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1. 发明申请

US20150236214A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 有权
标题翻译：带有焊接基板的电子设备
公开(公告)号：US20150236214A1
公开(公告)日：2015-08-20
申请号：US14704334
申请日：2015-05-05
申请人： Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L33/44 , H01L33/62 , H01L33/48 , H01L33/32
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译：根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

3. 发明授权

US08466488B2 Electronic devices with yielding substrates 有权
标题翻译：具有屈服底物的电子设备
公开(公告)号：US08466488B2
公开(公告)日：2013-06-18
申请号：US13466288
申请日：2012-05-08
申请人： Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L29/72
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, an unpackaged inorganic LED die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the unpackaged inorganic LED die or non-coplanarity of the contacts thereof.
摘要翻译：根据某些实施例，未封装的无机LED管芯具有压敏激光粘合剂直接粘附到屈服基底上，尽管未封装的无机LED裸片的表面具有任何非平面性，也不与其接触的非共面性。

4. 发明申请

US20110136281A1 EPITAXIAL FORMATION SUPPORT STRUCTURES AND ASSOCIATED METHODS 有权
标题翻译：外来形成支持结构和相关方法
公开(公告)号：US20110136281A1
公开(公告)日：2011-06-09
申请号：US12961370
申请日：2010-12-06
申请人： Calvin Wade Sheen
发明人： Calvin Wade Sheen
IPC分类号： H01L21/324 , H01L33/30
CPC分类号： H01L33/32 , B28B1/16 , H01L21/02433 , H01L21/02458 , H01L21/0254 , H01L29/2003 , H01L33/007 , H01L33/0079 , H01L33/48
摘要： Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.
摘要翻译：本文公开了外延形成支撑结构和制造外延形成支撑结构和固态照明装置的相关方法。在几个实施例中，制造外延形成支撑衬底的方法可以包括形成具有第一侧，与第一侧相对的第二侧和基本类似于N型氮化镓的热膨胀系数的未固化支撑衬底。该方法还可以包括将未固化的支撑衬底的第一侧定位在第一参考板的第一表面上，并将第二参考板的第二表面定位在第二侧上以形成堆叠。第一和第二表面可以包括均匀的平坦部分。该方法还可以包括烧结堆叠以烧结未固化的支撑衬底。支撑基板的至少一侧可以形成基本均匀平坦的平坦表面。

5. 发明申请

US20140034960A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 有权
标题翻译：带有焊接基板的电子设备
公开(公告)号：US20140034960A1
公开(公告)日：2014-02-06
申请号：US14014998
申请日：2013-08-30
申请人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L33/08 , H01L33/32
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译：根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

8. 发明申请

US20120220064A1 EPITAXIAL FORMATION SUPPORT STRUCTURES AND ASSOCIATED METHODS 有权
标题翻译：外来形成支持结构和相关方法
公开(公告)号：US20120220064A1
公开(公告)日：2012-08-30
申请号：US13465867
申请日：2012-05-07
申请人： Calvin Wade Sheen
发明人： Calvin Wade Sheen
IPC分类号： H01L33/32 , H01L21/762
CPC分类号： H01L33/32 , B28B1/16 , H01L21/02433 , H01L21/02458 , H01L21/0254 , H01L29/2003 , H01L33/007 , H01L33/0079 , H01L33/48
摘要： Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.
摘要翻译：本文公开了外延形成支撑结构和制造外延形成支撑结构和固态照明装置的相关方法。在几个实施例中，制造外延形成支撑衬底的方法可以包括形成具有第一侧，与第一侧相对的第二侧和基本类似于N型氮化镓的热膨胀系数的未固化支撑衬底。该方法还可以包括将未固化的支撑衬底的第一侧定位在第一参考板的第一表面上，并将第二参考板的第二表面定位在第二侧上以形成堆叠。第一和第二表面可以包括均匀的平坦部分。该方法还可以包括烧结堆叠以烧结未固化的支撑衬底。支撑基板的至少一侧可以形成基本均匀平坦的平坦表面。

9. 发明申请

US20110151588A1 METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES 审中-公开
标题翻译：使用磁性传输印刷技术传输半导体数字的方法和磁转印
公开(公告)号：US20110151588A1
公开(公告)日：2011-06-23
申请号：US12966997
申请日：2010-12-13
申请人： Ian Ashdown , Ingo Speier , Calvin Wade Sheen , Philippe Michael Schick
发明人： Ian Ashdown , Ingo Speier , Calvin Wade Sheen , Philippe Michael Schick
IPC分类号： H01L21/50
CPC分类号： H01L24/95 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2221/6835 , H01L2221/68368 , H01L2221/68381 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2224/95001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01058 , H01L2924/0106 , H01L2924/01064 , H01L2924/01066 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01088 , H01L2924/01094 , H01L2924/01105 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/00 , H01L2924/01027 , H01L2924/01028 , H01L2924/01026
摘要： Releasable semiconductor dice are deposited with a magnetic layer and held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate.
摘要翻译：可释放的半导体晶片被沉积有磁性层并通过磁力保持在磁性或电磁传递印模上，用于将芯片从主机衬底直接或间接地转移到目标衬底。

10. 发明申请

US20110136324A1 SEMICONDUCTOR DICE TRANSFER-ENABLING APPARATUS AND METHOD FOR MANUFACTURING TRANSFER-ENABLING APPARATUS 审中-公开
标题翻译：半导体切片转印装置和制造转印装置的方法
公开(公告)号：US20110136324A1
公开(公告)日：2011-06-09
申请号：US12963609
申请日：2010-12-08
申请人： Ian Ashdown , Ingo Speier , Calvin Wade Sheen
发明人： Ian Ashdown , Ingo Speier , Calvin Wade Sheen
IPC分类号： H01L21/78 , B26F3/00
CPC分类号： H01L33/0079 , H01L25/0753 , H01L33/0095 , H01L2224/83 , H01L2924/0002 , Y10T225/30 , H01L2924/00
摘要： A transfer-enabling apparatus, produced by a method of manufacturing, includes a substrate patterned with islands separated by trenches and an epitaxial layer, grown at least on the islands, providing semiconductor dice in such a configuration partially released from said substrate and suspended over the substrate, and interconnected, by anchors of epitaxial or other material that are attached to the substrate. The anchors are of width less than or equal to than the semiconductor dice and define fracture zones at connections of the anchors with the semiconductor dice.
摘要翻译：通过制造方法制造的转印使能装置包括由沟槽分隔的岛和至少在岛上生长的外延层图案化的衬底，提供半导体晶片，其部分从所述衬底释放并悬浮在该衬底上衬底和互连的，通过连接到衬底的外延或其它材料的锚。锚固件的宽度小于或等于半导体晶片，并且在锚定件与半导体晶片的连接处限定断裂区域。

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