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1. 发明申请

US20160221141A1 GRINDING DEVICE 审中-公开
标题翻译：研磨装置
公开(公告)号：US20160221141A1
公开(公告)日：2016-08-04
申请号：US14791857
申请日：2015-07-06
申请人： CHENG-YING TECHNOLOGY LTD.
发明人： Yao-Hsiang WANG , Tien-Wang WANG
IPC分类号： B24B5/22
CPC分类号： B24B5/22
摘要： A grinding device for grinding a cylinder that has a rotating shaft includes an immovable component, a movable component, and a grinding component. The immovable component has a positioning unit. The cylinder has the rotating shaft positioned by the positioning unit. The movable component has a carrying portion and is such installed on the immovable component that the movable component can move axially along the rotating shaft. The carrying portion positionally corresponds to the cylinder. The grinding component is located on the carrying portion and positionally corresponds to a surface of the rotating shaft. The grinding device thereby is able to grind the rotating shaft of the cylinder evenly with reduced labor costs.
摘要翻译：用于研磨具有旋转轴的圆筒的研磨装置包括不可移动部件，可移动部件和研磨部件。不动部件具有定位单元。气缸具有由定位单元定位的旋转轴。可移动部件具有承载部分，并且被安装在不可移动的部件上，使可移动部件能够沿着旋转轴轴向移动。承载部分位于气缸上。研磨部件位于承载部分上并且位置对应于旋转轴的表面。因此，研磨装置能够以较低的人工成本平均地研磨气缸的旋转轴。

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