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1. 发明申请

US20190331433A1 THERMAL CONDUCTING STRUCTURE 审中-公开
公开(公告)号：US20190331433A1
公开(公告)日：2019-10-31
申请号：US16444771
申请日：2019-06-18
申请人： COOLER MASTER CO.,LTD.
发明人： Chien-Hung SUN , Te-Hsuan CHIN , Lei-Lei LIU
IPC分类号： F28D15/04 , F28D15/02 , F28F9/007 , F28F9/00
摘要： A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

2. 发明申请

US20180372419A1 HEAT TRANSFER DEVICE 审中-公开
公开(公告)号：US20180372419A1
公开(公告)日：2018-12-27
申请号：US16119707
申请日：2018-08-31
申请人： COOLER MASTER CO., LTD.
发明人： Lei-Lei LIU , Xiao-Min ZHANG , Jen-Chih CHENG
IPC分类号： F28D15/04
摘要： A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.

3. 发明申请

US20160330868A1 COOLING MODULE, WATER-COOLED COOLING MODULE AND COOLING SYSTEM 审中-公开
标题翻译：冷却模块，水冷却冷却模块和冷却系统
公开(公告)号：US20160330868A1
公开(公告)日：2016-11-10
申请号：US14735559
申请日：2015-06-10
申请人： COOLER MASTER CO., LTD.
发明人： CHIEN-HUNG SUN , Lei-Lei LIU
IPC分类号： H05K7/20
摘要： A cooling module used in conjunction with a heating element includes a vapor chamber and a plurality of cooling fins. The vapor chamber is in contact with one side of the heating element. The vapor chamber is disposed with a direct conduction area and a vacuum block disposed on two sides of the direct conduction area respectively. Each vacuum block forms a chamber. The cooling fins protrude from and are vertically disposed on the direct conduction area and each vacuum block, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.
摘要翻译：与加热元件结合使用的冷却模块包括蒸气室和多个散热片。蒸气室与加热元件的一侧接触。蒸气室设置有分别设置在直接导电区域两侧的直接导电区域和真空块。每个真空块形成一个室。冷却片分别从直接导电区域和每个真空块垂直设置并竖直地设置。由此，实现了快速垂直传热至翅片并快速水平传递至远端散热片的效果。

4. 发明申请

US20180356162A1 MANUFACTURING METHOD OF THREE-DIMENSIONAL HEAT CONDUCTING STRUCTURE 审中-公开
公开(公告)号：US20180356162A1
公开(公告)日：2018-12-13
申请号：US16107877
申请日：2018-08-21
申请人： COOLER MASTER CO.,LTD.
发明人： Chien-Hung SUN , Lei-Lei LIU
IPC分类号： F28D15/02 , F28D15/04 , B23K37/06 , B23K1/18 , H01L23/427
摘要： A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

5. 发明申请

US20210148646A1 THERMAL CONDUCTING STRUCTURE 有权
公开(公告)号：US20210148646A1
公开(公告)日：2021-05-20
申请号：US17158975
申请日：2021-01-26
申请人： COOLER MASTER CO., LTD.
发明人： Chien-Hung SUN , Te-Hsuan CHIN , Lei-Lei LIU
IPC分类号： F28D15/04 , F28D15/02 , F28F9/00 , F28F9/007
摘要： A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

6. 发明申请

US20190049190A1 THREE-DIMENSIONAL HEAT TRANSFER DEVICE 审中-公开
公开(公告)号：US20190049190A1
公开(公告)日：2019-02-14
申请号：US16159398
申请日：2018-10-12
申请人： COOLER MASTER CO., LTD.
发明人： Lei-Lei LIU , Xiao-Min ZHANG
IPC分类号： F28D15/04 , F28D15/02 , F28F1/32
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F1/32 , F28F1/325
摘要： A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.

7. 发明申请

US20170292793A1 THERMAL CONDUCTING STRUCTURE 审中-公开
公开(公告)号：US20170292793A1
公开(公告)日：2017-10-12
申请号：US15352804
申请日：2016-11-16
申请人： COOLER MASTER CO., LTD.
发明人： Chien-Hung SUN , Te-Hsuan CHIN , Lei-Lei LIU
IPC分类号： F28D15/04 , F28F9/00 , F28F9/007 , F28D15/02
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0275 , F28D2021/0028 , F28F9/001 , F28F9/0075
摘要： A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

8. 发明申请

US20170227298A1 THREE-DIMENSIONAL HEAT TRANSFER DEVICE 审中-公开
公开(公告)号：US20170227298A1
公开(公告)日：2017-08-10
申请号：US15257805
申请日：2016-09-06
申请人： COOLER MASTER CO., LTD.
发明人： Chien-Hung SUN , Lei-Lei LIU , Xiaomin ZHANG
IPC分类号： F28D15/04
CPC分类号： F28D15/04 , F28D15/0266 , F28D15/046 , F28F1/32
摘要： A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.

9. 发明申请

US20160348985A1 THREE-DIMENSIONAL HEAT CONDUCTING STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：三维热传导结构及其制造方法
公开(公告)号：US20160348985A1
公开(公告)日：2016-12-01
申请号：US14794028
申请日：2015-07-08
申请人： Cooler Master Co., Ltd.
发明人： Chien-Hung SUN , Lei-Lei LIU
IPC分类号： F28D15/02 , F28F21/08 , B23K1/00
CPC分类号： F28D15/0275 , B23K1/18 , B23K37/06 , F28D15/0266 , F28D15/04 , F28F2275/06 , H01L23/427
摘要： In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.
摘要翻译：在三维导热结构及其制造方法中，制造方法包括以下步骤：（a）提供具有至少一个插入孔的蒸气室; （b）提供具有开口端的热管，并将开口端插入插入孔中; （c）提供支撑环，并将支撑环包围在热管和蒸气室的关节位置上; 和（d）提供焊接装置，并且在支撑环和热管之间施加焊接装置。

10. 发明申请

US20160003555A1 HEAT DISSIPATER HAVING CAPILLARY COMPONENT 有权
标题翻译：具有毛细分量的散热器
公开(公告)号：US20160003555A1
公开(公告)日：2016-01-07
申请号：US14676817
申请日：2015-04-02
申请人： COOLER MASTER CO., LTD.
发明人： CHIEN-HUNG SUN , Lei-Lei LIU , Xiao-Min ZHANG
IPC分类号： F28D15/04
CPC分类号： F28D15/046 , F28D15/0266
摘要： A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.
摘要翻译：具有毛细管部件的散热器包括：散热器，其包括具有至少一个通孔的壳体部件和设置在壳体部件中的第一毛细结构; 容纳在所述通孔中并且包括管构件和设置在所述管构件中的第二毛细结构的热管。管构件包括形成在壳构件中的开口; 以及毛细管部件，容纳在所述壳体部件中，并且包括以突出部分延伸并且布置成与所述第一毛细管结构相邻的块体部件。突出部分容纳在开口中并且布置成与第二毛细结构相邻。因此，热管和散热器可以组合起来操作，并且内部工作流体可以在热管和散热器之间流动。

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