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1. 发明授权

US07800190B2 Getter on die in an upper sense plate designed system 有权
标题翻译：吸气器在上感板设计系统中死亡
公开(公告)号：US07800190B2
公开(公告)日：2010-09-21
申请号：US12140006
申请日：2008-06-16
申请人： Bryan Seppala , Jon DCamp , Max Glenn
发明人： Bryan Seppala , Jon DCamp , Max Glenn
IPC分类号： G01L9/04
CPC分类号： B81B7/0038 , H01L2224/05554 , H01L2224/16225 , H01L2224/49171 , H01L2924/16195 , Y10T29/49002
摘要： A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and lower plates made in accordance with upper sense plate design. The MEMS die is mounted to the bottom section. The upper and lower plates form a cavity that receives a MEMS device. The upper and lower plates are bonded by one or more bond pads and a seal ring that surrounds the cavity. The seal ring includes grooves that allow exposure of the cavity to the space within the package. A getter material applied to a top surface of the MEMS die on the upper plate. The getter material is activated during or after the lid is mounted to the bottom section.
摘要翻译：微机电系统（MEMS）密封封装装置，其制造费用较低，因此制造成本较低。示例性包装装置包括具有底部部分和盖子的包装。 MEMS模具包括根据上感测板设计制成的上板和下板。 MEMS管芯安装在底部。上板和下板形成接收MEMS装置的空腔。上板和下板通过一个或多个接合垫和围绕腔的密封环粘合。密封环包括允许腔体暴露于包装内的空间的凹槽。将吸气剂材料施加到上板上的MEMS管芯的顶表面。吸气剂材料在盖被安装到底部部分期间或之后被激活。

2. 发明申请

US20100020517A1 MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS 审中-公开
标题翻译： MEMS BUMP PATTERN DIE对准系统和方法
公开(公告)号：US20100020517A1
公开(公告)日：2010-01-28
申请号：US12180336
申请日：2008-07-25
申请人： Bryan Seppala , Jon DCamp , Harlan Curtis , Max Glenn , Lori Dunaway
发明人： Bryan Seppala , Jon DCamp , Harlan Curtis , Max Glenn , Lori Dunaway
IPC分类号： H05K7/02 , H01L21/60
CPC分类号： B81B7/007 , B81C3/004 , B81C2203/051 , H01L2224/16
摘要： A Leadless Chip Carrier (LCC) device and method of attaching a Microelectromechanical (MEMS) device into an LCC package. An alignment plate is die bonded into the bottom of an LCC. The alignment plate includes fiducials fabricated into top and bottom metal layers, thus producing a tolerance that will be an order of magnitude better than the tolerance of fiducials included in the LCC. A bump pattern and MEMS die are attached based on the alignment plate and fiducials giving a much improved die to bump alignment.
摘要翻译：一种无引线芯片载体（LCC）器件和将微机电（MEMS）器件连接到LCC封装中的方法。对准板被模具粘合到LCC的底部。对准板包括制造成顶部和底部金属层的基准，从而产生将比包括在LCC中的基准的公差好一个数量级的公差。基于对准板和基准来附接突起图案和MEMS管芯，从而提供了大大改进的管芯到凸点对准。

3. 发明申请

US20090309203A1 GETTER ON DIE IN AN UPPER SENSE PLATE DESIGNED SYSTEM 有权
标题翻译：在上传感应板设计系统中的入口
公开(公告)号：US20090309203A1
公开(公告)日：2009-12-17
申请号：US12140006
申请日：2008-06-16
申请人： Bryan Seppala , Jon DCamp , Max Glenn
发明人： Bryan Seppala , Jon DCamp , Max Glenn
IPC分类号： H01L23/20 , H01S4/00
CPC分类号： B81B7/0038 , H01L2224/05554 , H01L2224/16225 , H01L2224/49171 , H01L2924/16195 , Y10T29/49002
摘要： A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and lower plates made in accordance with upper sense plate design. The MEMS die is mounted to the bottom section. The upper and lower plates form a cavity that receives a MEMS device. The upper and lower plates are bonded by one or more bond pads and a seal ring that surrounds the cavity. The seal ring includes grooves that allow exposure of the cavity to the space within the package. A getter material applied to a top surface of the MEMS die on the upper plate. The getter material is activated during or after the lid is mounted to the bottom section.
摘要翻译：微机电系统（MEMS）密封封装装置，其制造费用较低，因此制造成本较低。示例性包装装置包括具有底部部分和盖子的包装。 MEMS模具包括根据上感测板设计制成的上板和下板。 MEMS管芯安装在底部。上板和下板形成接收MEMS装置的空腔。上板和下板通过一个或多个接合垫和围绕腔的密封环粘合。密封环包括允许腔体暴露于包装内的空间的凹槽。将吸气剂材料施加到上板上的MEMS管芯的顶表面。吸气剂材料在盖被安装到底部部分期间或之后被激活。

4. 发明授权

US4904340A Laser-assisted liquid-phase etching of copper conductors 失效
标题翻译：铜导体的激光辅助液相蚀刻
公开(公告)号：US4904340A
公开(公告)日：1990-02-27
申请号：US264564
申请日：1988-10-31
申请人： Robert F. Miracky , Kantesh Doss , Bryan Seppala
发明人： Robert F. Miracky , Kantesh Doss , Bryan Seppala
IPC分类号： C23F1/02 , H05K3/06 , H05K3/22 , H05K3/38 , H05K3/46
CPC分类号： H05K3/06 , C23F1/02 , H05K2203/0361 , H05K2203/107 , H05K2203/175 , H05K3/225 , H05K3/388 , H05K3/467
摘要： A process for laser-assisted liquid phase etching of copper conductors which includes the use of a solution of sulfuric acid and hydrogen peroxide in contact with an integrated circuit substrate and the provision of a laser beam to select substrate areas having copper conductors to be etched. Also disclosed is an apparatus for the laser-assisted etching.
摘要翻译：一种用于铜导体的激光辅助液相蚀刻的方法，其包括使用与集成电路基板接触的硫酸和过氧化氢溶液，以及提供激光束以选择具有要被蚀刻的铜导体的衬底区域。还公开了一种用于激光辅助蚀刻的装置。

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