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    • 7. 发明授权
    • Heatsink with periodically patterned baseplate structure
    • 散热片与周期性图案基板结构
    • US07848108B1
    • 2010-12-07
    • US12536655
    • 2009-08-06
    • Bruce R. ArchambeaultEric N. ChikandoSamuel R. ConnorJohn S. Maas
    • Bruce R. ArchambeaultEric N. ChikandoSamuel R. ConnorJohn S. Maas
    • H05K7/20
    • H01L23/3677H01L23/467H01L23/552H01L2924/0002H01L2924/00
    • A heatsink including an electromagnetic bandgap structure reduces electromagnetic interference caused by an integrated circuit in an electronic device. One embodiment provides a heatsink having a base with an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches are interconnected by a plurality of branches. Each branch connects adjacent patches and has a width in the reference plane of less than a width of each adjacent patch. A plurality of thermally conductive cooling fins coupled to a surface of the base and extend normal to the reference plane. The cooling fins may be formed of a thermally-conductive, electrically non-conductive material or may be coupled to the base by a thermally-conductive, electrically non-conductive material. The periodically patterned structure of the base, together with a solid metal layer of a circuit board, form an electromagnetic bandgap structure that reduces certain frequencies of electromagnetic noise caused by the integrated circuit.
    • 包括电磁带隙结构的散热片减少了由电子设备中的集成电路引起的电磁干扰。 一个实施例提供一种散热器,其具有基底,该基底具有导电的导热贴片阵列,该贴片在参考平面的两个维度上间隔开并且具有垂直于参考平面的厚度。 贴片通过多个分支相互连接。 每个分支连接相邻的贴片,并且在参考平面中的宽度小于每个相邻贴片的宽度。 耦合到基座的表面并且垂直于参考平面延伸的多个导热冷却翅片。 散热片可以由导热的,不导电的材料形成,或者可以通过导热的非导电材料与基底相连。 基极的周期性图案化结构与电路板的固体金属层一起形成电磁带隙结构,其减小由集成电路引起的某些电磁噪声频率。