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1. 发明授权

US08616748B1 Portable computing device 有权
标题翻译：便携式计算设备
公开(公告)号：US08616748B1
公开(公告)日：2013-12-31
申请号：US13492701
申请日：2012-06-08
申请人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Bartley K. Andre , Jeremy Bataillou , Jay S Nigen , Matthew S. Theobald , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett
发明人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Bartley K. Andre , Jeremy Bataillou , Jay S Nigen , Matthew S. Theobald , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett
IPC分类号： F21V7/04
CPC分类号： G06F1/1613 , G06F1/1616 , G06F2200/1612 , Y10T29/49 , Y10T29/49002
摘要： The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.
摘要翻译：本申请描述了关于用于提供具有薄型材的轻便且耐用的便携式计算设备的系统和方法的各种实施例。便携式计算设备可以采用膝上型计算机的形式。膝上型计算机可以包括其上形成有集成支撑系统的单体顶部壳体，该集成支撑系统提供结构支撑，其通过顶部壳体分配施加的负载以防止翘曲和弯曲。

2. 发明授权

US08897002B2 Internal components of a portable computing device 有权
标题翻译：便携式计算设备的内部组件
公开(公告)号：US08897002B2
公开(公告)日：2014-11-25
申请号：US13492789
申请日：2012-06-08
申请人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
发明人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
IPC分类号： H01Q1/52
CPC分类号： G06F1/1616 , F16B37/061 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1681 , G06F1/169 , G06F1/1698 , G06F1/184 , G06F1/187 , G06F1/203 , H01Q1/2266
摘要： The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.
摘要翻译：本申请描述了用于为具有薄轮廓的便携式计算设备提供内部组件的系统和方法的各种实施例。更具体地，本申请描述了被配置成装配在相对薄的外壳内的内部部件。

3. 发明授权

US10228720B2 Internal components of a portable computing device 有权
公开(公告)号：US10228720B2
公开(公告)日：2019-03-12
申请号：US14406515
申请日：2012-06-08
申请人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
发明人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
IPC分类号： H01Q1/22 , G06F1/16 , G06F1/20 , G06F1/18 , F16B37/06
摘要： The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

4. 发明申请

US20160048163A1 INTERNAL COMPONENTS OF A PORTABLE COMPUTING DEVICE 审中-公开
公开(公告)号：US20160048163A1
公开(公告)日：2016-02-18
申请号：US14406515
申请日：2012-06-08
申请人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
发明人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
IPC分类号： G06F1/16
CPC分类号： G06F1/1616 , F16B37/061 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1681 , G06F1/169 , G06F1/1698 , G06F1/184 , G06F1/187 , G06F1/203 , H01Q1/2266
摘要： The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

5. 发明申请

US20130328741A1 INTERNAL COMPONENTS OF A PORTABLE COMPUTING DEVICE 有权
标题翻译：便携式计算设备的内部组件
公开(公告)号：US20130328741A1
公开(公告)日：2013-12-12
申请号：US13492789
申请日：2012-06-08
申请人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
发明人： Brett W. Degner , Christiaan A. Ligtenberg , Ron A. Hopkinson , Patrick Kessler , Bradley J. Hamel , Dinesh C. Mathew , John M. Brock , Keith J. Hendren , Peteris K. Augenbergs , Joss N. Giddings , Matthew C. Waldon , Cina Hazegh , Matthew P. Casebolt , Charles A. Schwalbach , Brandon S. Smith , William F. Leggett , Gavin J. Reid , Tom Tate , Gary Thomason
IPC分类号： G06F1/16 , H01Q1/52 , H05K7/00 , H05K1/11 , H01L27/146 , G06F1/20
CPC分类号： G06F1/1616 , F16B37/061 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1681 , G06F1/169 , G06F1/1698 , G06F1/184 , G06F1/187 , G06F1/203 , H01Q1/2266
摘要： The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.
摘要翻译：本申请描述了用于为具有薄轮廓的便携式计算设备提供内部组件的系统和方法的各种实施例。更具体地，本申请描述了被配置成装配在相对薄的外壳内的内部部件。

6. 发明授权

US08947874B2 Portable computing device with a housing secured by a magnetic element and related method 有权
标题翻译：具有通过磁性元件固定的外壳的便携式计算设备及相关方法
公开(公告)号：US08947874B2
公开(公告)日：2015-02-03
申请号：US13492725
申请日：2012-06-08
申请人： Bartley K. Andre , Brett W. Degner , Bradley J. Hamel , William F. Leggett , Christiaan A. Ligtenberg , Charles A. Schwalbach
发明人： Bartley K. Andre , Brett W. Degner , Bradley J. Hamel , William F. Leggett , Christiaan A. Ligtenberg , Charles A. Schwalbach
IPC分类号： H05K5/00 , H05K7/00 , G06F1/16
CPC分类号： H05K5/0004 , F16B2001/0035 , G06F1/1613 , G06F1/1616 , G06F1/1679 , H05K5/0086 , H05K5/0217 , H05K5/0226 , H05K5/03 , Y10T29/49826 , Y10T29/49947
摘要： Magnetic elements and attractors may be employed to secure a top case and a bottom case of a housing of a personal computing device. The magnetic elements may include a magnet that produces a magnetic field and a shunt. The shunt may direct the magnetic field through an opening to a pocket in which the magnet is received. Accordingly, flux leakage may be reduced and the bottom case may be secured to the top case. Magnetic elements and attractors may also be employed to secure a lid portion of the portable computing device to the housing thereof. These magnetic elements and attractors may be centered with respect to proximal and distal edges thereof.
摘要翻译：可以使用磁性元件和吸引器来固定个人计算设备的壳体的顶壳和底壳。磁性元件可以包括产生磁场和分路的磁体。分流器可以将磁场引导通过其中接收磁体的口袋的开口。因此，可以减少漏磁，并且底壳可以固定到顶壳。还可以使用磁性元件和吸引器来将便携式计算设备的盖部分固定到其壳体上。这些磁性元件和吸引器可以相对于其近端和远端边缘居中。

7. 发明授权

US08573911B2 Floating fasteners 有权
标题翻译：浮动紧固件
公开(公告)号：US08573911B2
公开(公告)日：2013-11-05
申请号：US13610822
申请日：2012-09-11
申请人： Brett W. Degner , Houtan R. Farahani , Ron A. Hopkinson , William F. Leggett
发明人： Brett W. Degner , Houtan R. Farahani , Ron A. Hopkinson , William F. Leggett
IPC分类号： F16B39/22
CPC分类号： H05K5/0217 , F16B5/025 , F16B19/02 , F16B33/002 , F16B33/02 , F16B37/042 , F16B37/043 , F16B37/048 , F16B39/02 , G06F1/1613
摘要： One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening associated with a first component, a second opening associated with a second component, a floating fastener, and a screw. The floating fastener is inserted into the first opening and/or second opening, and includes a threaded opening therein having a primary axis therethrough. The screw is inserted through first and/or second openings and into the threaded opening in the floating fastener. The screw and threaded opening combination is defined by contact between the screw and threaded opening about a thread surface that is substantially perpendicular to the primary axis, a screw thread return angle of 45 degrees or less, and a thread depth that is less than about triple the float between the major diameters of the screw and the threaded opening.
摘要翻译：可以使用一个或多个紧固件将部件固定在一起，例如在计算设备上的壳体部件。每个紧固件可以包括与第一部件相关联的第一开口，与第二部件相关联的第二开口，浮动紧固件和螺钉。浮动紧固件插入第一开口和/或第二开口中，并且包括其中具有主轴线的螺纹开口。螺钉通过第一和/或第二开口插入浮动紧固件中的螺纹孔中。螺钉和螺纹开口组合由螺钉和螺纹开口围绕基本上垂直于主轴线的螺纹表面，45度或更小的螺纹返回角度以及小于约三分之一的螺纹深度的接触限定在螺杆的大直径和螺纹开口之间的浮子。

8. 发明申请

US20130078052A1 FLOATING FASTNERS 有权
标题翻译：浮动快速
公开(公告)号：US20130078052A1
公开(公告)日：2013-03-28
申请号：US13610822
申请日：2012-09-11
申请人： BRETT W. DEGNER , Houtan R. Farahani , Ron A. Hopkinson , William F. Leggett
发明人： BRETT W. DEGNER , Houtan R. Farahani , Ron A. Hopkinson , William F. Leggett
IPC分类号： H05K5/02 , F16B39/02
CPC分类号： H05K5/0217 , F16B5/025 , F16B19/02 , F16B33/002 , F16B33/02 , F16B37/042 , F16B37/043 , F16B37/048 , F16B39/02 , G06F1/1613
摘要： One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening associated with a first component, a second opening associated with a second component, a floating fastener, and a screw. The floating fastener is inserted into the first opening and/or second opening, and includes a threaded opening therein having a primary axis therethrough. The screw is inserted through first and/or second openings and into the threaded opening in the floating fastener. The screw and threaded opening combination is defined by contact between the screw and threaded opening about a thread surface that is substantially perpendicular to the primary axis, a screw thread return angle of 45 degrees or less, and a thread depth that is less than about triple the float between the major diameters of the screw and the threaded opening.
摘要翻译：可以使用一个或多个紧固件将部件固定在一起，例如在计算设备上的壳体部件。每个紧固件可以包括与第一部件相关联的第一开口，与第二部件相关联的第二开口，浮动紧固件和螺钉。浮动紧固件插入第一开口和/或第二开口中，并且包括其中具有主轴线的螺纹开口。螺钉通过第一和/或第二开口插入浮动紧固件中的螺纹孔中。螺钉和螺纹开口组合由螺钉和螺纹开口围绕基本上垂直于主轴线的螺纹表面，45度或更小的螺纹返回角度以及小于约三分之一的螺纹深度的接触限定在螺杆的大直径和螺纹开口之间的浮子。

9. 发明申请

US20130329368A1 FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES 有权
标题翻译：电子设备中的紧固件和双厚度热阶段
公开(公告)号：US20130329368A1
公开(公告)日：2013-12-12
申请号：US13614996
申请日：2012-09-13
申请人： Brett W. Degner , Patrick Kessler , Charles A. Schwalbach , Richard H. Tan , William F. Leggett
发明人： Brett W. Degner , Patrick Kessler , Charles A. Schwalbach , Richard H. Tan , William F. Leggett
IPC分类号： H05K7/20 , F28F7/00 , F28D15/04
CPC分类号： G06F1/20 , F28D15/0233 , F28D15/0275 , G06F1/203
摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.
摘要翻译：所公开的实施例提供了促进电子设备中的热传递的系统。该系统包括被配置为将热量从电子设备中的发热部件导出的热管。该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。最后，该系统包括一组紧固件，其被配置为将热平台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。

10. 发明授权

US08976528B2 Fasteners and dual-thickness thermal stages in electronic devices 有权
标题翻译：电子设备中的紧固件和双层热层
公开(公告)号：US08976528B2
公开(公告)日：2015-03-10
申请号：US13614996
申请日：2012-09-13
申请人： Brett W. Degner , Patrick Kessler , Charles A. Schwalbach , Richard H. Tan , William F. Leggett
发明人： Brett W. Degner , Patrick Kessler , Charles A. Schwalbach , Richard H. Tan , William F. Leggett
IPC分类号： H05K7/20 , F28F7/00 , F28D15/04 , G01F1/20
CPC分类号： G06F1/20 , F28D15/0233 , F28D15/0275 , G06F1/203
摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.
摘要翻译：所公开的实施例提供了促进电子设备中的热传递的系统。该系统包括被配置为将热量从电子设备中的发热部件导出的热管。该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。最后，该系统包括一组紧固件，其被配置为将热台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。

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