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1. 发明申请

US20050077803A1 Film bulk acoustic resonator and method for manufacturing the same 有权
标题翻译：薄膜体声波谐振器及其制造方法
公开(公告)号：US20050077803A1
公开(公告)日：2005-04-14
申请号：US10929569
申请日：2004-08-31
申请人： Byeoung-ju Ha , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
发明人： Byeoung-ju Ha , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
IPC分类号： H03H9/24 , H03H3/02 , H03H9/17 , H01L41/04
CPC分类号： H03H9/173 , H03H3/02 , H03H9/02133 , H03H2003/021 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49155
摘要： A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.
摘要翻译：一种薄膜体声波谐振器及其制造方法。薄膜体声波谐振器包括基板，气相沉积在基板上的保护层，气相沉积在保护层上并距离基板的上侧预定距离的膜，以及气相沉积在膜。此外，制造方法包括在基板上气相沉积膜，在膜的两侧形成保护层，在膜上气相沉积层叠的共振部分，并且通过去除设置在膜之间的基板的一部分来形成气隙保护层。因此，膜可以以简单的结构形成并且没有应力，并且整个制造过程被简化。

2. 发明申请

US20070157442A1 FILM BULK ACOUSTIC RESONATOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电影胶卷声谐振器及其制造方法
公开(公告)号：US20070157442A1
公开(公告)日：2007-07-12
申请号：US11687734
申请日：2007-03-19
申请人： Byeoung-ju HA , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
发明人： Byeoung-ju HA , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
IPC分类号： H04R17/00 , B05D5/12
CPC分类号： H03H9/173 , H03H3/02 , H03H9/02133 , H03H2003/021 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49155
摘要： A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.
摘要翻译：一种薄膜体声波谐振器及其制造方法。薄膜体声波谐振器包括基板，气相沉积在基板上的保护层，气相沉积在保护层上并距离基板的上侧预定距离的膜，以及气相沉积在膜。此外，制造方法包括在基板上气相沉积膜，在膜的两侧形成保护层，在膜上气相沉积层叠的共振部分，并且通过去除设置在膜之间的基板的一部分来形成气隙保护层。因此，膜可以以简单的结构形成并且没有应力，并且整个制造过程被简化。

3. 发明授权

US07793395B2 Method for manufacturing a film bulk acoustic resonator 有权
标题翻译：薄膜体声共振器的制造方法
公开(公告)号：US07793395B2
公开(公告)日：2010-09-14
申请号：US11687734
申请日：2007-03-19
申请人： Byeoung-ju Ha , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
发明人： Byeoung-ju Ha , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
IPC分类号： H01L41/22 , H01L41/00
CPC分类号： H03H9/173 , H03H3/02 , H03H9/02133 , H03H2003/021 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49155
摘要： A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.
摘要翻译：一种薄膜体声波谐振器及其制造方法。薄膜体声波谐振器包括基板，气相沉积在基板上的保护层，气相沉积在保护层上并距离基板的上侧预定距离的膜，以及气相沉积在膜。此外，制造方法包括在基板上气相沉积膜，在膜的两侧形成保护层，在膜上气相沉积层叠的共振部分，并且通过去除设置在膜之间的基板的一部分来形成气隙保护层。因此，膜可以以简单的结构形成并且没有应力，并且整个制造过程被简化。

4. 发明授权

US07205702B2 Film bulk acoustic resonator and method for manufacturing the same 有权
标题翻译：薄膜体声波谐振器及其制造方法
公开(公告)号：US07205702B2
公开(公告)日：2007-04-17
申请号：US10929569
申请日：2004-08-31
申请人： Byeoung-ju Ha , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
发明人： Byeoung-ju Ha , Yun-kwon Park , In-sang Song , Il-jong Song , Jong-seok Kim , Duck-hwan Kim , Jun-sik Hwang
IPC分类号： H01L41/04 , H01L41/08
CPC分类号： H03H9/173 , H03H3/02 , H03H9/02133 , H03H2003/021 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49155
摘要： A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.
摘要翻译：一种薄膜体声波谐振器及其制造方法。薄膜体声波谐振器包括基板，气相沉积在基板上的保护层，气相沉积在保护层上并距离基板的上侧预定距离的膜，以及气相沉积在膜。此外，制造方法包括在基板上气相沉积膜，在膜的两侧形成保护层，在膜上气相沉积层叠的共振部分，并且通过去除设置在膜之间的基板的一部分来形成气隙保护层。因此，膜可以以简单的结构形成并且没有应力，并且整个制造过程被简化。

5. 发明授权

US08418331B2 Method of fabricating a duplexer using an embedded PCB 有权
标题翻译：使用嵌入式PCB制作双工器的方法
公开(公告)号：US08418331B2
公开(公告)日：2013-04-16
申请号：US13006052
申请日：2011-01-13
申请人： Jun-sik Hwang , Yun-kwon Park , Il-jong Song , Byeoung-ju Ha
发明人： Jun-sik Hwang , Yun-kwon Park , Il-jong Song , Byeoung-ju Ha
IPC分类号： H04R17/10 , H05K3/30
CPC分类号： H03H9/706 , H01L2224/16235 , H01L2224/81192 , H01L2924/15313 , H01L2924/16251 , H01P1/213 , H03H9/0571 , H05K1/0243 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4652 , H05K2201/0959 , H05K2201/1006 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： Provided is a method for fabricating a duplexer. The method includes fabricating an embedded PCB having an isolation part built therein and forming pads on certain areas of an upper side of the embedded PCB to connect with an external terminal. Further, a first filter and a second filter are separately fabricated, each having at least one film bulk acoustic resonator which is fabricated by depositing a lower electrode, a piezoelectric layer, and an upper electrode in this respective order. Thereafter, the first and second filters are bonded onto the pads formed on the embedded PCB. The entire surface of the embedded PCD is packaged at a predetermined distance from the first and second filters.
摘要翻译：提供了一种制造双工器的方法。该方法包括制造其中内置隔离部分的嵌入式PCB，并在嵌入式PCB的上侧某些区域上形成焊盘，以与外部端子连接。此外，分别制造第一滤波器和第二滤波器，每个滤波器和第二滤波器具有至少一个薄膜体声波谐振器，其通过以各自的顺序沉积下电极，压电层和上电极而制造。此后，将第一和第二滤光器结合到形成在嵌入式PCB上的焊盘上。嵌入式PCD的整个表面被封装在与第一和第二滤光器相距预定距离处。

6. 发明申请

US20050105478A1 Duplexer fabrication method using embedded PCB and duplexer fabricated by the same 有权
标题翻译：使用嵌入式PCB和双工器的双工器制造方法
公开(公告)号：US20050105478A1
公开(公告)日：2005-05-19
申请号：US10923086
申请日：2004-08-23
申请人： Jun-sik Hwang , Yun-kwon Park , Il-jong Song , Byeoung-ju Ha
发明人： Jun-sik Hwang , Yun-kwon Park , Il-jong Song , Byeoung-ju Ha
IPC分类号： H05K3/46 , H01P1/18 , H01P1/205 , H01P1/213 , H01P11/00 , H03H9/17 , H03H9/70 , H05K1/02 , H05K1/16 , H05K3/42 , H04B1/56
CPC分类号： H03H9/706 , H01L2224/16235 , H01L2224/81192 , H01L2924/15313 , H01L2924/16251 , H01P1/213 , H03H9/0571 , H05K1/0243 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4652 , H05K2201/0959 , H05K2201/1006 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A high-integrated duplexer and a fabrication method thereof. The duplexer has a first filter to pass a signal of a transmitted frequency band, a second filter to pass a signal of a received frequency band, an embedded PCB having the first and second filters bonded on a certain area of a surface of an upper side in a predetermined distance from each other, and an isolation part to prevent a signal interference between the first and second filters, and a packaging substrate to package the entire upper side of the embedded PCB so that the packaging substrate is located above and separated from the first and second filters by a predetermined distance. The fabricated high-integrated duplexer has a small size and high performance.
摘要翻译：高集成双工器及其制造方法。双工器具有通过发送频带的信号的第一滤波器，传递接收频带的信号的第二滤波器，具有第一和第二滤波器的嵌入式PCB，该第一和第二滤波器接合在上侧表面的某一区域上隔离部分，以防止第一和第二滤光器之间的信号干扰，以及封装基板，以封装嵌入式PCB的整个上侧，使得封装基板位于上方并与之分离第一和第二滤光器预定距离。制造的高集成双工器具有小尺寸和高性能。

7. 发明授权

US07893792B2 Duplexer using an embedded PCB and method of fabricating the same 有权
标题翻译：使用嵌入式PCB的双工器及其制造方法
公开(公告)号：US07893792B2
公开(公告)日：2011-02-22
申请号：US10923086
申请日：2004-08-23
申请人： Jun-sik Hwang , Yun-kwon Park , Il-jong Song , Byeoung-ju Ha
发明人： Jun-sik Hwang , Yun-kwon Park , Il-jong Song , Byeoung-ju Ha
IPC分类号： H03H9/54 , H01P1/213
CPC分类号： H03H9/706 , H01L2224/16235 , H01L2224/81192 , H01L2924/15313 , H01L2924/16251 , H01P1/213 , H03H9/0571 , H05K1/0243 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4652 , H05K2201/0959 , H05K2201/1006 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A high-integrated duplexer and a fabrication method thereof. The duplexer has a first filter to pass a signal of a transmitted frequency band, a second filter to pass a signal of a received frequency band, an embedded PCB having the first and second filters bonded on a certain area of a surface of an upper side in a predetermined distance from each other, and an isolation part to prevent a signal interference between the first and second filters, and a packaging substrate to package the entire upper side of the embedded PCB so that the packaging substrate is located above and separated from the first and second filters by a predetermined distance. The fabricated high-integrated duplexer has a small size and high performance.
摘要翻译：高集成双工器及其制造方法。双工器具有通过发送频带的信号的第一滤波器，传递接收频带的信号的第二滤波器，具有第一和第二滤波器的嵌入式PCB，该第一和第二滤波器接合在上侧表面的某一区域上隔离部分，以防止第一和第二滤光器之间的信号干扰，以及封装基板，以封装嵌入式PCB的整个上侧，使得封装基板位于上方并与之分离第一和第二滤光器预定距离。制造的高集成双工器具有小尺寸和高性能。

8. 发明申请

US20050128027A1 Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same 有权
标题翻译：气隙型FBAR，其制造方法，以及使用该FBAR的过滤器和双工器
公开(公告)号：US20050128027A1
公开(公告)日：2005-06-16
申请号：US10959313
申请日：2004-10-07
申请人： In-sang Song , Yun-kwon Park , Byeoung-ju Ha , Jun-sik Hwang
发明人： In-sang Song , Yun-kwon Park , Byeoung-ju Ha , Jun-sik Hwang
IPC分类号： H01L41/09 , H01L41/08 , H01L41/18 , H03H3/02 , H03H9/10 , H03H9/17 , H03H9/24 , H03H9/58 , H03H9/70
CPC分类号： H03H9/587 , H03H3/02 , H03H9/105 , H03H9/173 , Y10T29/42
摘要： An air-gap type thin film bulk acoustic resonator (FBAR) and method for fabricating the same. Also disclosed are a filter and a duplexer employing the air-gap type FBAR. The air-gap type FBAR includes: a first substrate having a cavity part at a predetermined region on its upper surface; a dielectric film stacked on the upper part of the first substrate; a first air gap formed between the first substrate and the dielectric film; a stacked resonance part including a lower electrode/piezoelectric layer/upper electrode formed on the upper part of the dielectric film; a second substrate having a cavity part at a predetermined region on its lower surface and joined to the first substrate; and a second air gap formed between the stacked resonance part and the second substrate. A thin film of predetermined thickness made of a liquid crystal polymer (LCP) may be used as the dielectric film.
摘要翻译：气隙式薄膜体声波谐振器（FBAR）及其制造方法。还公开了采用气隙型FBAR的过滤器和双工器。气隙式FBAR包括：第一基板，其上表面上的预定区域具有空腔部分; 电介质膜，其堆叠在所述第一基板的上部; 在所述第一基板和所述电介质膜之间形成的第一气隙; 堆叠的共振部分，包括形成在电介质膜的上部的下电极/压电层/上电极; 第二基板，在其下表面上的预定区域具有空腔部分，并且与第一基板接合; 以及在所述层叠的共振部和所述第二基板之间形成的第二气隙。可以使用由液晶聚合物（LCP）制成的预定厚度的薄膜作为电介质膜。

9. 发明授权

US07253703B2 Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same 有权
标题翻译：气隙型FBAR，其制造方法，以及使用该FBAR的过滤器和双工器
公开(公告)号：US07253703B2
公开(公告)日：2007-08-07
申请号：US10959313
申请日：2004-10-07
申请人： In-sang Song , Yun-kwon Park , Byeoung-ju Ha , Jun-sik Hwang
发明人： In-sang Song , Yun-kwon Park , Byeoung-ju Ha , Jun-sik Hwang
IPC分类号： H03H9/54 , H03H9/70 , H03H9/10 , H03H9/15 , H03H3/02
CPC分类号： H03H9/587 , H03H3/02 , H03H9/105 , H03H9/173 , Y10T29/42
摘要： An air-gap type thin film bulk acoustic resonator (FBAR) and method for fabricating the same. Also disclosed are a filter and a duplexer employing the air-gap type FBAR. The air-gap type FBAR includes: a first substrate having a cavity part at a predetermined region on its upper surface; a dielectric film stacked on the upper part of the first substrate; a first air gap formed between the first substrate and the dielectric film; a stacked resonance part including a lower electrode/piezoelectric layer/upper electrode formed on the upper part of the dielectric film; a second substrate having a cavity part at a predetermined region on its lower surface and joined to the first substrate; and a second air gap formed between the stacked resonance part and the second substrate. A thin film of predetermined thickness made of a liquid crystal polymer (LCP) may be used as the dielectric film.
摘要翻译：气隙式薄膜体声波谐振器（FBAR）及其制造方法。还公开了采用气隙型FBAR的过滤器和双工器。气隙式FBAR包括：第一基板，其上表面上的预定区域具有空腔部分; 电介质膜，其堆叠在所述第一基板的上部; 在所述第一基板和所述电介质膜之间形成的第一气隙; 堆叠的共振部分，包括形成在电介质膜的上部的下电极/压电层/上电极; 第二基板，在其下表面上的预定区域具有空腔部分，并且与第一基板接合; 以及在所述层叠的共振部和所述第二基板之间形成的第二气隙。可以使用由液晶聚合物（LCP）制成的预定厚度的薄膜作为电介质膜。

10. 发明授权

US07408257B2 Packaging chip and packaging method thereof 失效
标题翻译：包装芯片及其包装方法
公开(公告)号：US07408257B2
公开(公告)日：2008-08-05
申请号：US11390220
申请日：2006-03-28
申请人： Kyu-dong Jung , Woon-bae Kim , In-sang Song , Moon-chul Lee , Jun-sik Hwang , Suk-jin Ham
发明人： Kyu-dong Jung , Woon-bae Kim , In-sang Song , Moon-chul Lee , Jun-sik Hwang , Suk-jin Ham
IPC分类号： H01L23/04
CPC分类号： H01L23/055 , H01L23/04 , H01L27/14618 , H01L2224/16
摘要： A packaging chip in which a circuit module is packaged and a method of packaging a circuit module are provided. The packaging chip includes a base wafer; a circuit module on the base wafer; a packaging wafer having a cavity and combined with the base wafer so that the circuit module fits inside the cavity; a connecting electrode connecting upper and lower surfaces of the cavity; and a seed layer between the connecting electrode and the packaging wafer. The method includes etching a lower surface of the packaging wafer to form a cavity, stacking a metal layer in an area of the lower surface, combining the base wafer with the packaging wafer, polishing the packaging wafer, forming a viahole through the packaging wafer, stacking a seed layer on the packaging wafer, plating the inside of the viahole, removing the seed layer and forming an electrode.
摘要翻译：提供电路模块封装的封装芯片和封装电路模块的方法。包装芯片包括基底晶片; 基底晶片上的电路模块; 封装晶片，其具有空腔并与所述基底晶片组合，使得所述电路模块装配在所述腔内; 连接所述空腔的上表面和下表面的连接电极; 以及连接电极和封装晶片之间的晶种层。该方法包括蚀刻封装晶片的下表面以形成空腔，在下表面的区域中堆叠金属层，将基底晶片与封装晶片组合，抛光封装晶片，通过封装晶片形成通孔，将种子层堆叠在包装晶片上，电镀通孔内部，去除种子层并形成电极。

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