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    • 2. 发明申请
    • PROCESSING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD
    • 液体喷射头基板和制造方法的处理方法
    • US20160176193A1
    • 2016-06-23
    • US14963493
    • 2015-12-09
    • CANON KABUSHIKI KAISHA
    • Atsushi HiramotoAtsunori TerasakiRyoji Kanri
    • B41J2/16H01L21/02
    • H01L21/0234B41J2/14016B41J2/14145B41J2/1603B41J2/1628B41J2/1631H01L21/0212
    • There are provided a processing method of a substrate in which in forming a trench on the substrate by etching, a side wall surrounding the trench is surely protected, and a manufacturing method of a liquid ejection head. The methods include: repeating sequentially a plurality of cycles of a trench forming step of forming the trench on a printing element substrate, a first protection layer forming step of forming a passivation layer, and a first protection layer removing step of removing a portion at which the trench is excavated in the passivation layer. A second protection layer forming step and a second protection layer removing step are performed between the trench forming step through the first protection layer removing step repeated in a plurality of cycles and the trench forming step through the first protection layer removing step repeated next.
    • 提供了一种衬底的处理方法,其中通过蚀刻在衬底上形成沟槽,确保保护围绕沟槽的侧壁,以及液体喷射头的制造方法。 所述方法包括:在打印元件基板上顺序地重复形成沟槽的沟槽形成步骤的多个循环,形成钝化层的第一保护层形成步骤,以及去除部分的第一保护层去除步骤, 沟槽在钝化层中被挖掘出来。 在通过多个周期重复的第一保护层去除步骤的沟槽形成步骤和接下来重复的第一保护层去除步骤的沟槽形成步骤之间执行第二保护层形成步骤和第二保护层去除步骤。