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1. 发明授权

US09013011B1 Stacked and staggered die MEMS package and method 有权
标题翻译：堆叠和交错模具MEMS封装和方法
公开(公告)号：US09013011B1
公开(公告)日：2015-04-21
申请号：US13046071
申请日：2011-03-11
申请人： Bob Shih-Wei Kuo , Brett Arnold Dunlap , Louis B. Troche, Jr. , Ahmer Syed , Russell Shumway
发明人： Bob Shih-Wei Kuo , Brett Arnold Dunlap , Louis B. Troche, Jr. , Ahmer Syed , Russell Shumway
IPC分类号： H01L23/49 , H01L27/04
CPC分类号： H01L27/04 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.
摘要翻译：交错的模具MEMS封装包括其中形成有转换器腔的衬底。 A转换器电子部件安装在转换器腔内。此外，MEMS电子部件以交错的管芯装置安装到基板和转换器电子部件两者。通过直接在转换器电子部件上交错MEMS电子部件，而不是将MEMS电子部件与转换器电子部件并排布置，使交错的模具MEMS封装的总封装宽度最小化。此外，通过将转换器电子部件定位在转换器腔内并将MEMS电子部件直接交错在转换器电子部件上，交错模具MEMS封装的总封装高度（有时称为Z高度）被最小化。

2. 发明授权

US08536663B1 Metal mesh lid MEMS package and method 有权
公开(公告)号：US08536663B1
公开(公告)日：2013-09-17
申请号：US13096359
申请日：2011-04-28
申请人： Bob Shih-Wei Kuo , Russell Shumway , Louis B. Troche, Jr.
发明人： Bob Shih-Wei Kuo , Russell Shumway , Louis B. Troche, Jr.
IPC分类号： H01L29/84
CPC分类号： B81B7/0032 , B81B7/0061 , B81B7/0064 , B81B7/0074 , B81B2201/0257 , B81B2201/0264 , B81B2207/09 , B81C1/00261 , B81C1/00269 , B81C2203/01 , B81C2203/0109 , B81C2203/0154 , B81C2203/0163 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/16151 , H01L2924/16152 , H01L2924/00
摘要： A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.

3. 发明授权

US09420378B1 Top port MEMS microphone package and method 有权
标题翻译：顶端口MEMS麦克风封装及方法
公开(公告)号：US09420378B1
公开(公告)日：2016-08-16
申请号：US12834682
申请日：2010-07-12
申请人： Ahmer Raza Syed , Bob Shih-Wei Kuo , Louis B. Troche, Jr.
发明人： Ahmer Raza Syed , Bob Shih-Wei Kuo , Louis B. Troche, Jr.
IPC分类号： H04R9/08 , H04R11/04
CPC分类号： H04R9/08 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H04R11/04 , H04R19/005 , H04R19/04 , H01L2924/00014
摘要： A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.
摘要翻译：顶端MEMS麦克风封装包括其中具有后体积扩展孔的衬底。 MEMS麦克风电子部件直接安装在背面体积扩张孔上方的基板上，使得MEMS麦克风电子部件的孔径与后扩张孔径流体连通。具有盖腔的盖子安装到基板上。后体积扩大孔将MEMS麦克风电子部件的孔耦合到盖腔。通过将盖腔与后体积扩大孔耦合到孔，所产生的背部体积基本上是整个顶端MEMS麦克风封装的尺寸。以这种方式，噪声与信号的比例被最小化，从而使顶端MEMS麦克风封装的灵敏度以及应用范围最大化。

4. 发明授权

US08618619B1 Top port with interposer MEMS microphone package and method 有权
标题翻译：顶端口带插入式MEMS麦克风封装及方法
公开(公告)号：US08618619B1
公开(公告)日：2013-12-31
申请号：US13016343
申请日：2011-01-28
申请人： Jeffrey Alan Miks , Louis B. Troche, Jr.
发明人： Jeffrey Alan Miks , Louis B. Troche, Jr.
IPC分类号： H01L27/14 , H01L21/00
CPC分类号： H04R19/04 , B81B7/0061 , B81B2201/0257 , H01L2224/32225 , H01L2224/48137 , H01L2224/73265 , H01L2924/16152 , H04R1/021 , H04R1/04 , H04R19/005
摘要： A top port MEMS package includes a substrate and an interposer mounted to the substrate. The interposer includes an interposer aperture and an interposer channel fluidly coupled to the interposer aperture. A MEMS electronic component is mounted to the interposer above the interposer aperture. A top port lid includes a top port and a chimney structure fluidly coupling to the top port to the interposer channel. A front volume including the top port, the flue, the interposer channel, and the interposer aperture is acoustically sealed from a relatively large back volume defined by a lid cavity of the top port lid. By acoustically sealing the front volume from the back volume and further by maximizing the back volume, the noise to signal ratio is minimized thus maximizing the sensitivity of top port MEMS microphone package as well as the range of applications.
摘要翻译：顶端MEMS封装包括衬底和安装到衬底的插入器。插入器包括插入器孔和流体耦合到插入器孔的插入器通道。将MEMS电子部件安装到插入器上方的插入器孔。顶部端口盖包括顶部端口和烟道结构，其流体地联接到顶部端口到插入器通道。包括顶部端口，烟道，插入器通道和插入器孔的前部容积与由顶部端口盖的盖腔限定的相对大的后部体积进行声学密封。通过从正面音量声学地密封前部音量并进一步通过最大化后部音量，噪声与信号的比例被最小化，从而最大化顶端MEMS麦克风包的灵敏度以及应用范围。

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