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    • 8. 发明申请
    • PROGRAMMABLE MEMORY REPAIR SCHEME
    • 可编程存储器维修方案
    • US20110016352A1
    • 2011-01-20
    • US12922425
    • 2009-04-09
    • Adrian E. OngFan Ho
    • Adrian E. OngFan Ho
    • G06F11/16G06F11/00
    • G11C29/76G11C11/401G11C11/4085G11C29/027G11C29/04G11C29/12G11C29/4401G11C29/48G11C29/78G11C29/789G11C29/802G11C2229/743
    • The present disclosure provides semiconductor devices and methods, systems, and apparatus for testing and operating the same. A semiconductor memory device includes data storage elements and a repair circuit. The data storage elements include primary data storage elements and one or more redundant data storage elements, the primary data storage elements having respective addresses for memory access operations. The repair circuit is programmable by another semiconductor device separate from the memory device to recognize a malfunctioning address of the primary data storage elements and the programmed repair circuit is configured to reroute memory access from a primary data storage element having the recognized malfunctioning address to a corresponding redundant data storage element.
    • 本公开提供了用于测试和操作该半导体器件的方法,系统和装置。 半导体存储器件包括数据存储元件和修复电路。 数据存储元件包括主数据存储元件和一个或多个冗余数据存储元件,主数据存储元件具有用于存储器存取操作的相应地址。 修复电路由与存储器件分开的另一个半导体器件可编程,以识别主数据存储元件的故障地址,并且编程的修复电路被配置为将存储器访问从具有识别的故障地址的主数据存储元件重新路由到相应的 冗余数据存储元件。
    • 9. 发明授权
    • Configurable addressing for multiple chips in a package
    • 封装中多个芯片的可配置寻址
    • US06657914B1
    • 2003-12-02
    • US09909675
    • 2001-07-19
    • Adrian E. OngFan Ho
    • Adrian E. OngFan Ho
    • G11C800
    • G11C8/10
    • A first semiconductor chip is provided. The first semiconductor chip is operable to be incorporated along with at least a second semiconductor chip of the same type into an integrated circuit device within in a single package. The integrated circuit device has a common address path for the first and second semiconductor chips. The first semiconductor chip includes a configurable addressing circuit operable to be configured so that the first semiconductor chip responds to a predetermined range of addresses in the common address path of the integrated circuit device, to decode an address conveyed in the common address path of the integrated circuit device, and to generate a selection signal if the address conveyed in the common address path falls within the predetermined range of addresses.
    • 提供第一半导体芯片。 第一半导体芯片可操作地与至少一个相同类型的第二半导体芯片一起并入到单个封装内的集成电路器件中。 集成电路器件具有用于第一和第二半导体芯片的公共地址路径。 第一半导体芯片包括可配置寻址电路,其可操作以被配置为使得第一半导体芯片响应于集成电路器件的公共地址路径中的预定范围的地址,以对在集成电路器件的公共地址路径中传送的地址进行解码 并且如果在公共地址路径中传送的地址落在地址的预定范围内,则产生选择信号。