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1. 发明授权

US08201324B2 Method of manufacturing electronic component embedded circuit board 有权
标题翻译：电子元件嵌入式电路板的制造方法
公开(公告)号：US08201324B2
公开(公告)日：2012-06-19
申请号：US12359416
申请日：2009-01-26
申请人： Byoung-Chan Kim , Young-Hwan Shin , Jong-Jin Lee
发明人： Byoung-Chan Kim , Young-Hwan Shin , Jong-Jin Lee
IPC分类号： H05K3/36
CPC分类号： H01L24/91 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/24227 , H01L2224/32145 , H01L2224/73267 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/18162 , H05K1/187 , H05K3/205 , H05K3/4602 , H05K2201/10515 , H05K2201/10674 , H05K2203/0376 , H05K2203/1469 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165 , H01L2224/82 , H01L2224/0401
摘要： An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
摘要翻译：公开了电子部件嵌入式印刷电路板及其制造方法。该方法包括：提供具有形成在其一个表面上的第一电路图案的第一载体; 提供具有形成在其一个表面上的第二电路图案的第二载体; 将电子部件倒装成第一电路图案; 将绝缘体的一侧堆叠在第一载体的一侧以覆盖电子部件; 在绝缘体的另一侧上压制在其一个表面上形成有第二电路图案的第二载体; 以及去除所述第一载体和所述第二载体。该方法可以通过使用倒装芯片接合方法嵌入电子部件来提高电气部件的构造程度，并且可以通过简化制造工艺来提高成品率。

2. 发明申请

US20120134125A1 METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD 审中-公开
标题翻译：制造电子元件嵌入式电路板的方法
公开(公告)号：US20120134125A1
公开(公告)日：2012-05-31
申请号：US13364104
申请日：2012-02-01
申请人： Byoung-Chan Kim , Young-Hwan Shin , Jong-Jin Lee
发明人： Byoung-Chan Kim , Young-Hwan Shin , Jong-Jin Lee
IPC分类号： H05K1/18
CPC分类号： H01L24/91 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/24227 , H01L2224/32145 , H01L2224/73267 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/18162 , H05K1/187 , H05K3/205 , H05K3/4602 , H05K2201/10515 , H05K2201/10674 , H05K2203/0376 , H05K2203/1469 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165 , H01L2224/82 , H01L2224/0401
摘要： An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
摘要翻译：公开了电子部件嵌入式印刷电路板及其制造方法。该方法包括：提供具有形成在其一个表面上的第一电路图案的第一载体; 提供具有形成在其一个表面上的第二电路图案的第二载体; 将电子部件倒装成第一电路图案; 将绝缘体的一侧堆叠在第一载体的一侧以覆盖电子部件; 在绝缘体的另一侧上压制在其一个表面上形成有第二电路图案的第二载体; 以及去除所述第一载体和所述第二载体。该方法可以通过使用倒装芯片接合方法嵌入电子部件来提高电气部件的构造程度，并且可以通过简化制造工艺来提高成品率。

3. 发明申请

US20050051895A1 BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same 审中-公开
标题翻译： BGA封装具有形成有边缘焊接金属图案的半导体芯片及其制造方法
公开(公告)号：US20050051895A1
公开(公告)日：2005-03-10
申请号：US10720484
申请日：2003-11-25
申请人： Byoung-Chan Kim , Young-Hwan Shin , Kyoung-Ro Yoon
发明人： Byoung-Chan Kim , Young-Hwan Shin , Kyoung-Ro Yoon
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/498 , H01L23/525 , H01L25/065 , H01L25/07 , H01L25/18 , H01L23/48 , H01L21/44
CPC分类号： H01L23/525 , H01L23/3128 , H01L23/49833 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05599 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/484 , H01L2224/4911 , H01L2224/85399 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00012
摘要： The present invention relates to a BGA package having center-bonding type semiconductor chips with edge-bonding metal patterns formed thereon wherein the edge-bonding metal patterns are formed on the semiconductor chips in a wafer level, and wire bonding is carried out in the shape of edge bonding so that a plurality of semiconductor chips are stacked, whereby high-density memory performance is obtained, and a method of manufacturing the same.
摘要翻译：本发明涉及一种具有形成在其上形成有边缘焊接金属图案的中心接合型半导体芯片的BGA封装，其中在半导体芯片上以晶片级形成边缘焊接金属图案，并且引线接合以形状的边缘接合，从而堆叠多个半导体芯片，从而获得高密度存储器性能及其制造方法。

4. 发明申请

US20070217520A1 Apparatuses and methods for post-processing video images 审中-公开
标题翻译：视频图像后处理的设备和方法
公开(公告)号：US20070217520A1
公开(公告)日：2007-09-20
申请号：US11717692
申请日：2007-03-14
申请人： Byoung-Chan Kim , Soon-Jae Cho
发明人： Byoung-Chan Kim , Soon-Jae Cho
IPC分类号： H04B1/66
CPC分类号： H04N19/86 , H04N19/117 , H04N19/159 , H04N19/61
摘要： An apparatus for post-processing a video image may include a filter configured to remove artifacts from pictures decoded by a video decoder; a differential picture encoder configured to produce compressed differential pictures based on the decoded pictures and the pictures filtered by the filter; and a differential picture decoder configured to reconstruct the filtered pictures based on the decoded pictures and the compressed differential pictures. A method for post-processing a video image may include filtering pictures decoded by a video decoder to remove artifacts from the decoded pictures; producing compressed differential pictures based on the decoded pictures and the filtered pictures; and reconstructing the filtered pictures based on the decoded pictures and the compressed differential pictures. A video image system may include a video decoder; a filter; a differential picture encoder; a memory; a differential picture decoder; and a display unit.
摘要翻译：用于后处理视频图像的装置可以包括被配置为从由视频解码器解码的图像中去除伪像的滤波器; 差分图像编码器，被配置为基于解码图像和由滤波器滤波的图像产生压缩差分图像; 以及差分图像解码器，被配置为基于解码的图像和压缩的差分图像重建经滤波的图像。用于后处理视频图像的方法可以包括对由视频解码器解码的图像进行滤波以从解码的图像中去除伪像; 基于解码图像和滤波图像产生压缩差分图像; 以及基于解码的图像和压缩的差分图像来重建滤波的图像。视频图像系统可以包括视频解码器; 过滤器差分图像编码器; 记忆差分图像解码器; 和显示单元。

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