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1. 发明申请

US20120256990A1 PATTERNED CONDUCTIVE ARRAY AND SELF LEVELING EPOXY 有权
标题翻译：图形导电阵列和自我调节环氧树脂
公开(公告)号：US20120256990A1
公开(公告)日：2012-10-11
申请号：US13081584
申请日：2011-04-07
申请人： Bradley J. Gerner , Bryan R. Dolan , John R. Andrews , Peter J. Nystrom
发明人： Bradley J. Gerner , Bryan R. Dolan , John R. Andrews , Peter J. Nystrom
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1631 , B41J2/1634 , B41J2/1646
摘要： A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.
摘要翻译：形成喷墨打印头的方法可以包括将多个压电元件附接到隔膜，在隔膜上分配间隙层，将多个导电元件电耦合到多个压电元件，以及固化间隙层。间隙层内的多个电隔离导电颗粒将多个导电元件电耦合到多个压电元件。导电粒子可以均匀地分布在整个间隙层电介质的整体中，或者它们可以定位在每个压电元件的顶表面上，并插入在多个压电元件和多个导电元件之间。导电元件可以是柔性电路或印刷电路板的一部分。

2. 发明授权

US08646881B1 Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays 有权
标题翻译：间隙材料，以实现高密度压电阵列的鲁棒电气互连
公开(公告)号：US08646881B1
公开(公告)日：2014-02-11
申请号：US13570056
申请日：2012-08-08
申请人： Bryan R. Dolan , Gary D. Redding , Peter J. Nystrom
发明人： Bryan R. Dolan , Gary D. Redding , Peter J. Nystrom
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2002/14491 , B41J2202/11
摘要： An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.
摘要翻译：一种喷墨打印头，包括在相邻的压电元件之间的间隙区域中的多个支撑层支撑件和形成方法。多个间隔层支撑体可以由与压电元件相同的层，或者由诸如聚合物的电介质层形成。隔离层支撑增加了可以附接隔离层的区域，从而形成诸如柔性电路或印刷电路板的电路层的更安全的附接到喷射堆叠子组件。

3. 发明授权

US08567924B2 Patterned conductive array and self leveling epoxy 有权
标题翻译：图案导电阵列和自流平环氧树脂
公开(公告)号：US08567924B2
公开(公告)日：2013-10-29
申请号：US13081584
申请日：2011-04-07
申请人： Bradley J. Gerner , Bryan R. Dolan , John R. Andrews , Peter J. Nystrom
发明人： Bradley J. Gerner , Bryan R. Dolan , John R. Andrews , Peter J. Nystrom
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1631 , B41J2/1634 , B41J2/1646
摘要： A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.
摘要翻译：形成喷墨打印头的方法可以包括将多个压电元件附接到隔膜，在隔膜上分配间隙层，将多个导电元件电耦合到多个压电元件，以及固化间隙层。间隙层内的多个电隔离导电颗粒将多个导电元件电耦合到多个压电元件。导电粒子可以均匀地分布在整个间隙层电介质的整体中，或者它们可以定位在每个压电元件的顶表面上，并插入在多个压电元件和多个导电元件之间。导电元件可以是柔性电路或印刷电路板的一部分。

4. 发明授权

US08556611B2 Method for interstitial polymer planarization using a flexible flat plate 有权
标题翻译：使用柔性平板的间隙聚合物平面化方法
公开(公告)号：US08556611B2
公开(公告)日：2013-10-15
申请号：US13165785
申请日：2011-06-21
申请人： Bryan R. Dolan , Peter J. Nystrom , Gary D. Redding , Mark A. Cellura , John R. Andrews
发明人： Bryan R. Dolan , Peter J. Nystrom , Gary D. Redding , Mark A. Cellura , John R. Andrews
IPC分类号： B29C43/20
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14362
摘要： A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.
摘要翻译：一种用于形成具有电介质间隙层的喷墨打印头的方法和结构。可以使用连接到压机的柔性顶板来对未固化的介质间隙层施加压力。在将未固化的介质间隙层与柔性顶板接触并使用压机施加压力的同时固化未固化的介质间隙层。已经发现使用柔性顶板而不是刚性顶板在压电元件阵列上形成固化的间隙层，所述压电元件阵列具有更均匀或平坦的上表面。这样形成的间隙层可以减少处理时间，减少在使用期间喷墨打印头中的墨水通信的问题以及降低的制造成本。

5. 发明申请

US20130307903A1 METHOD FOR FLEX CIRCUIT BONDING WITHOUT SOLDER MASK FOR HIGH DENSITY ELECTRICAL INTERCONNECT 有权
标题翻译：用于高密度电气互连的无焊盘掩模的方法
公开(公告)号：US20130307903A1
公开(公告)日：2013-11-21
申请号：US13472734
申请日：2012-05-16
申请人： Bryan R. Dolan , Peter J. Nystrom
发明人： Bryan R. Dolan , Peter J. Nystrom
IPC分类号： B41J2/135 , B32B37/10 , B32B37/06 , B32B37/02
CPC分类号： B41J2/161 , B41J2/1623
摘要： In some aspects of the present application, a print head and a method of forming the print head are disclosed. The print head can include an array of jets formed in a jet stack; at least one ink reservoir operable to deliver ink to the jet stack; an actuator array arranged on the control circuitry formed into an actuator layer to cause the reservoir to deliver ink in response to signals from the control circuitry; a standoff adhesive layer arranged on the actuator layer, the standoff adhesive layer having an array of holes corresponding to the actuators; and a flex circuit layer having an array of bumped contacts pad corresponding to the array of holes of the standoff adhesive layer.
摘要翻译：在本申请的一些方面，公开了一种打印头和形成打印头的方法。打印头可以包括形成在喷射堆中的射流阵列; 至少一个墨水储存器，其可操作以将墨水输送到所述喷射叠层; 布置在所述控制电路上的致动器阵列，形成为致动器层，以响应于来自所述控制电路的信号使所述储存器输送墨水; 布置在所述致动器层上的支座粘合剂层，所述支座粘合剂层具有与所述致动器相对应的孔阵列; 以及柔性电路层，其具有对应于支座粘合剂层的孔的阵列的凸起接触垫阵列。

6. 发明申请

US20130100212A1 Process for Adding Thermoset Layer to Piezoelectric Printhead 有权
标题翻译：将热固性层添加到压电打印头的工艺
公开(公告)号：US20130100212A1
公开(公告)日：2013-04-25
申请号：US13279778
申请日：2011-10-24
申请人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
发明人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
IPC分类号： B41J2/045 , B23P17/00
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634
摘要： Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.
摘要翻译：公开了一种用于制备喷墨打印头的方法，其包括：（a）提供具有多个压电换能器的隔膜板，（b）将具有填充接头的电路板与压电换能器对准并将电路板临时附接到压电换能器，从而形成在隔膜板，压电换能器和电路板之间具有间隙的层叠结构 ; （c）通过填充接头施加热固性聚合物并允许其通过毛细管作用填充间隙空间; 和（d）固化热固性聚合物以形成间隙聚合物层。

7. 发明授权

US08182069B2 Method for modular arrangement of a silicon based array and modular silicon based array 有权
标题翻译：硅基阵列和模块化硅基阵列的模块化布置方法
公开(公告)号：US08182069B2
公开(公告)日：2012-05-22
申请号：US13246170
申请日：2011-09-27
申请人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
发明人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要翻译：一种硅基模块，包括：基板; 第一芯片组件，其固定到所述基板，所述第一芯片组件包括第一硅芯片和具有电路的第一驱动器芯片; 以及固定到所述基板的第二芯片组件，所述第二芯片组件包括第二硅芯片和具有电路的第二驱动器芯片。第一和第二芯片组件的部分在基板的纵向方向上排列; 并且所述第一和第二硅芯片的部分在与所述纵向正交的宽度方向上排列。硅基模块的形成方法。

8. 发明授权

US08857021B2 Laser welded bonding pads for piezoelectric print heads 有权
标题翻译：用于压电打印头的激光焊接焊盘
公开(公告)号：US08857021B2
公开(公告)日：2014-10-14
申请号：US13524791
申请日：2012-06-15
申请人： Bradley James Gerner , Peter J. Nystrom , Bryan R. Dolan
发明人： Bradley James Gerner , Peter J. Nystrom , Bryan R. Dolan
IPC分类号： B41J2/16 , H05K3/10 , B41J2/14 , B23K26/22
CPC分类号： B23K26/22 , B41J2/14233 , B41J2/14274 , B41J2/1607 , B41J2/161 , B41J2/1621 , B41J2/1623 , B41J2/1634 , H05K3/103 , Y10T29/42
摘要： An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.
摘要翻译：可以使用激光来形成喷墨打印头，以熔化介于压电致动器和电路层凸起之间的镀层。可以在电路层凸块，压电致动器或两者上形成镀层，并且使用由激光器输出的激光束来熔化镀层以提供激光焊接。在另一个实施例中，电路层凸起或迹线本身用作镀层，其使用激光熔化以提供激光焊接。

9. 发明申请

US20130147881A1 POLYMER FILM AS AN INTERSTITIAL FILL FOR PZT PRINTHEAD FABRICATION 有权
标题翻译：聚合物膜作为PZT PRINTHEAD制造的间歇填充
公开(公告)号：US20130147881A1
公开(公告)日：2013-06-13
申请号：US13323867
申请日：2011-12-13
申请人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
发明人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
IPC分类号： B41J2/045 , H01L41/22
CPC分类号： B41J2/14233 , B41J2/1603 , B41J2/1623 , B41J2002/14491 , Y10T29/42
摘要： A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.
摘要翻译：用于喷墨打印头的方法和结构，以及包括喷墨打印头的打印机。打印头可以包括作为膜间隔件的聚合物，其将诸如印刷电路板或柔性电路的电互连与打印头隔膜分离，使得膜间隔件插入在电互连和隔膜之间。在一个实施例中，压电致动器不与膜间隔件接触。用于形成打印头的方法的实施例可以具有比一些其它工艺要求更少的制造工具的减少的处理阶段。所得到的打印头和打印机的实施例可以具有比一些其它打印头和打印机更少的结构部件。

10. 发明申请

US20130061469A1 IN SITU FLEXIBLE CIRCUIT EMBOSSING TO FORM AN ELECTRICAL INTERCONNECT 有权
标题翻译：在现场灵活电路中形成电气互连
公开(公告)号：US20130061469A1
公开(公告)日：2013-03-14
申请号：US13232465
申请日：2011-09-14
申请人： Bryan R. Dolan , Peter J. Nystrom
发明人： Bryan R. Dolan , Peter J. Nystrom
IPC分类号： H05K3/36
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623
摘要： A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.
摘要翻译：一种形成诸如打印头或打印机的结构的方法，其包括具有多个变形（即成型，成形或压花）导电柔性印刷电路（柔性电路）焊盘）的柔性电路的打印头。多个柔性电路板可以与喷墨打印头的多个压电元件对准。在诸如叠层压机的压机中，可以施加压力以使多个柔性电路板变形，并且在多个柔性电路板和多个压电元件之间建立电接触。在压制操作过程中原位地形成多个柔性电路板可以通过消除在制造或形成柔性电路期间执行的单独的压花阶段来降低成本。

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