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1. 发明申请

US20210010656A1 LIGHT-EMITTING DEVICE WITH REFLECTIVE CERAMIC SUBSTRATE 有权
公开(公告)号：US20210010656A1
公开(公告)日：2021-01-14
申请号：US16879498
申请日：2020-05-20
申请人： BRIDGELUX, INC.
发明人： Jesus DEL CASTILLO , Scott WEST , Vladimir ODNOBLYUDOV
IPC分类号： F21V7/00 , F21V23/00 , F21V29/503 , F21K9/64 , F21K9/60 , F21V9/32 , F21V13/08
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

2. 发明申请

US20150276172A1 LIGHT-EMITTING DEVICE WITH REFLECTIVE CERAMIC SUBSTRATE 审中-公开
标题翻译：具有反射性陶瓷基板的发光装置
公开(公告)号：US20150276172A1
公开(公告)日：2015-10-01
申请号：US14231657
申请日：2014-03-31
申请人： Bridgelux, Inc.
发明人： Jesus DEL CASTILLO , Scott WEST , Vladimir ODNOBLYUDOV
IPC分类号： F21V7/00 , F21V29/503 , F21K99/00 , F21V9/16 , F21V23/00
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.
摘要翻译：发光装置可以包括具有反射部件的陶瓷基板，陶瓷基板上的发光二极管和发光二极管上的光转换材料。照明系统可以包括具有反射部件的陶瓷基板，串联连接在一起的多个发光二极管，其中多个发光二极管在陶瓷基板上，以及在多个光上的光转换材料发光二极管。陶瓷基板可以在发光二极管和铝载体之间提供电绝缘。陶瓷基板可以在发光二极管和铝载体之间提供导热性。反射组分可以包括氧化锆。陶瓷基板可以包括氧化铝和/或氮化铝。光转换材料可以包括磷光体。发光二极管可以具有外延二极管结构。

3. 发明申请

US20220262991A1 LED ARRAY PACKAGE 有权
公开(公告)号：US20220262991A1
公开(公告)日：2022-08-18
申请号：US17735362
申请日：2022-05-03
申请人： Bridgelux, Inc.
发明人： Vladimir ODNOBLYUDOV , Scott WEST , Cem BASCERI , Zhengqing GAN
IPC分类号： H01L33/56 , H01L33/46
摘要： Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

4. 发明申请

US20210372590A1 LIGHT-EMITTING DEVICE WITH REFLECTIVE CERAMIC SUBSTRATE 有权
公开(公告)号：US20210372590A1
公开(公告)日：2021-12-02
申请号：US17346966
申请日：2021-06-14
申请人： BRIDGELUX, INC.
发明人： Jesus DEL CASTILLO , Scott WEST , Vladimir ODNOBLYUDOV
IPC分类号： F21V7/00 , F21V23/00 , F21V29/503 , F21K9/64 , F21K9/60 , F21V9/32 , F21V13/08
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

5. 发明申请

US20210226104A1 LED ARRAY PACKAGE 有权
公开(公告)号：US20210226104A1
公开(公告)日：2021-07-22
申请号：US17132325
申请日：2020-12-23
申请人： BRIDGELUX, INC.
发明人： Vladimir ODNOBLYUDOV , Scott WEST , Cem BASCERI , Zhengqing GAN
IPC分类号： H01L33/56 , H01L33/46
摘要： Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

6. 发明公开

US20240097084A1 LED ARRAY PACKAGE 审中-公开
公开(公告)号：US20240097084A1
公开(公告)日：2024-03-21
申请号：US18525084
申请日：2023-11-30
申请人： Bridgelux, Inc.
发明人： Vladimir ODNOBLYUDOV , Scott WEST , Cem BASCERI , Zhengqing GAN
IPC分类号： H01L33/56 , H01L33/46
CPC分类号： H01L33/56 , H01L33/46
摘要： Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

7. 发明公开

US20230280015A1 OPTICS FOR CHIP-ON-BOARD ROAD AND AREA LIGHTING 审中-公开
公开(公告)号：US20230280015A1
公开(公告)日：2023-09-07
申请号：US18120288
申请日：2023-03-10
申请人： Bridgelux, Inc.
发明人： Xiaolu CHEN , Wenhui Zhang , Scott WEST
IPC分类号： F21V7/00 , F21S8/08 , F21V5/04 , F21V5/08 , G02B19/00 , F21V5/10
CPC分类号： F21V7/0091 , F21S8/086 , F21V5/04 , F21V5/08 , G02B19/0061 , F21V5/10 , F21V7/0066 , F21W2131/103
摘要： A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.

8. 发明公开

US20230299241A1 DIE EMITTING WHITE LIGHT 审中-公开
公开(公告)号：US20230299241A1
公开(公告)日：2023-09-21
申请号：US18125066
申请日：2023-03-22
申请人： Bridgelux, Inc.
发明人： Babak IMANGHOLI , Khashayar Phil OLIAEI , Scott WEST
IPC分类号： H01L33/50 , H01L33/00 , H01L33/56 , H01L33/62
CPC分类号： H01L33/502 , H01L33/50 , H01L33/0095 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

9. 发明申请

US20190273192A1 LED ARRAY PACKAGE 审中-公开
公开(公告)号：US20190273192A1
公开(公告)日：2019-09-05
申请号：US16267958
申请日：2019-02-05
申请人： BRIDGELUX, INC.
发明人： Vladimir ODNOBLYUDOV , Scott WEST , Cem BASCERI , Zhengqing GAN
IPC分类号： H01L33/56 , H01L33/46
摘要： Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

10. 发明申请

US20160035950A1 LED ARRAY PACKAGE 审中-公开
标题翻译： LED阵列包装
公开(公告)号：US20160035950A1
公开(公告)日：2016-02-04
申请号：US14449142
申请日：2014-07-31
申请人： BRIDGELUX, INC.
发明人： Vladimir ODNOBLYUDOV , Scott WEST , Cem BASCERI , Zhengghng GAN
IPC分类号： H01L33/60 , H01L33/50 , F21V23/00 , H01L33/32
CPC分类号： H01L33/56 , H01L33/46
摘要： Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
摘要翻译：发光装置的各个方面包括基板。发光装置的各个方面包括布置在基板上的发光模具。发光模具包括一个或多个侧壁。发光装置的各个方面包括沿着发光管芯的一个或多个侧壁延伸的反射管芯附接材料。

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