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1. 发明授权

US08094451B2 Onboard computer equipped with a stand-alone aeraulic cooling device 有权
标题翻译：机载电脑配备独立的卫浴冷却装置
公开(公告)号：US08094451B2
公开(公告)日：2012-01-10
申请号：US12535608
申请日：2009-08-04
申请人： Bruno Bellin , Gerard Nemoz , Serge Bernadac , Jean-Michel Civadier
发明人： Bruno Bellin , Gerard Nemoz , Serge Bernadac , Jean-Michel Civadier
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： G06F1/20 , H05K7/20581
摘要： The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).
摘要翻译：本发明提出一种装备有独立的水槽冷却装置的车载计算机。其主要优点是，通过提供将冷空气流（FA）布置到电子模块（E1，E2）的热点的管道（N1，N2，N3），从而提高了机载计算机的水蚀冷却的有效性，E3，E4）。

2. 发明申请

US20100302727A1 Onboard Computer Equipped with a Stand-Alone Aeraulic Cooling Device 有权
标题翻译：车载计算机配备独立的Aululic冷却装置
公开(公告)号：US20100302727A1
公开(公告)日：2010-12-02
申请号：US12535608
申请日：2009-08-04
申请人： Bruno Bellin , Gerard Nemoz , Serge Bernadac , Jean-Michel Civadier
发明人： Bruno Bellin , Gerard Nemoz , Serge Bernadac , Jean-Michel Civadier
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , H05K7/20581
摘要： The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device.Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).
摘要翻译：本发明提出一种装备有独立的水槽冷却装置的车载计算机。其主要优点是，通过提供将冷空气流（FA）布置到电子模块（E1，E2）的热点的管道（N1，N2，N3），从而提高了机载计算机的水蚀冷却的有效性，E3，E4）。

3. 发明授权

US07859837B2 Modular electronic device operating in difficult environments 有权
标题翻译：模块化电子设备在恶劣环境中工作
公开(公告)号：US07859837B2
公开(公告)日：2010-12-28
申请号：US11915372
申请日：2006-04-24
申请人： Gerard Nemoz , Olivier Leborgne , Serge Bernadac
发明人： Gerard Nemoz , Olivier Leborgne , Serge Bernadac
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components.
摘要翻译：本发明涉及一种在困难环境中工作的电子设备。电子设备包括至少一个支撑散热电子部件的印刷电路板，散热器，第一侧与印刷电路板的第一面上的电子部件接触，第二侧被设计成通过对流排出热量，其特征在于它还包括限定通道的盖子，冷却剂循环在其中以确保对流，盖子连接到散热器和印刷电路板，并且通道防止冷却剂来与电子元件接触。

4. 发明申请

US20090213543A1 MODULAR ELECTRONIC DEVICE OPERATING IN DIFFICULT ENVIRONMENTS 有权
标题翻译：模块化电子设备在恶劣环境中运行
公开(公告)号：US20090213543A1
公开(公告)日：2009-08-27
申请号：US11915372
申请日：2006-04-24
申请人： Gerard Nemoz , Olivier Leborgne , Serge Bernadac
发明人： Gerard Nemoz , Olivier Leborgne , Serge Bernadac
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components.
摘要翻译：本发明涉及一种在困难环境中工作的电子设备。电子设备包括至少一个支撑散热电子部件的印刷电路板，散热器，第一侧与印刷电路板的第一面上的电子部件接触，第二侧被设计成通过对流排出热量，其特征在于它还包括限定通道的盖子，冷却剂循环在其中以确保对流，盖子连接到散热器和印刷电路板，并且通道防止冷却剂来与电子元件接触。

5. 发明申请

US20090161721A1 METHOD FOR TESTING A HEAT PIPE AND CORRESPONDING TEST DEVICE 有权
标题翻译：测试热管和相关测试装置的方法
公开(公告)号：US20090161721A1
公开(公告)日：2009-06-25
申请号：US12334742
申请日：2008-12-15
申请人： Marc Gatti , Gerard Nemoz , Bruno Bellin , Christian Pitot
发明人： Marc Gatti , Gerard Nemoz , Bruno Bellin , Christian Pitot
IPC分类号： G01N25/18
CPC分类号： G01K17/00 , F28F2200/005 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ΔP of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.
摘要翻译：通过在交换器300处以热的形式提供能量，并且通过在交换器300处以热的形式提供能量，并且通过在热交换器300中以热的形式提供能量，通过在相反方向上使用热管来测试用于将由电子部件101散发的热量传递到热交换器300 测量从交换器到电子部件的热量的传播时间ΔP。应用于车载电脑的热管测试。

6. 发明授权

US08322917B2 Method for testing a heat pipe and corresponding test device 有权
标题翻译：热管及相应试验装置的测试方法
公开(公告)号：US08322917B2
公开(公告)日：2012-12-04
申请号：US12334742
申请日：2008-12-15
申请人： Marc Gatti , Gerard Nemoz , Bruno Bellin , Christian Pitot
发明人： Marc Gatti , Gerard Nemoz , Bruno Bellin , Christian Pitot
IPC分类号： G01K1/16 , G01K25/00
CPC分类号： G01K17/00 , F28F2200/005 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ΔP of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.
摘要翻译：通过在交换器300处以热的形式提供能量，并且通过在交换器300处以热的形式提供能量，并且通过在热交换器300中以热的形式提供能量，通过在相反方向上使用热管来测试用于将由电子部件101散发的热量传递到热交换器300 测量从交换器到电子部件的热量的传播时间＆Dgr; P。应用于车载电脑的热管测试。

7. 发明授权

US08542485B2 Electronic equipment housing cooled by natural and forced ventilation 有权
标题翻译：电子设备由天然和强制通风冷却
公开(公告)号：US08542485B2
公开(公告)日：2013-09-24
申请号：US12519639
申请日：2007-12-11
申请人： Gerard Nemoz , Bruno Bellin , Pilippe Bieth
发明人： Gerard Nemoz , Bruno Bellin , Pilippe Bieth
IPC分类号： H05K7/20
CPC分类号： H05K7/20672
摘要： This housing comprises rackable electronic equipment modules (2) housed in a bay. A module (2) has both internal (12, 13) and external (45) thermal radiators cooled by natural and forced ventilation. The internal thermal radiators (12, 13) are placed in thermal contact with the hot spots of the electronic equipment placed in the module (2) via hear collectors (40, 41) connected by heat pipe (42, 43) to the external thermal radiators (45) arranged outside on the edge (44) of the module (2). The internal thermal radiators (12, 13) are sized to be sufficient to cool the electric equipment when the forced ventilation is functioning normally. The external thermal radiators (45) are sized to complement the cooling provided by the internal radiators (12, 13) should the forced ventilation be lost.
摘要翻译：该壳体包括容纳在托架中的可架式电子设备模块（2）。模块（2）具有由天然和强制通风冷却的内部（12,13）和外部（45）散热器。内部散热器（12,13）通过由热管（42,43）连接到外部热量的收集器（40,41）与放置在模块（2）中的电子设备的热点热接触。散热器（45）布置在模块（2）的边缘（44）的外侧。当强制通风正常工作时，内部散热器（12,13）的尺寸应足以冷却电气设备。外部散热器（45）的大小适合于强制通风损失时内部散热器（12,13）提供的冷却。

8. 发明授权

US07869209B2 Electronic rack combining natural convection and forced air circulation for its cooling 有权
标题翻译：电子机架结合自然对流和强制空气循环进行冷却
公开(公告)号：US07869209B2
公开(公告)日：2011-01-11
申请号：US12438417
申请日：2007-08-27
申请人： Gerard Nemoz , Bruno Bellin
发明人： Gerard Nemoz , Bruno Bellin
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.
摘要翻译：这个机架（1）容纳可容纳的电子齿轮模块（2,3），由于底部（10）和顶部（11）墙壁上提供的通风孔（20,21），通过内部的冷却，强制空气冷却通过连接到强制空气循环管道（37）的配电箱（31）的介质供给压力空气的空气分配斜面（30）。对于强制空气使用内部分配斜面，可以产生脉冲空气循环，只对通过自然对流获得的空气循环提供轻微的障碍。与通常的配置相比，这样可以在强制通风失效的情况下降低设备达到的工作温度。

9. 发明申请

US20100008025A1 ELECTRONIC RACK COMBINING NATURAL CONVECTION AND FORCED AIR CIRCULATION FOR ITS COOLING 有权
标题翻译：电子机架结合自然对流和强制空气循环进行冷却
公开(公告)号：US20100008025A1
公开(公告)日：2010-01-14
申请号：US12438417
申请日：2007-08-27
申请人： Gerard Nemoz , Bruno Bellin
发明人： Gerard Nemoz , Bruno Bellin
IPC分类号： H02B1/56
CPC分类号： H05K7/20563
摘要： This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.
摘要翻译：这个机架（1）容纳可容纳的电子齿轮模块（2,3），由于底部（10）和顶部（11）墙壁上提供的通风孔（20,21），通过内部的冷却，强制空气冷却通过连接到强制空气循环管道（37）的配电箱（31）的介质供给压力空气的空气分配斜面（30）。对于强制空气使用内部分配斜面，可以产生脉冲空气循环，只对通过自然对流获得的空气循环提供轻微的障碍。与通常的配置相比，这样可以在强制通风失效的情况下降低设备达到的工作温度。

10. 发明授权

US5396401A Modular printed circuit board holder structure, capable of engaging, in drawer-like fashion, in a rack of an electronic installation 失效
标题翻译：模块化的印刷电路板支架结构，能够以抽屉式的方式与电子装置的机架接合
公开(公告)号：US5396401A
公开(公告)日：1995-03-07
申请号：US87407
申请日：1993-07-08
申请人： Gerard Nemoz
发明人： Gerard Nemoz
IPC分类号： H05K7/14 , H05K7/20
CPC分类号： H05K7/1461
摘要： The modular structure embodying the invention comprises at least one frame, preferably manufactured in molded material, on which a printed circuit board is attached and whose rear vertical member has at least one indentation in which a group of connection elements is engaged, the frame comprising two lateral flanks equipped with attachment means to each of which can be attached either a covering plate or a second frame identical to the first one. The invention notably enables the connections between the printed circuit boards and the output connector of the structure to be reduced to a single level.
摘要翻译：体现本发明的模块化结构包括至少一个框架，优选以模制材料制成，其上安装有印刷电路板，并且其后垂直构件具有至少一个连接元件组合在一起的凹陷，该框架包括两个具有装配有附接装置的侧腹部，每个连接装置可以附接与第一框架相同的盖板或第二框架。本发明特别地使得印刷电路板和结构的输出连接器之间的连接可以降低到单一水平。

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