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1. 发明申请

US20070295099A1 APPARATUS FOR FORMING THERMAL FATIGUE CRACKS 失效
标题翻译：形成热疲劳裂纹的装置
公开(公告)号：US20070295099A1
公开(公告)日：2007-12-27
申请号：US11625706
申请日：2007-01-22
申请人： Bo-Young LEE , Duck Hee Ryu , Jae Seong Kim , Yong Kim , Dae Hwan An
发明人： Bo-Young LEE , Duck Hee Ryu , Jae Seong Kim , Yong Kim , Dae Hwan An
IPC分类号： G01N3/32
CPC分类号： G01N3/60 , G01N2203/0066 , G01N2203/0073 , G01N2203/027
摘要： Disclosed is an apparatus and method for forming thermal fatigue cracks in a test piece for performance demonstration of nondestructive testing. The apparatus for forming thermal fatigue cracks includes a heating unit, having a conductive member attached around the outer surface of a pipe test piece and an induction heating coil disposed adjacent to the conductive member; a cooling unit, having a cooling water pump for forcibly supplying cooling water to the inner surface of the pipe test piece from a cooling water storage source and a cooling water hose; and a control unit for controlling operation of the heating unit and the cooling unit. Accordingly, thermal fatigue cracks similar to actual thermal fatigue cracks occurring during the operation of nuclear power plants or processing industry equipment are formed in a test piece, thereby assuring effective performance demonstration of nondestructive testing.
摘要翻译：公开了一种用于在无损检测的性能演示中形成试验片中的热疲劳裂纹的装置和方法。用于形成热疲劳裂纹的装置包括加热单元，其具有附接在管道试件的外表面上的导电构件和邻近导电构件设置的感应加热线圈; 冷却单元，具有冷却水泵，用于从冷却水存储源和冷却水软管向管道试件的内表面强制供给冷却水; 以及用于控制加热单元和冷却单元的操作的控制单元。因此，在试验片中形成类似于在核电厂或加工工业设备运行期间发生的实际热疲劳裂纹的热疲劳裂纹，从而确保了非破坏性试验的有效性能演示。

2. 发明申请

US20210284367A1 SEAL PACKAGING MACHINE FOR FOOD CONTAINER 有权
公开(公告)号：US20210284367A1
公开(公告)日：2021-09-16
申请号：US16614398
申请日：2018-05-21
申请人： Bo-Young LEE
发明人： Bo-Young LEE
IPC分类号： B65B7/28 , B65B65/02
摘要： A seal-packaging machine for a food container is proposed. The seal-packaging machine includes: a tray for loading a food-carrying container into the seal-packaging machine configured to move stably forward/backward while engaging with a -shaped guide by a “”-shaped guide rail; a heater unit driving support shafts operating the heater unit upward/downward and a heater unit driving portion support plate connected thereto operating upward/downward by two roller bearings and two eccentric cams contacting the same; a motor fixedly provided on a bottom frame to drive upward/downward the heater unit driving support shafts and the heater unit driving portion support plate of a heater unit driving portion; and a heater unit evenly operating upward/downward while keeping in horizontal along the four heater unit driving support shafts provided on four sides. The seal-packaging machine prevents defects due to imbalance of the heater unit, thereby guaranteeing an accurate sealing operation with a film.

3. 发明申请

US20130059422A1 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 有权
公开(公告)号：US20130059422A1
公开(公告)日：2013-03-07
申请号：US13599844
申请日：2012-08-30
申请人： Bo-Young LEE , Jongwan CHOI , Myoungbum LEE
发明人： Bo-Young LEE , Jongwan CHOI , Myoungbum LEE
IPC分类号： H01L21/764 , H01L21/336
CPC分类号： H01L27/11582 , H01L21/76229 , H01L21/764 , H01L23/528 , H01L23/5329 , H01L27/11524 , H01L27/11556 , H01L27/1157 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor devices, and methods of fabricating the same, include forming a trench between a plurality of patterns on a substrate to be adjacent to each other, forming a first sacrificial layer in the trench, forming a first porous insulation layer having a plurality of pores on the plurality of patterns and on the first sacrificial layer, and removing the first sacrificial layer through the plurality of pores of the first porous insulation layer to form a first air gap between the plurality of patterns and under the first porous insulation layer.

4. 发明申请

US20150060988A1 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20150060988A1
公开(公告)日：2015-03-05
申请号：US14519821
申请日：2014-10-21
申请人： Bo-Young LEE , Jongwan CHOI , Myoungbum LEE
发明人： Bo-Young LEE , Jongwan CHOI , Myoungbum LEE
IPC分类号： H01L27/115 , H01L23/532 , H01L23/528
CPC分类号： H01L27/11582 , H01L21/76229 , H01L21/764 , H01L23/528 , H01L23/5329 , H01L27/11524 , H01L27/11556 , H01L27/1157 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor devices, and methods of fabricating the same, include forming a trench between a plurality of patterns on a substrate to be adjacent to each other, forming a first sacrificial layer in the trench, forming a first porous insulation layer having a plurality of pores on the plurality of patterns and on the first sacrificial layer, and removing the first sacrificial layer through the plurality of pores of the first porous insulation layer to form a first air gap between the plurality of patterns and under the first porous insulation layer.
摘要翻译：半导体器件及其制造方法包括在彼此相邻的衬底上的多个图案之间形成沟槽，在沟槽中形成第一牺牲层，形成具有多个孔的第一多孔绝缘层所述多个图案和所述第一牺牲层上，并且通过所述第一多孔绝缘层的所述多个孔去除所述第一牺牲层，以在所述多个图案之间和所述第一多孔绝缘层下方形成第一气隙。

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