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1. 发明申请

US20100229392A1 PROCESS FOR MAKING A MICRO-FLUID EJECTION HEAD STRUCTURE 有权
标题翻译：制造微流体喷射头结构的方法
公开(公告)号：US20100229392A1
公开(公告)日：2010-09-16
申请号：US12786803
申请日：2010-05-25
申请人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
发明人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
IPC分类号： B23P17/04
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1645 , Y10T29/49401
摘要： A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed.
摘要翻译：通过该方法制造微流体喷射头结构和微流体喷射头的方法。该方法包括将氧化钽层施加到设置在基板的器件表面上的流体喷射致动器的表面，使得钽氧化物层是包括电阻层的多个层的最顶层，以及选自钝化层，空穴层以及钝化层和空化层的组合。氧化钽层具有满足方程式t =（¼* W / n）的厚度（t），其中W是来自辐射源的辐射的波长，n是氧化钽层的折射率。光致成像层也可应用于基板。可光成像层用辐射源成像，然后显影。

2. 发明申请

US20090091604A1 PROCESS FOR MAKING A MICRO-FLUID EJECTION HEAD STRUCTURE 有权
标题翻译：制造微流体喷射头结构的方法
公开(公告)号：US20090091604A1
公开(公告)日：2009-04-09
申请号：US11866585
申请日：2007-10-03
申请人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
发明人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
IPC分类号： B41J2/05 , B23P17/00
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1645 , Y10T29/49401
摘要： A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed.
摘要翻译：通过该方法制造微流体喷射头结构和微流体喷射头的方法。该方法包括将氧化钽层施加到设置在基板的器件表面上的流体喷射致动器的表面，使得钽氧化物层是包括电阻层的多个层的最顶层，以及选自钝化层，空穴层以及钝化层和空化层的组合。氧化钽层具有满足方程式t =（¼* W / n）的厚度（t），其中W是来自辐射源的辐射的波长，n是氧化钽层的折射率。光致成像层也可应用于基板。可光成像层用辐射源成像，然后显影。

3. 发明授权

US08158336B2 Process for making a micro-fluid ejection head structure 有权
标题翻译：制造微流体喷射头结构的方法
公开(公告)号：US08158336B2
公开(公告)日：2012-04-17
申请号：US12786803
申请日：2010-05-25
申请人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
发明人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
IPC分类号： B41J2/16
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1645 , Y10T29/49401
摘要： A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed.
摘要翻译：通过该方法制造微流体喷射头结构和微流体喷射头的方法。该方法包括将氧化钽层施加到设置在基板的器件表面上的流体喷射致动器的表面，使得钽氧化物层是包括电阻层的多个层的最顶层，以及选自钝化层，空穴层以及钝化层和空化层的组合。氧化钽层具有满足方程式t =（¼* W / n）的厚度（t），其中W是来自辐射源的辐射的波长，n是氧化钽层的折射率。光致成像层也可应用于基板。可光成像层用辐射源成像，然后显影。

4. 发明授权

US07784917B2 Process for making a micro-fluid ejection head structure 有权
标题翻译：制造微流体喷射头结构的方法
公开(公告)号：US07784917B2
公开(公告)日：2010-08-31
申请号：US11866585
申请日：2007-10-03
申请人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
发明人： Byron Vencent Bell , Christopher Allen Craft , Bryan Thomas Fannin , Burton Lee Joyner, II , Sean Terrence Weaver
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1645 , Y10T29/49401
摘要： A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed.
摘要翻译：通过该方法制造微流体喷射头结构和微流体喷射头的方法。该方法包括将氧化钽层施加到设置在基板的器件表面上的流体喷射致动器的表面，使得钽氧化物层是包括电阻层的多个层的最顶层，以及选自钝化层，空穴层以及钝化层和空化层的组合。氧化钽层具有满足方程式t =（¼* W / n）的厚度（t），其中W是来自辐射源的辐射的波长，n是氧化钽层的折射率。光致成像层也可应用于基板。可光成像层用辐射源成像，然后显影。

5. 发明授权

US08109608B2 Micro-fluid ejection head and stress relieved orifice plate therefor 有权
标题翻译：微流体喷头和应力释放孔板
公开(公告)号：US08109608B2
公开(公告)日：2012-02-07
申请号：US11867205
申请日：2007-10-04
申请人： Bryan Thomas Fannin , Vinod Kumar Gopalakrishnan , Christopher John Money , Sean Terrence Weaver
发明人： Bryan Thomas Fannin , Vinod Kumar Gopalakrishnan , Christopher John Money , Sean Terrence Weaver
IPC分类号： B41J2/135 , B41J2/15 , B28B1/48
CPC分类号： B41J2/1404 , B41J2/1603 , B41J2/1631 , B41J2/1645
摘要： A micro-fluid ejection head and methods for improving the fabrication and operation of the micro-fluid ejection head. The ejection head includes a photoimaged thick film layer attached to a substrate containing fluid ejection actuators. An orifice plate is laminated to the thick film layer. The orifice plate has a plurality of concentric orifices therein and is derived from a first photoresist material that is heated to a temperature sufficient to relieve film stresses in the photoresist material prior to exposing and developing the orifices in the orifice plate.
摘要翻译：微流体喷射头和用于改进微流体喷射头的制造和操作的方法。喷射头包括附着在含有流体喷射致动器的基板上的光电薄膜层。孔板被层压到厚膜层上。孔板在其中具有多个同心孔，并且从第一光致抗蚀剂材料得到，该第一光致抗蚀剂材料被加热到足以在曝光和显影孔板之间的孔隙之前减轻光致抗蚀剂材料中的膜应力的温度。

6. 发明申请

US20090091600A1 MICRO-FLUID EJECTION HEAD AND STRESS RELIEVED ORIFICE PLATE THEREFOR 有权
标题翻译：微流体喷射头和应力消除的其他板
公开(公告)号：US20090091600A1
公开(公告)日：2009-04-09
申请号：US11867205
申请日：2007-10-04
申请人： Bryan Thomas Fannin , Vinod Kumar Gopalakrishnan , Christopher John Money , Sean Terrence Weaver
发明人： Bryan Thomas Fannin , Vinod Kumar Gopalakrishnan , Christopher John Money , Sean Terrence Weaver
IPC分类号： B41J2/135 , H01L21/00
CPC分类号： B41J2/1404 , B41J2/1603 , B41J2/1631 , B41J2/1645
摘要： A micro-fluid ejection head and methods for improving the fabrication and operation of the micro-fluid ejection head. The ejection head includes a photoimaged thick film layer attached to a substrate containing fluid ejection actuators. An orifice plate is laminated to the thick film layer. The orifice plate has a plurality of concentric orifices therein and is derived from a first photoresist material that is heated to a temperature sufficient to relieve film stresses in the photoresist material prior to exposing and developing the orifices in the orifice plate.
摘要翻译：微流体喷射头和用于改进微流体喷射头的制造和操作的方法。喷射头包括附着在含有流体喷射致动器的基板上的光电薄膜层。孔板被层压到厚膜层上。孔板在其中具有多个同心孔，并且从第一光致抗蚀剂材料得到，该第一光致抗蚀剂材料被加热到足以在曝光和显影孔板之间的孔隙之前减轻光致抗蚀剂材料中的膜应力的温度。

7. 发明申请

US20100210759A1 Adhesive Compositions, Micro-fluid Ejection Devices and Methods for Attaching Mirco-Fluid Ejection Heads 有权
标题翻译：粘合剂组合物，微流体喷射装置和附着微流体喷射头的方法
公开(公告)号：US20100210759A1
公开(公告)日：2010-08-19
申请号：US12767857
申请日：2010-04-27
申请人： David Christopher Graham , Gary Anthony Holt, JR. , Jonathan Harold Laurer , Johnny Dale Massie, II , Melissa Marie Waldeck , Sean Terrence Weaver , Rich Wells
发明人： David Christopher Graham , Gary Anthony Holt, JR. , Jonathan Harold Laurer , Johnny Dale Massie, II , Melissa Marie Waldeck , Sean Terrence Weaver , Rich Wells
IPC分类号： C09J163/00
CPC分类号： B41J2/1623 , B41J2/14024 , B41J2/1408 , B41J2/1601
摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
摘要翻译：粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

8. 发明授权

US08163819B2 Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads 有权
标题翻译：粘合剂组合物，微流体喷射装置和用于附着微流体喷射头的方法
公开(公告)号：US08163819B2
公开(公告)日：2012-04-24
申请号：US12767857
申请日：2010-04-27
申请人： David Christopher Graham , Gary Anthony Holt, Jr. , Jonathan Harold Laurer , Johnny Dale Massie, II , Melissa Marie Waldeck , Sean Terrence Weaver , Rich Wells
发明人： David Christopher Graham , Gary Anthony Holt, Jr. , Jonathan Harold Laurer , Johnny Dale Massie, II , Melissa Marie Waldeck , Sean Terrence Weaver , Rich Wells
IPC分类号： C08L63/00 , C09J163/00
CPC分类号： B41J2/1623 , B41J2/14024 , B41J2/1408 , B41J2/1601
摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
摘要翻译：粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

9. 发明申请

US20080079776A1 Micro-Fluid Ejection Heads with Chips in Pockets 有权
标题翻译：微型流体喷射头与芯片中的芯片
公开(公告)号：US20080079776A1
公开(公告)日：2008-04-03
申请号：US11536470
申请日：2006-09-28
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

10. 发明授权

US06834937B2 Printhead corrosion protection 有权
标题翻译：打印头防腐蚀
公开(公告)号：US06834937B2
公开(公告)日：2004-12-28
申请号：US10218063
申请日：2002-08-13
申请人： Eric Louis Killmeier , Paul Timothy Spivey , Sean Terrence Weaver , Gary Raymond Williams
发明人： Eric Louis Killmeier , Paul Timothy Spivey , Sean Terrence Weaver , Gary Raymond Williams
IPC分类号： B41J214
CPC分类号： B41J2/1753 , B41J2/14072 , H05K3/28 , H05K3/361
摘要： A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.
摘要翻译：一种用于将电迹线封装在柔性电路或TAB电路上的方法，以及柔性电路或TAB电路与打印头基板之间的电连接以抑制其油墨腐蚀的方法。该方法包括将第一粘合剂施加到柔性电路或TAB电路的第一表面。将第二粘合剂施加到柔性电路或TAB电路的第一表面，由此第一和第二粘合剂有效地涂覆迹线和连接的暴露部分。第一和第二粘合剂是可热固化的环氧组合物，其彼此可混溶，并且第一粘合剂具有低于第二粘合剂的第二粘度秒触变指数的第一粘度和第一触变指数。在施加粘合剂之后，第一和第二粘合剂被固化。

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