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    • 10. 发明授权
    • Apparatus for electrical and optical interconnection
    • 用于电气和光学互连的设备
    • US07660128B2
    • 2010-02-09
    • US10955876
    • 2004-09-30
    • Darren S. CrewsLee L. Xu
    • Darren S. CrewsLee L. Xu
    • H05K1/18
    • H05K1/182G02B6/42H01R12/714H01R12/722H01R13/6658H05K2201/10121H05K2201/10446
    • A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.
    • 电路封装包括具有限定在其中的切口部分的电路基板,电耦合到电路基板的互连和在切除部分内设置在电路基板之外的电连接到互连的有源电路部件。 光学电路包括引线框架和电耦合到引线框架的光学部件。 引线框架包括具有上表面和下表面的第一级的第一引线部分和低于第一级别的第二级别的电连接到第一引线部分的第二引线部分。 第一引线部分的下表面被布置成电连接到电路基板的表面。 第二引线部分包括上表面和下表面。 光学部件设置在第二引线部分的上表面上。