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1. 发明授权

US10716211B2 Printed circuit board, printed wiring board, electronic device, and camera 有权
公开(公告)号：US10716211B2
公开(公告)日：2020-07-14
申请号：US16264401
申请日：2019-01-31
申请人： CANON KABUSHIKI KAISHA
发明人： Takashi Numagi , Shoji Matsumoto , Hiroyuki Yamaguchi , Youhei Tazawa
IPC分类号： H05K1/11 , H05K1/18 , H04N5/225 , H04N5/232
摘要： A printed wiring board includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings each include a first via conductor disposed outside a first region, a second region, and a third region in a plan view, and a first conductor pattern extending from the first via conductor to the first region. The plurality of second wirings each include a second via conductor disposed outside the first region, the second region, and the third region, and a second conductor pattern extending from the second via conductor to the first region. A fourth region overlaps with a fifth region in the plan view, the fourth region being a region in which a plurality of first conductor patterns are disposed, the fifth region being a region in which a plurality of second conductor patterns are disposed.

2. 发明授权

US11689801B2 Electric circuit and electronic apparatus 有权
公开(公告)号：US11689801B2
公开(公告)日：2023-06-27
申请号：US17703440
申请日：2022-03-24
申请人： CANON KABUSHIKI KAISHA
发明人： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
IPC分类号： H02M1/44 , H04N23/65
CPC分类号： H04N23/65 , H02M1/44
摘要： An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.

3. 发明授权

US10306761B2 Printed wiring board, printed circuit board, and electronic apparatus 有权
公开(公告)号：US10306761B2
公开(公告)日：2019-05-28
申请号：US15825563
申请日：2017-11-29
申请人： CANON KABUSHIKI KAISHA
发明人： Takashi Numagi , Youhei Tazawa , Shoji Matsumoto
IPC分类号： H05K1/18 , H05K1/11 , H01L23/48 , H05K1/02
摘要： Provided is a printed wiring board including: a plurality of inner layers including a ground layer and a power supply layer; and a plurality of ground vias and a plurality of power supply vias each provided to penetrate at least the ground layer and the power supply layer in a thickness direction of the printed wiring board, a ground potential being applied to the plurality of ground vias at the ground layer, and a power supply potential being applied to the plurality of power supply vias at the power supply layer. In a top view from a direction perpendicular to the printed wiring board, a distance between vias to which the same potential is applied is shorter than a distance between vias to which different potentials are applied.

4. 发明授权

US11480910B2 Printed circuit board, printed wiring board, electronic device, and image forming apparatus 有权
公开(公告)号：US11480910B2
公开(公告)日：2022-10-25
申请号：US16893506
申请日：2020-06-05
申请人： CANON KABUSHIKI KAISHA
发明人： Takashi Numagi , Kunihiko Uchida
IPC分类号： H05K5/02 , H05K1/11 , G03G15/00
摘要： A printed circuit board includes a printed wiring board, and a first element and a second element mounted on the printed wiring board. The printed wiring board includes a plurality of first signal lines and a plurality of second signal lines. The plurality of first signal lines each include a first main line, a first branch line, and a second branch line. The plurality of second signal lines each include a second main line, a third branch line, and a fourth branch line. The first branch line includes a first conductor pattern disposed in a first conductor layer. The second branch line includes a second conductor pattern disposed in the first conductor layer. The third branch line includes a third conductor pattern disposed in a second conductor layer. The fourth branch line includes a fourth conductor pattern disposed in the second conductor layer.

5. 发明申请

US20220321781A1 ELECTRIC CIRCUIT AND ELECTRONIC APPARATUS 有权
公开(公告)号：US20220321781A1
公开(公告)日：2022-10-06
申请号：US17703440
申请日：2022-03-24
申请人： CANON KABUSHIKI KAISHA
发明人： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
IPC分类号： H04N5/232 , H02M1/44
摘要： An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.

6. 发明申请

US20220304144A1 ELECTRONIC MODULE AND ELECTRONIC APPARATUS 有权
公开(公告)号：US20220304144A1
公开(公告)日：2022-09-22
申请号：US17694070
申请日：2022-03-14
申请人： CANON KABUSHIKI KAISHA
发明人： Takuya Kondo , Takashi Numagi , Nobuaki Yamashita
IPC分类号： H05K1/02 , H01L25/16
摘要： An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.

7. 发明授权

US11792917B2 Electronic module and electronic apparatus 有权
公开(公告)号：US11792917B2
公开(公告)日：2023-10-17
申请号：US17694070
申请日：2022-03-14
申请人： CANON KABUSHIKI KAISHA
发明人： Takuya Kondo , Takashi Numagi , Nobuaki Yamashita
IPC分类号： H05K1/02 , H01L25/16 , H05K1/14
CPC分类号： H05K1/0231 , H01L25/162 , H05K1/0225 , H05K1/148 , H05K2201/09227 , H05K2201/1003 , H05K2201/1006 , H05K2201/10015 , H05K2201/10378 , H05K2201/10545
摘要： An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.

8. 发明申请

US20190246498A1 PRINTED CIRCUIT BOARD, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND CAMERA 审中-公开
公开(公告)号：US20190246498A1
公开(公告)日：2019-08-08
申请号：US16264401
申请日：2019-01-31
申请人： CANON KABUSHIKI KAISHA
发明人： Takashi Numagi , Shoji Matsumoto , Hiroyuki Yamaguchi , Youhei Tazawa
IPC分类号： H05K1/11 , H05K1/18 , H04N5/225
摘要： A printed wiring board includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings each include a first via conductor disposed outside a first region, a second region, and a third region in a plan view, and a first conductor pattern extending from the first via conductor to the first region. The plurality of second wirings each include a second via conductor disposed outside the first region, the second region, and the third region, and a second conductor pattern extending from the second via conductor to the first region. A fourth region overlaps with a fifth region in the plan view, the fourth region being a region in which a plurality of first conductor patterns are disposed, the fifth region being a region in which a plurality of second conductor patterns are disposed.

9. 发明授权

US09894751B2 Printed circuit board 有权
公开(公告)号：US09894751B2
公开(公告)日：2018-02-13
申请号：US14944540
申请日：2015-11-18
申请人： CANON KABUSHIKI KAISHA
发明人： Yusuke Murai , Shoji Matsumoto , Takashi Numagi , Hiroyuki Yamaguchi , Nobuaki Yamashita
IPC分类号： H05K1/02 , H05K1/11
CPC分类号： H05K1/0225 , H05K1/0231 , H05K1/0234 , H05K1/115
摘要： First and second semiconductor devices and first and second bypass circuits are mounted on a printed wiring board. The first bypass circuit and the second bypass circuit are provided closer to the first semiconductor device and to the second semiconductor device, respectively. The first bypass circuit has one end connected to a power plane through a first power supply via and the other end connected to a ground plane through a first ground via. The second bypass circuit has one end connected to the power plane through a second power supply via and the other end connected to the ground plane through a second ground via. The ground plane has a slit between the connecting portions of the first and second ground vias to increase the impedance between the connecting portions of the first and the second ground vias. Thus, jitters caused by power supply noise can be reduced.

10. 发明申请

US20160157336A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20160157336A1
公开(公告)日：2016-06-02
申请号：US14944540
申请日：2015-11-18
申请人： CANON KABUSHIKI KAISHA
发明人： Yusuke Murai , Shoji Matsumoto , Takashi Numagi , Hiroyuki Yamaguchi , Nobuaki Yamashita
IPC分类号： H05K1/02 , H05K1/11 , H05K1/18
CPC分类号： H05K1/0225 , H05K1/0231 , H05K1/0234 , H05K1/115
摘要： First and second semiconductor devices and first and second bypass circuits are mounted on a printed wiring board. The first bypass circuit and the second bypass circuit are provided closer to the first semiconductor device and to the second semiconductor device, respectively. The first bypass circuit has one end connected to a power plane through a first power supply via and the other end connected to a ground plane through a first ground via. The second bypass circuit has one end connected to the power plane through a second power supply via and the other end connected to the ground plane through a second ground via. The ground plane has a slit between the connecting portions of the first and second ground vias to increase the impedance between the connecting portions of the first and the second ground vias. Thus, jitters caused by power supply noise can be reduced.
摘要翻译：第一和第二半导体器件以及第一和第二旁路电路安装在印刷线路板上。第一旁路电路和第二旁路电路分别靠近第一半导体器件和第二半导体器件设置。第一旁路电路的一端通过第一电源通路连接到电源平面，另一端通过第一接地通孔连接到接地平面。第二旁路电路的一端通过第二电源通路连接到电源平面，另一端通过第二接地通孔连接到接地平面。接地平面在第一和第二接地通孔的连接部分之间具有狭缝，以增加第一和第二接地通路的连接部分之间的阻抗。因此，可以减少由电源噪声引起的抖动。

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