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1. 发明申请

US20090283792A1 SIDE VIEW LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：侧视图发光二极管封装
公开(公告)号：US20090283792A1
公开(公告)日：2009-11-19
申请号：US12510520
申请日：2009-07-28
申请人： Chang Wook KIM , Yoon Suk Han , Young Jae Song , Byung Man Kim , Jae Ky Roh , Seong Jae Hong
发明人： Chang Wook KIM , Yoon Suk Han , Young Jae Song , Byung Man Kim , Jae Ky Roh , Seong Jae Hong
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , G02B6/0073 , H01L33/483 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2224/48227 , H01L2224/4554
摘要： A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
摘要翻译：一种用于背光单元的侧视图LED封装包括具有一倾斜内侧壁的空腔的封装主体，布置在封装主体中的第一和第二引线框架，该封装体的空腔暴露了第一和第二引线框架中的至少一个的一部分，第二引线框架放置在腔的底部到外部，安装在腔的底部上以电连接到第一引线框架和第二引线框架的发光二极管芯片，以及布置在围绕发光二极管的空腔中的透明密封剂芯片。空腔的深度大于发光二极管芯片的安装高度，不超过安装高度的六倍。侧壁的高度被缩短以改善发射光的束角特性，增加光量，并防止侧壁的模制缺陷。

2. 发明授权

US6103554A Method for packaging integrated circuits with elastomer chip carriers 有权
标题翻译：用弹性体芯片载体封装集成电路的方法
公开(公告)号：US6103554A
公开(公告)日：2000-08-15
申请号：US219015
申请日：1998-12-23
申请人： Dae Woo Son , Youn Soo Lee , Byung Man Kim
发明人： Dae Woo Son , Youn Soo Lee , Byung Man Kim
IPC分类号： H01L23/12 , H01L21/82 , H01L23/31 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/22 , H01L23/24
CPC分类号： H01L23/3107 , H01L24/86 , H01L24/97 , H01L2224/50 , H01L2224/97 , H01L2924/12044 , H01L2924/14
摘要： A semiconductor chip packaging method includes the provision of individual elastomer chip carriers cut from an elastomer sheet having a uniform thickness and smooth, parallel surfaces. The elastomer sheet is mounted on an adhesive tape held by a fixing member, such as a support ring, and is then divided into individual carriers. The carrier is attached to a circuit interposer, and a semiconductor chip is attached to the carrier. Circuit leads of the interposer are bonded to connection pads on the chip. The beam lead bonding area is then encapsulated, and conductive bumps are formed on the underside of the package to serve as input/output terminals for the packaged device. Using this method, an number of devices can be packaged simultaneously on a flexible sheet and then separated into individual devices by cutting the sheet between the devices.
摘要翻译：半导体芯片封装方法包括提供从具有均匀厚度和平滑的平行表面的弹性体片材切割的单独的弹性体芯片载体。弹性体片材安装在由诸如支撑环的固定构件保持的胶带上，然后分成单独的载体。载体附接到电路插入器，并且半导体芯片附接到载体。插入器的电路引线连接到芯片上的连接焊盘。然后封装光束引线接合区域，并且在封装的下侧上形成导电凸块，以用作封装器件的输入/输出端子。使用这种方法，可以将多个装置同时包装在柔性片材上，然后通过在装置之间切割片材将其分离成各个装置。

3. 发明授权

US08632218B2 Lighting device 有权
标题翻译：照明设备
公开(公告)号：US08632218B2
公开(公告)日：2014-01-21
申请号：US13227948
申请日：2011-09-08
申请人： Hun Yong Park , Byung Man Kim
发明人： Hun Yong Park , Byung Man Kim
IPC分类号： F21S8/00
CPC分类号： F21V17/02 , F21K9/20 , F21K9/69 , F21V5/04 , F21V5/045 , F21V14/06 , F21V17/12 , F21V29/504 , F21V29/507 , F21Y2115/10
摘要： A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.
摘要翻译：提供照明装置。照明装置包括：安装在基板上的光源模块; 透镜单元，设置在所述光源模块上并且包括容纳所述光源模块的容纳槽; 将透镜单元容纳在其中以将透镜单元从外部保护的壳体单元; 支撑单元，其固定到所述基板并且包括联接孔，所述联接孔具有联接到其上的所述壳体单元，从而支撑所述壳体单元; 以及高度调节单元，其允许所述壳体单元可垂直移动地联接到所述支撑单元并且调节所述透镜单元的高度，使得所述透镜单元的高度变化。

4. 发明申请

US20070181899A1 Light emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20070181899A1
公开(公告)日：2007-08-09
申请号：US11646424
申请日：2006-12-28
申请人： Min Sang Lee , Byung Man Kim , Seon Goo Lee , Dong Yeoul Lee , Alex Chae , Je Myung Park
发明人： Min Sang Lee , Byung Man Kim , Seon Goo Lee , Dong Yeoul Lee , Alex Chae , Je Myung Park
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum.
摘要翻译：提供一种LED封装，其包括由用作第一电极的第一区域和与所述第一区域的一部分重叠形成的第二区域构成的第一封装，所述第二区域限定模制材料填充腔; 安装在第一包装的第一区域上的一个或多个LED芯片; 形成在所述第一封装的第二区域下方的第二封装，所述第二封装由所述第一区域和绝缘构件绝缘，以用作第二电极; 用于电连接LED芯片和第二封装的导线; 以及填充在第一封装的第二区域内的成型材料，以保护LED芯片和导线。第一和第二包装由铝形成。

5. 发明申请

US20150162475A1 SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：太阳能电池模块及其制造方法
公开(公告)号：US20150162475A1
公开(公告)日：2015-06-11
申请号：US14404636
申请日：2012-08-31
申请人： Koo Lee , Chang Seon Hwang , Byung Man Kim , Woo Jin Kim , Yong Hyun Cho , Il Kyo Lee , Ki Han Ko , Seol Hui Jung
发明人： Koo Lee , Chang Seon Hwang , Byung Man Kim , Woo Jin Kim , Yong Hyun Cho , Il Kyo Lee , Ki Han Ko , Seol Hui Jung
IPC分类号： H01L31/056 , H01L31/0203
CPC分类号： H01L31/056 , H01L31/048 , H01L31/0547 , H02S30/10 , Y02E10/52
摘要： The present invention relates to a solar cell module comprising: a transparent plate; a support plate positioned to face the transparent plate; at least one unit cell disposed between the transparent plate and the support plate; a first filler disposed between the transparent plate and the unit cell; a second filler disposed between the support plate and the unit cell; and a reflective layer which is disposed between the second filler and the support plate, and which reflects sunlight that has passed through the transparent plate on the unit cell, wherein the length of the reflective layer is shorter than the length of the second filler and the second filler directly comes in contact with the support plate. According to this configuration, the amount of sunlight irradiated on the unit cell can be increased, thereby enhancing generating efficiency and improving the durability of the solar cell module.
摘要翻译：太阳能电池模块技术领域本发明涉及一种太阳能电池组件，包括：定位成面对透明板的支撑板; 设置在所述透明板和所述支撑板之间的至少一个单元电池; 设置在所述透明板和所述单电池之间的第一填料; 设置在所述支撑板和所述单元电池之间的第二填料; 以及反射层，其设置在所述第二填充物和所述支撑板之间，并且反射已经穿过所述单元电池上的所述透明板的太阳光，其中所述反射层的长度短于所述第二填料的长度，第二填料直接与支撑板接触。根据该结构，可以提高照射在单电池上的阳光量，从而提高发电效率，提高太阳能电池模块的耐久性。

6. 发明授权

US06421456B1 Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks 有权
标题翻译：形成有识别标记的半导体晶片和使用识别标记锯切晶片的方法
公开(公告)号：US06421456B1
公开(公告)日：2002-07-16
申请号：US09205003
申请日：1998-12-02
申请人： Dae Woo Son , Youn Soo Lee , Byung Man Kim
发明人： Dae Woo Son , Youn Soo Lee , Byung Man Kim
IPC分类号： G06K900
CPC分类号： H01L21/67282 , B28D5/0064 , H01L21/3043 , H01L21/78 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： On a semiconductor wafer, recognition marks are fabricated on the crossing points of scribe lines for the purpose of proper wafer alignment in wafer sawing process. Since the recognition mark has a distinctive pattern that is distinguished from other circuit patterns on the chip, the recognition mark can be easily recognized by a camera in a sawing apparatus, and reduce the chance of wafer misaligning. When a part of circuit pattern on the semiconductor chip is used for the alignment purpose, the chance of wafer misalignment relatively high due to the similarity between the part chosen and other parts of the circuit pattern. The present invention also provides a method for sawing the wafer using the recognition marks.
摘要翻译：在半导体晶片上，为了在晶片锯切工艺中进行适当的晶片对准，在划线的交叉点上制造识别标记。由于识别标记具有与芯片上的其他电路图案不同的独特图案，因此可以通过照相机在锯切装置中容易地识别识别标记，并且减少晶片未对准的机会。当使用半导体芯片上的电路图形的一部分用于对准目的时，由于选择的部分和电路图案的其它部分之间的相似性，晶片未对准的可能性相对较高。本发明还提供了一种使用识别标记锯切晶片的方法。

7. 发明授权

US06183589B2 Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads 失效
标题翻译：使用在引线下施加的液体粘合剂来制造片上芯片（LOC）半导体封装的方法
公开(公告)号：US06183589B2
公开(公告)日：2001-02-06
申请号：US09035965
申请日：1998-03-06
申请人： Shin Kim , Byung Man Kim , Il Heung Choi , Jeong Ho Bang
发明人： Shin Kim , Byung Man Kim , Il Heung Choi , Jeong Ho Bang
IPC分类号： B32B3100
CPC分类号： H01L24/27 , H01L23/4951 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L2224/2919 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/743 , H01L2224/83192 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , Y10T29/49121 , Y10T29/53178 , Y10T156/17 , H01L2924/00 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A method for manufacturing lead-on-chip (LOC) semiconductor packages includes steps of preparing a lead frame having inner leads and outer leads, and applying a liquid adhesive having a certain viscosity to the bottom surfaces of the inner leads. The method also includes positioning a semiconductor chip under the lead frame, to expose electrode pads through the space defined between opposing rows of inner leads. The inner leads are then attached to the active surface of the semiconductor chip by means of the liquid adhesive. The adhesive applying step may be carried out using a tool having discharge projections through which liquid adhesive is discharged from a reservoir. The liquid adhesive under the lead frame may be cured and then turned into a solid adhesive layer by thermocompression. The liquid adhesive is a thermosetting resin or a thermoplastic resin.
摘要翻译：一种制造芯片上芯片（LOC）半导体封装的方法包括制备具有内引线和外引线的引线框架的步骤，以及向内引线的底表面施加具有一定粘度的液体粘合剂。该方法还包括将半导体芯片定位在引线框架下方，以通过在相应的内引线行之间限定的空间露出电极焊盘。然后通过液体粘合剂将内部引线附接到半导体芯片的有源表面。粘合剂施加步骤可以使用具有从贮存器排出液体粘合剂的排出突起的工具进行。引线框架下方的液体粘合剂可以固化，然后通过热压变成固体粘合剂层。液体粘合剂是热固性树脂或热塑性树脂。

8. 发明授权

US6121118A Chip separation device and method 有权
标题翻译：芯片分离装置及方法
公开(公告)号：US6121118A
公开(公告)日：2000-09-19
申请号：US369683
申请日：1999-08-05
申请人： Ho Tae Jin , In Pyo Hong , Byung Man Kim , Jeong Ho Bang
发明人： Ho Tae Jin , In Pyo Hong , Byung Man Kim , Jeong Ho Bang
IPC分类号： H01L21/301 , H01L21/00 , H01L21/78 , H01L21/46
CPC分类号： H01L21/67092 , H01L21/78
摘要： A method for separating semiconductor devices formed on a semiconductor wafer includes: inscribing the semiconductor wafer along scribe lines; mounting the inscribed semiconductor wafer on a stage including an elastic structure and vacuum suction holes that can be aligned to respective semiconductor chips; applying a vacuum through the vacuum suction holes to hold the semiconductor wafer on the elastic structure; and applying a mechanical force to the semiconductor wafer to break the wafer along the scribe lines and separate the semiconductor devices. A device for separating semiconductor devices formed on a wafer includes a stage including an elastic structure and vacuum suction holes that can be aligned with respective semiconductor chips of the semiconductor wafer and a press for applying mechanical force to the semiconductor wafer on the elastic structure. Since use of a wafer tape is avoided in cutting a semiconductor wafer, package cracking and delamination caused by wafer tape adhesive stuck to the back surface of a semiconductor chip are avoided.
摘要翻译：用于分离形成在半导体晶片上的半导体器件的方法包括：沿着划线刻录半导体晶片; 将内接的半导体晶片安装在包括弹性结构的台上，以及可以对准各自的半导体芯片的真空吸孔; 通过真空吸孔施加真空以将半导体晶片保持在弹性结构上; 以及向所述半导体晶片施加机械力以使所述晶片沿着划线断开并分离所述半导体器件。用于分离形成在晶片上的半导体器件的器件包括：包括弹性结构的台和可以与半导体晶片的各个半导体芯片对准的真空吸孔以及用于在弹性结构上向半导体晶片施加机械力的压力机。由于在切割半导体晶片时避免了晶圆带的使用，所以避免了由于贴在半导体芯片的背面上的晶片胶带引起的封装开裂和分层。

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