专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060285271A1 Multilayer chip capacitor 失效
标题翻译：多层片式电容器
公开(公告)号：US20060285271A1
公开(公告)日：2006-12-21
申请号：US11453880
申请日：2006-06-16
申请人： Byoung Lee , Chang Shim , Hae Chung , Dong Park , Sang Park , Min Park
发明人： Byoung Lee , Chang Shim , Hae Chung , Dong Park , Sang Park , Min Park
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/232
摘要： The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal electrodes are separated from one another by the dielectric layers within the capacitor body. Each of the first internal electrodes opposes each of the second internal electrodes. Each of the first and second internal electrodes includes at least two leads extending toward any side of the capacitor body. Also, a plurality of external electrodes are formed on an outer surface of the capacitor body and connected to the internal electrodes via the leads. Further, vertically adjacent ones of the leads having the same polarity extend in different directions at a predetermined angle. The leads of the first and second internal electrodes are disposed adjacent to and alternate with those of the second internal electrodes.
摘要翻译：本发明提供了一种减少ESL的多层片式电容器。电容器本体具有沿厚度方向堆叠的多个电介质层。多个第一和第二内部电极通过电容器主体内的电介质层彼此分离。每个第一内部电极与每个第二内部电极相对。第一和第二内部电极中的每一个包括朝向电容器主体的任何一侧延伸的至少两个引线。此外，多个外部电极形成在电容器主体的外表面上并通过引线连接到内部电极。此外，具有相同极性的垂直相邻的引线以预定角度在不同方向上延伸。第一和第二内部电极的引线设置成与第二内部电极的引线相邻并与其交替。

2. 发明申请

US20060158827A1 MULTILAYER CHIP CAPACITOR 有权
标题翻译：多层芯片电容器
公开(公告)号：US20060158827A1
公开(公告)日：2006-07-20
申请号：US11068825
申请日：2005-03-02
申请人： Byoung Lee , Chang Shim , Hae Chung , Dong Park , Sang Park , Min Park
发明人： Byoung Lee , Chang Shim , Hae Chung , Dong Park , Sang Park , Min Park
IPC分类号： H01G4/06
CPC分类号： H01G4/30 , H01G4/232
摘要： A multilayer chip capacitor, which reduces ESL generated due to current flowing through external electrodes and assures an improved mechanical strength. The multilayer chip capacitor includes an upper dummy layer and a lower dummy layer; a plurality of internal electrodes interposed between the upper and lower dummy layers; and external electrodes connected to the internal electrodes, wherein the thickness of the lower dummy layer is smaller than the thickness of the upper dummy layer.
摘要翻译：一种多层片状电容器，其减少由于电流流过外部电极而产生的ESL，并确保改进的机械强度。多层片状电容器包括上虚拟层和下虚拟层; 插入在上下虚拟层之间的多个内部电极; 以及连接到内部电极的外部电极，其中下部虚拟层的厚度小于上部虚拟层的厚度。

3. 发明申请

US20060092595A1 Multilayered chip capacitor array 有权
公开(公告)号：US20060092595A1
公开(公告)日：2006-05-04
申请号：US11264486
申请日：2005-11-01
申请人： Byoung Hwa Lee , Hiroki Sato , Chang Shim , Sang Park , Hae Chung , Dong Park , Min Park , Hyun Yi , Min Kwon , Seung Han
发明人： Byoung Hwa Lee , Hiroki Sato , Chang Shim , Sang Park , Hae Chung , Dong Park , Min Park , Hyun Yi , Min Kwon , Seung Han
IPC分类号： H01G4/228
CPC分类号： H05K1/0231 , H01G2/065 , H01G4/228 , H01G4/30 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16235 , H01L2924/00014 , H01L2924/15159 , H01L2924/19041 , H01L2924/19106 , H05K2201/10515 , H05K2201/1053 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Disclosed herein is a multilayered chip capacitor array, including a capacitor body having a plurality of dielectric layers, a plurality of pairs of first and second inner electrodes which are formed on the plurality of dielectric layers such that one electrode of one pair of inner electrodes faces the other electrode of the one pair of inner electrodes with one of the plurality of dielectric layers interposed therebetween, at least one first outer terminal and a plurality of second outer terminals formed on at least one surface of a top surface and a bottom surface of the capacitor body, and at least one first conductive via and a plurality of second conductive vias formed in a stacking direction of the capacitor body and connected to the first outer terminal and the second outer terminal, respectively.

4. 发明申请

US20070109717A1 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US20070109717A1
公开(公告)日：2007-05-17
申请号：US11598672
申请日：2006-11-14
申请人： Byoung Lee , Hae Chung , Dong Park , Min Park , Sang Park , Sung Wi
发明人： Byoung Lee , Hae Chung , Dong Park , Min Park , Sang Park , Sung Wi
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor includes a capacitor body having dielectric layers, and internal electrode layers separated from each other in the capacitor body by the dielectric layers. Each internal electrode layer has one or two leads and includes at least one coplanar electrode plate. External electrodes are electrically connected to the internal electrode layers via the leads. The internal electrode layers constitute a plurality of blocks stacked repeatedly. Each block includes a plurality of the internal electrode layers stacked successively. The leads extending to a face of the capacitor body are arranged in a zigzag shape along a stacking direction. The leads of vertically adjacent ones of the electrode plates having opposite polarities are arranged to be horizontally adjacent to each other.
摘要翻译：多层片状电容器包括具有电介质层的电容器主体，以及通过电介质层在电容器主体中彼此分离的内部电极层。每个内部电极层具有一个或两个引线并且包括至少一个共面电极板。外部电极通过引线电连接到内部电极层。内部电极层构成反复堆叠的多个块。每个块包括依次层叠的多个内部电极层。延伸到电容器主体的表面的引线沿堆叠方向布置成Z字形。具有相反极性的垂直相邻电极板的引线被布置成水平相邻。

5. 发明申请

US20060291138A1 Built-in type upper/lower electrode multi-layer part and method of manufacturing thereof 审中-公开
标题翻译：内置型上下电极多层部件及其制造方法
公开(公告)号：US20060291138A1
公开(公告)日：2006-12-28
申请号：US11472335
申请日：2006-06-22
申请人： Sung Kang , Jin Ahn , Suk Cho , Young Choi , Hae Chung , Chang Shim
发明人： Sung Kang , Jin Ahn , Suk Cho , Young Choi , Hae Chung , Chang Shim
IPC分类号： H01G4/236
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： The present invention relates to a method of manufacturing a built-in type upper/lower electrode multi-layer part including alternately laminating a first ceramic sheet having a first internal electrode pattern formed thereon and a second ceramic sheet having a second internal electrode pattern formed thereon so as to form a first multi-layer sheet product; forming first and second via holes on the first multi-layer sheet product, the first and second via holes respectively connecting the first and second internal electrode patterns; respectively joining third and fourth ceramic sheets having no internal electrode pattern on the upper and lower portions of the first multi-layer sheet product so as to form a second multi-layer sheet product, the third and fourth ceramic sheets having third and fourth via holes formed to correspond to the first and second via holes; and filling a conductive paste in the first to fourth via holes.
摘要翻译：本发明涉及一种制造内置型上下电极多层部件的方法，该方法包括交替层叠形成有第一内部电极图案的第一陶瓷片和形成有第二内部电极图案的第二陶瓷片以形成第一多层片材制品; 在第一多层片材产品上形成第一和第二通孔，分别连接第一和第二内部电极图案的第一和第二通孔; 分别在第一多层片材的上部和下部接合不具有内部电极图案的第三和第四陶瓷片，以形成第二多层片材产品，第三和第四陶瓷片具有第三和第四通孔形成为对应于第一和第二通孔; 并在第一至第四通孔中填充导电膏。

6. 发明申请

US20130287128A1 500MBPS TRANSMISSION APPARATUS USING 2P LINE 有权
标题翻译：使用2P LINE的500MBPS传输设备
公开(公告)号：US20130287128A1
公开(公告)日：2013-10-31
申请号：US13997510
申请日：2011-11-23
申请人： Hyung-Jin Park , Jae-Hyoung Park , Hae Chung , Jin-Hee Kim , Dong Won Lee , Seong-Bae Jeon
发明人： Hyung-Jin Park , Jae-Hyoung Park , Hae Chung , Jin-Hee Kim , Dong Won Lee , Seong-Bae Jeon
IPC分类号： H04B3/02
CPC分类号： H04B3/02 , H04L1/0067 , H04L5/1423 , H04L12/2801 , H04L25/05 , H04L25/14 , H04L25/4919 , H04L47/266 , H04L49/40
摘要： A 500 Mbps transmission apparatus is provided. The apparatus uses a 2P line which is capable of providing a 500 megabits-per-second service via a 2P UTP cable by adding a sub-layer which serializes and de-serializes symbols which have rates matched with each other and are synchronized, while maintaining a 1000BASE-T unique hierarchical architecture.
摘要翻译：提供500Mbps的传输设备。该设备使用2P线路，其能够通过2P UTP电缆提供500兆比特/秒的服务，通过添加将具有彼此匹配并且被同步的速率的符号串行化和解串行化的子层，同时保持 1000BASE-T独特的层次结构。

7. 发明申请

US20070007811A1 Armrest tilting device 有权
公开(公告)号：US20070007811A1
公开(公告)日：2007-01-11
申请号：US10555900
申请日：2004-04-30
申请人： Hae Chung
发明人： Hae Chung
IPC分类号： A47C7/54
CPC分类号： B60N2/767 , B60N2/753
摘要： A device for adjusting the inclination of the armrest by combined operation of the gear and cam mechanisms is provided. The device comprises a housing a ratchet member (12), a check member, a pivot control device comprising a fixed cam (22), a rotational com (24) and a torsion coil spring (32).

8. 发明授权

US06721504B2 Method for requesting grant for MAC protocol in PON 有权
标题翻译：在PON中请求授权给MAC协议的方法
公开(公告)号：US06721504B2
公开(公告)日：2004-04-13
申请号：US09735797
申请日：2000-12-14
申请人： Jin-Hee Kim , Hae Chung , Gun-Il Yoo , Sang-Ho Koh , Sun-Cheol Gweon
发明人： Jin-Hee Kim , Hae Chung , Gun-Il Yoo , Sang-Ho Koh , Sun-Cheol Gweon
IPC分类号： H04J1402
CPC分类号： H04Q11/0062 , H04Q11/0067 , H04Q2011/0064 , H04Q2011/0088
摘要： A method for requesting a grant for Medium Access Control (MAC) being applied to a Passive Optical Network (PON) system. The method includes the steps of: a) deciding a period of a mini slot (Tms), which is necessary for a plurality of Optical Network Units (ONU) to transmit upstream cells to an Optical Line Termination (OLT); b) deciding a period of a divided slot (Tds) and a link overhead (Co) based on the period of the mini slot (Tms); c) calculating a length of the mini slot based on information to be transmitted to the OLT and a protocol being used; and d) requesting a grant for a MAC protocol between the plurality of the ONUs by calculating and allocating optimal parameters based on the length of the mini slot.
摘要翻译：一种向被动光网络（PON）系统请求授予媒体接入控制（MAC）的方法。该方法包括以下步骤：a）确定多个光网络单元（ONU）将上行小区发送到光线路终端（OLT）所需的小时隙（Tms）的周期; b）基于微时隙（Tms）的周期来确定分割时隙（Tds）和链路开销（Co）的周期; c）基于要发送到OLT的信息和正在使用的协议来计算迷你时隙的长度; 以及d）通过基于所述迷你时隙的长度计算和分配最佳参数来请求所述多个ONU之间的MAC协议的授权。

9. 发明申请

US20070236069A1 Device for Stooping Car Headrests 有权
标题翻译：车头枕头装置
公开(公告)号：US20070236069A1
公开(公告)日：2007-10-11
申请号：US11587739
申请日：2005-04-26
申请人： Hae Chung
发明人： Hae Chung
IPC分类号： B60N2/48
CPC分类号： B60N2/859
摘要： A device for stooping car headrests is provided. The device includes a housing in which a stay of a car headrest is pivotably coupled thereto, a main spring installed in the housing to bias the stay and the headrest in the forward direction, an arresting member pivotably and resiliently fixed to the housing for releasably holding the stay and a check member having a release and pivotably and resiliently coupled to the arresting member for controlling movement of the arresting member.
摘要翻译：提供了一种用于起落架头枕的装置。该装置包括壳体，其中轿厢头枕的支撑件可枢转地联接到其上，主弹簧，其安装在壳体中以向前方向偏置撑杆和头枕;止动构件，其可枢转地并且弹性地固定到壳体以可释放地保持所述支撑件和支架构件具有释放并且可枢转地且弹性地联接到所述止动构件以控制所述止动构件的运动。

10. 发明授权

US09042464B2 500 Mbps transmission apparatus using 2P line 有权
标题翻译： 500Mbps传输设备使用2P线
公开(公告)号：US09042464B2
公开(公告)日：2015-05-26
申请号：US13997510
申请日：2011-11-23
申请人： Hyung-Jin Park , Jae-Hyoung Park , Hae Chung , Jin-Hee Kim , Dong Won Lee , Seong-Bae Jeon
发明人： Hyung-Jin Park , Jae-Hyoung Park , Hae Chung , Jin-Hee Kim , Dong Won Lee , Seong-Bae Jeon
IPC分类号： H04B3/02 , H04L12/931 , H04L25/05 , H04L25/14 , H04L25/49 , H04L12/28 , H04L1/00 , H04L5/14 , H04L12/825
CPC分类号： H04B3/02 , H04L1/0067 , H04L5/1423 , H04L12/2801 , H04L25/05 , H04L25/14 , H04L25/4919 , H04L47/266 , H04L49/40
摘要： A 500 Mbps transmission apparatus is provided. The apparatus uses a 2P line which is capable of providing a 500 megabits-per-second service via a 2P UTP cable by adding a sub-layer which serializes and de-serializes symbols which have rates matched with each other and are synchronized, while maintaining a 1000BASE-T unique hierarchical architecture.
摘要翻译：提供500Mbps的传输设备。该设备使用2P线路，其能够通过2P UTP电缆提供500兆比特/秒的服务，通过添加将具有彼此匹配并且被同步的速率的符号串行化和解串行化的子层，同时保持 1000BASE-T独特的层次结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式