺陷的方法
    • US08111389B2
    • 2012-02-07
    • US12717688
    • 2010-03-04
    • Seung Seoup LeeTak Gyum KimJin Won Park
    • Seung Seoup LeeTak Gyum KimJin Won Park
    • G01N21/00
    • G01N21/95684G01R31/309
    • Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements.
    • 本文公开了一种检查基板的电路图案中的缺陷的方法。 制备用于以非接触方式将激光束照射到基板的检查对象电路图案上的至少一个激光束辐射单元。 准备用于以不接触的方式将探测光束照射到连接电路图案以电连接到检查对象电路图案的探测光束辐射单元。 使用激光束辐射单元将激光束照射到检查对象电路图案上。 使用探测光束辐射单元将探测光束照射到连接电路图案上,从而测量关于探针光束是否衍射的信息和衍射角。 因此,该方法可以解决诸如由接触压力引起的误差测量等问题,并且可以减少测量所需的时间。