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1. 发明申请

US20110299244A1 COOLING MEMBER FOR HEAT CONTAINING DEVICE 有权
标题翻译：用于加热装置的冷却部件
公开(公告)号：US20110299244A1
公开(公告)日：2011-12-08
申请号：US12796382
申请日：2010-06-08
申请人： Ercan Mehmet Dede , Brian Joseph Robert , Serdar H. Yonak
发明人： Ercan Mehmet Dede , Brian Joseph Robert , Serdar H. Yonak
IPC分类号： H05K7/20 , H01L29/739 , F28F7/00
CPC分类号： H05K7/20254 , F28F3/046 , F28F13/08 , F28F2215/04 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.
摘要翻译：公开了一种用于从含热装置中取出热量的冷却构件。冷却构件可以具有壳体，其具有流体入口，流体出口和至少部分地位于其中的多个不规则形状的翅片。此外，多个不规则形状和分层的分支流体路径可以位于多个翅片与壳体之间和/或多个翅片可以与加热容器物理接触。

2. 发明授权

US08804339B2 Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same 有权
标题翻译：电力电子组件，绝缘金属基板组件和结合其的车辆
公开(公告)号：US08804339B2
公开(公告)日：2014-08-12
申请号：US13036447
申请日：2011-02-28
申请人： Brian Joseph Robert
发明人： Brian Joseph Robert
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H01L23/053 , H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/12042 , H01L2924/1304 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H05K1/0271 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.
摘要翻译：电力电子组件包括半导体器件，绝缘金属基底和冷却结构。绝缘金属基板包括位于第一和第二金属层之间的电介质层，以及延伸穿过第一金属层，第二金属层，介电层或其组合的多个应力消除通孔。半导体器件热耦合到第一金属层，并且多个应力释放通孔位于半导体器件周围。冷却结构直接接合到绝缘金属基板的第二金属层。还公开了绝缘金属基板组件。绝缘金属基板包括延伸穿过第一金属层，第二金属层和电介质层的多个应力消除穿透特征。还公开了具有应力消除通过特征的电力电子组件的车辆。

3. 发明授权

US08654541B2 Three-dimensional power electronics packages 有权
标题翻译：三维电力电子封装
公开(公告)号：US08654541B2
公开(公告)日：2014-02-18
申请号：US13070990
申请日：2011-03-24
申请人： Brian Joseph Robert , Ercan Mehmet Dede , Serdar Hakki Yonak
发明人： Brian Joseph Robert , Ercan Mehmet Dede , Serdar Hakki Yonak
IPC分类号： H05K7/00
CPC分类号： H01L23/3735 , H01L23/49827 , H01L23/49833 , H01L23/49844 , H01L25/074 , H01L25/16 , H01L2224/32225 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane. The second power electronics device is electrically coupled to the second conductive layer such that the second power electronics device is positioned in a second plane parallel to the first plane.
摘要翻译：公开了三维电力电子封装。在一个实施例中，三维电力电子封装包括金属化基板组件，第一电力电子设备和第二电力电子设备。金属化衬底组件包括绝缘电介质衬底，其具有通过绝缘电介质衬底完全延伸的功率，绝缘电介质衬底的第一表面上的第一导电层和绝缘电介质衬底的第二表面上的第二导电层。第一导电层通过电源通孔电耦合到第二导电层。第一电力电子设备电耦合到第一导电层，使得第一电力电子设备位于第一平面中。第二电力电子设备电耦合到第二导电层，使得第二电力电子设备被定位在平行于第一平面的第二平面中。

4. 发明授权

US08466660B2 Wireless energy transfer antennas and energy charging systems 有权
标题翻译：无线能量传输天线和能量充电系统
公开(公告)号：US08466660B2
公开(公告)日：2013-06-18
申请号：US12613791
申请日：2009-11-06
申请人： Hideo Iizuka , Jae Seung Lee , Paul Donald Schmalenberg , Brian Joseph Robert
发明人： Hideo Iizuka , Jae Seung Lee , Paul Donald Schmalenberg , Brian Joseph Robert
IPC分类号： H02J7/00 , H04B5/00 , H04B1/38
CPC分类号： B60L11/182 , B60L11/1824 , H02J7/025 , H02J17/00 , H02J50/10 , H02J50/12 , H02J50/40 , H02J50/80 , H04B5/0037 , Y02T10/7005 , Y02T10/7072 , Y02T90/122 , Y02T90/14
摘要： A resonant wireless energy transfer system comprises first and second antennas made up of dual parallel wire helixes wherein the wires are terminated by short wires. Voltage controlled variable capacitors are connected into the antennas to permit progressive variation between folded dipole and normal dipole operating modes such that optimum energy transfer can be achieved between the antennas over a wide range of antenna separation distances. A vehicle battery charging system using the above-described antennas is provided including an installation which allows purchase of battery charging power by members of the general public. In-vehicle energy transfer for sensors, computers, cell phones and the like is also described.
摘要翻译：谐振无线能量传输系统包括由双平行线螺旋构成的第一和第二天线，其中线由短线端接。电压控制可变电容器连接到天线中以允许折叠偶极和正常偶极操作模式之间的逐渐变化，使得可以在宽范围的天线间隔距离之间在天线之间实现最佳能量传递。提供一种使用上述天线的车载电池充电系统，其包括允许一般公众购买电池充电电力的装置。还描述了用于传感器，计算机，蜂窝电话等的车载能量传递。

5. 发明授权

US08431445B2 Multi-component power structures and methods for forming the same 有权
标题翻译：多组件功率结构及其形成方法
公开(公告)号：US08431445B2
公开(公告)日：2013-04-30
申请号：US13150645
申请日：2011-06-01
申请人： Brian Joseph Robert
发明人： Brian Joseph Robert
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L23/3735 , H01L23/36 , H01L23/473 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29083 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32225 , H01L2224/37124 , H01L2224/37147 , H01L2224/40091 , H01L2224/40225 , H01L2224/40227 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48227 , H01L2224/48472 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83825 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45147 , H01L2924/01004 , H01L2924/00014
摘要： In one embodiment, a method for forming a multi-component power structure for use in electrically propelled vehicles may include constraining a parent material system between a power component and a thermal device. The parent material system may include a low temperature material having a relatively low melting point and a high temperature material having a relatively high melting point. The relatively low melting point may be less than the relatively high melting point. The parent material system can be heated to a melting temperature greater than the relatively low melting point and lower than the relatively high melting point to diffuse the low temperature material into the high temperature material. The parent material system can be solidified to form a transient liquid phase bond that is electrically and thermally conductive.
摘要翻译：在一个实施例中，用于形成用于电动推进车辆的多部件动力结构的方法可以包括限制功率部件和热装置之间的母材系统。母材体系可以包括具有较低熔点的低温材料和具有较高熔点的高温材料。相对低的熔点可能低于较高的熔点。母材系统可以被加热到大于相对低熔点的熔点并且低于相对高的熔点，以将低温材料扩散到高温材料中。母体系统可以固化以形成导电和导热的瞬时液相。

6. 发明授权

US08243451B2 Cooling member for heat containing device 有权
标题翻译：用于含热装置的冷却构件
公开(公告)号：US08243451B2
公开(公告)日：2012-08-14
申请号：US12796382
申请日：2010-06-08
申请人： Ercan Mehmet Dede , Brian Joseph Robert , Serdar H. Yonak
发明人： Ercan Mehmet Dede , Brian Joseph Robert , Serdar H. Yonak
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H05K7/20254 , F28F3/046 , F28F13/08 , F28F2215/04 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.
摘要翻译：公开了一种用于从含热装置中取出热量的冷却构件。冷却构件可以具有壳体，其具有流体入口，流体出口和至少部分地位于其中的多个不规则形状的翅片。此外，多个不规则形状和分层的分支流体路径可以位于多个翅片与壳体之间和/或多个翅片可以与加热容器物理接触。

7. 发明申请

US20110168223A1 THERMOELECTRIC APPLICATION FOR WASTE HEAT RECOVERY FROM SEMICONDUCTOR DEVICES IN POWER ELECTRONICS SYSTEMS 有权
标题翻译：用于电力电子系统半导体器件废热回收的热电应用
公开(公告)号：US20110168223A1
公开(公告)日：2011-07-14
申请号：US12685380
申请日：2010-01-11
申请人： Ercan Mehmet DEDE , Brian Joseph Robert
发明人： Ercan Mehmet DEDE , Brian Joseph Robert
IPC分类号： H01L35/30
CPC分类号： H01L35/30 , F28D15/0233 , F28D15/0275 , H01L23/38 , H01L23/427 , H01L23/473 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05599 , H01L2224/05611 , H01L2224/05644 , H01L2224/45014 , H01L2224/45111 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4903 , H01L2224/85399 , H01L2224/85801 , H01L2224/8584 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2224/78 , H01L2924/00 , H01L2924/013 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： In a power electronics system of a next generation vehicle, a power module is provided including a thermoelectric device which is provided in a thermally conductive path between a power device and a cooling plate such that the thermoelectric device creates useful electric power from the waste heat of the power device.
摘要翻译：在下一代车辆的电力电子系统中，提供了功率模块，其包括热电装置，该热电装置设置在功率器件和冷却板之间的导热路径中，使得热电装置从废热中产生有用的电力电源设备。

8. 发明授权

US08552283B2 Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems 有权
标题翻译：用于电力电子系统半导体器件废热回收的热电应用
公开(公告)号：US08552283B2
公开(公告)日：2013-10-08
申请号：US12685380
申请日：2010-01-11
申请人： Ercan Mehmet Dede , Brian Joseph Robert
发明人： Ercan Mehmet Dede , Brian Joseph Robert
IPC分类号： H01L35/30 , H01L35/34 , H01L35/28 , H01L35/02 , H01L23/34 , H01L23/38 , H01L23/427
CPC分类号： H01L35/30 , F28D15/0233 , F28D15/0275 , H01L23/38 , H01L23/427 , H01L23/473 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05599 , H01L2224/05611 , H01L2224/05644 , H01L2224/45014 , H01L2224/45111 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4903 , H01L2224/85399 , H01L2224/85801 , H01L2224/8584 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2224/78 , H01L2924/00 , H01L2924/013 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： In a power electronics system of a next generation vehicle, a power module is provided including a thermoelectric device which is provided in a thermally conductive path between a power device and a cooling plate such that the thermoelectric device creates useful electric power from the waste heat of the power device.
摘要翻译：在下一代车辆的电力电子系统中，提供了一种功率模块，其包括设置在功率器件和冷却板之间的导热路径中的热电器件，使得热电器件从废热中产生有用的电力电源设备。

9. 发明申请

US20120243192A1 THREE-DIMENSIONAL POWER ELECTRONICS PACKAGES 有权
标题翻译：三维功率电子封装
公开(公告)号：US20120243192A1
公开(公告)日：2012-09-27
申请号：US13070990
申请日：2011-03-24
申请人： Brian Joseph Robert , Ercan Mehmet Dede , Serdar Hakki Yonak
发明人： Brian Joseph Robert , Ercan Mehmet Dede , Serdar Hakki Yonak
IPC分类号： H05K7/04
CPC分类号： H01L23/3735 , H01L23/49827 , H01L23/49833 , H01L23/49844 , H01L25/074 , H01L25/16 , H01L2224/32225 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane. The second power electronics device is electrically coupled to the second conductive layer such that the second power electronics device is positioned in a second plane parallel to the first plane.
摘要翻译：公开了三维电力电子封装。在一个实施例中，三维电力电子封装包括金属化基板组件，第一电力电子设备和第二电力电子设备。金属化衬底组件包括绝缘电介质衬底，其具有通过绝缘电介质衬底完全延伸的功率，绝缘电介质衬底的第一表面上的第一导电层和绝缘电介质衬底的第二表面上的第二导电层。第一导电层通过电源通孔电耦合到第二导电层。第一电力电子设备电耦合到第一导电层，使得第一电力电子设备位于第一平面中。第二电力电子设备电耦合到第二导电层，使得第二电力电子设备被定位在平行于第一平面的第二平面中。

10. 发明申请

US20120218714A1 POWER ELECTRONICS ASSEMBLIES, INSULATED METAL SUBSTRATE ASSEMBLIES, AND VEHICLES INCORPORATING THE SAME 有权
标题翻译：电力电子组件，绝缘金属基板组件，以及与其同时的车辆
公开(公告)号：US20120218714A1
公开(公告)日：2012-08-30
申请号：US13036447
申请日：2011-02-28
申请人： Brian Joseph Robert
发明人： Brian Joseph Robert
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H01L23/053 , H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/12042 , H01L2924/1304 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H05K1/0271 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.
摘要翻译：电力电子组件包括半导体器件，绝缘金属基底和冷却结构。绝缘金属基板包括位于第一和第二金属层之间的电介质层，以及延伸穿过第一金属层，第二金属层，介电层或其组合的多个应力消除通孔。半导体器件热耦合到第一金属层，并且多个应力释放通孔位于半导体器件周围。冷却结构直接接合到绝缘金属基板的第二金属层。还公开了绝缘金属基板组件。绝缘金属基板包括延伸穿过第一金属层，第二金属层和电介质层的多个应力消除穿透特征。还公开了具有应力消除通过特征的电力电子组件的车辆。

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