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1. 发明申请

US20170164516A1 Integrated Fluid Turbulator and Sealing System for Improved Thermal Management 审中-公开
公开(公告)号：US20170164516A1
公开(公告)日：2017-06-08
申请号：US14957198
申请日：2015-12-02
申请人： Caterpillar Inc.
发明人： Chris J. Scolton , Edward Choi , Jacob C. Wyss
IPC分类号： H05K7/20 , F28F13/12 , F28F11/00
CPC分类号： H01L23/473 , H01M10/6556 , H05K7/20254 , H05K7/20927
摘要： A cooling device for an electric component may include a manifold with a coolant section having a coolant inlet trough and a coolant outlet trough. The device may further include a fluid turbulator having a turbulator plate with turbulator fins extending upwardly therefrom, and turbulator inlet openings and outlet openings through the turbulator plate, and a turbulator carrier surrounding the turbulator plate. The fluid turbulator may be installed between the coolant section and the electric component so that a heat exchange reservoir is defined by bottom surface of the electric component, the turbulator plate top surface and the turbulator carrier. Coolant from a coolant source may flow into the coolant inlet trough, through the turbulator inlet opening into the heat exchange reservoir, and out of the heat exchange reservoir through the turbulator outlet opening into the coolant outlet trough to remove heat from the electric component.

2. 发明授权

US09693487B2 Heat management and removal assemblies for semiconductor devices 有权
公开(公告)号：US09693487B2
公开(公告)日：2017-06-27
申请号：US14616083
申请日：2015-02-06
申请人： Caterpillar Inc.
发明人： Edward Choi , Chris J. Scolton , Jacob Wyss
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20927 , H01L23/473 , H05K7/20254 , H05K7/20918
摘要： This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

3. 发明授权

US09638477B1 Sealless cooling device having manifold and turbulator 有权
公开(公告)号：US09638477B1
公开(公告)日：2017-05-02
申请号：US14881588
申请日：2015-10-13
申请人： Caterpillar Inc.
发明人： Edward Choi , Chris J. Scolton , John Walter Winkler
IPC分类号： H05K7/20 , F28F3/12 , F28F13/12 , B23P15/26 , H01L23/473
CPC分类号： F28F3/12 , B23P15/26 , F28F13/12 , H01L23/473 , H05K7/20009 , H05K7/20218 , H05K7/20927
摘要： A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

4. 发明申请

US20160234967A1 Heat Management and Removal Assemblies for Semiconductor Devices 有权
标题翻译：半导体器件热管理和拆卸组件
公开(公告)号：US20160234967A1
公开(公告)日：2016-08-11
申请号：US14616083
申请日：2015-02-06
申请人： Caterpillar Inc.
发明人： Edward Choi , Chris J. Scolton , Jacob Wyss
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H05K7/20254 , H05K7/20918
摘要： This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.
摘要翻译：该专利公开描述了在使用期间产生热的电子设备的热管理和去除组件。所公开的组件对于冷却绝缘栅双极晶体管（IGBT）特别有用。所公开的组件提供用于有效地将冷却剂输送到一个或多个电子设备的低电阻并行冷却电路。公开的平行冷却回路和组装设计降低了将冷却剂输送到一个或多个电子设备所需的泵功率。

5. 发明申请

US20160021784A1 Cooling Module for Electrical Components 审中-公开
标题翻译：电气元件冷却模块
公开(公告)号：US20160021784A1
公开(公告)日：2016-01-21
申请号：US14331752
申请日：2014-07-15
申请人： CATERPILLAR INC.
发明人： Edward Choi , Chris J. Scolton
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H05K7/20254
摘要： A cooling module for an electrical component is provided. The cooling module includes a housing defining an interior space for receiving a coolant. A flow directing member is arranged in the interior space of the housing. The flow directing member includes a plate that is divided into a plurality of discrete cells arranged parallel to each other with adjacent cells being separated from each other by a dividing wall. Each cell has an inlet opening in the plate through which coolant is directed onto a surface of the plate and an outlet opening in the plate through which coolant is directed off the surface of the plate. Each cell has a plurality of fins arranged on the surface of the plate in a herringbone pattern.
摘要翻译：提供了用于电气部件的冷却模块。冷却模块包括限定用于接收冷却剂的内部空间的壳体。流动引导构件布置在壳体的内部空间中。流动引导构件包括板，其被分成彼此平行布置的多个离散单元，相邻单元通过分隔壁彼此分离。每个电池在板中具有入口开口，冷却剂通过该入口导向板的表面和板中的出口开口，冷却剂通过该开口被引导离开板的表面。每个单元具有以人字形图案布置在板的表面上的多个翅片。

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