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1. 发明申请

US20050013539A1 Optical coupling system 审中-公开
标题翻译：光耦合系统
公开(公告)号：US20050013539A1
公开(公告)日：2005-01-20
申请号：US10622042
申请日：2003-07-17
申请人： Bo Chen , Bernard Li
发明人： Bo Chen , Bernard Li
IPC分类号： G02B6/42 , G02B6/32
CPC分类号： G02B6/4204 , G02B6/4209
摘要： An optical coupling system having an integrated micro lens system for achieving high coupling efficiency between an optoelectronic element and an optical medium such as an optical fiber. The system may have a posts formed on the wafer incorporating the optoelectronic elements. The posts may have micro lenses formed on them. The posts with their respective micro lenses may be situated over respective optoelectronic elements. A window may be formed over the wafer components that may include micro lenses, posts and optoelectronic elements. The window may be part of the package that hermetically seals these components. An optical fiber or an array of fibers may be positioned proximate to the window for the receiving or transmitting of light. The optical coupling system may instead have an aspherical lens situated between the optoelectronic component and optical fiber. The fiber may be in contact with the near lens surface.
摘要翻译：一种具有集成微透镜系统的光耦合系统，用于在光电子元件和诸如光纤的光学介质之间实现高耦合效率。该系统可以具有形成在包含光电子元件的晶片上的柱。柱可以在其上形成微透镜。具有各自的微透镜的柱可以位于相应的光电元件上。可以在可以包括微透镜，柱和光电元件的晶片组件上形成窗口。窗户可能是密封这些部件的包装的一部分。光纤或光纤阵列可以靠近窗口定位以接收或传输光。光耦合系统可以替代地具有位于光电子部件和光纤之间的非球面透镜。纤维可以与近透镜表面接触。

2. 发明申请

US20050013542A1 Coupler having reduction of reflections to light source 审中-公开
标题翻译：耦合器具有减少对光源的反射
公开(公告)号：US20050013542A1
公开(公告)日：2005-01-20
申请号：US10620512
申请日：2003-07-16
申请人： Raymond Blasingame , Bo Chen , James Guenter , James Lee , Bernard Li , James Orenstein
发明人： Raymond Blasingame , Bo Chen , James Guenter , James Lee , Bernard Li , James Orenstein
IPC分类号： G02B6/42 , G02B6/26 , G02B6/32
CPC分类号： G02B6/4204 , G02B6/4292
摘要： A coupler for coupling light between an optoelectronic element and an optical fiber. The coupler has a fiber stop that is made of a material that has an index of refraction that effectively matches the index of refraction of the optical fiber being coupled to the optoelectronic element. The fiber stop may be flat or rounded. It may be a discrete or molded part of the coupler assembly. The end of the fiber being stopped may be flat or rounded.
摘要翻译：用于在光电子元件和光纤之间耦合光的耦合器。耦合器具有由具有有效地匹配耦合到光电子元件的光纤的折射率匹配的折射率的材料制成的光纤停止件。纤维止动器可以是平的或圆形的。它可以是耦合器组件的分立或模制部件。停止的纤维的端部可以是平的或圆形的。

3. 发明授权

US09044593B2 Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding 有权
标题翻译：用于电磁屏蔽的不连续导电填料聚合物基体复合材料
公开(公告)号：US09044593B2
公开(公告)日：2015-06-02
申请号：US11674992
申请日：2007-02-14
申请人： Bernard Li , Chad Cai , Xingfu Chen
发明人： Bernard Li , Chad Cai , Xingfu Chen
IPC分类号： A61B5/055 , A61N1/05 , A61N1/08
CPC分类号： A61N1/08 , A61N1/05 , A61N1/0563 , A61N1/086
摘要： A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
摘要翻译：一种具有由绝缘层覆盖的导体组件的医疗电引线和位于绝缘层的至少一部分附近或邻近绝缘层的屏蔽罩，以便屏蔽导体组件与一个或多个电磁场。屏蔽罩由聚合物基体复合材料形成。聚合物 - 基质复合材料包括其中提供不连续的导电填料的聚合物树脂。不连续导电填料包括纳米尺寸金属结构和纳米尺寸非金属导电结构中的一种或多种。纳米尺寸的非金属导电结构可以具有由一种或多种金属形成的涂层。纳米尺寸的非金属导电结构可由碳形成。反过来，纳米尺寸的非金属导电结构可以包括一个或多个碳纳米纤维，碳丝，碳纳米管和碳纳米片。

4. 发明申请

US20120273090A1 PROCESS AND MATERIAL SOLUTION TO REDUCE METAL ION RELEASE FOR IMPLANTABLE MEDICAL DEVICE APPLICATION 有权
标题翻译：减少用于可植入医疗器械应用的金属离子的方法和材料解决方案
公开(公告)号：US20120273090A1
公开(公告)日：2012-11-01
申请号：US13447873
申请日：2012-04-16
申请人： Alan Shi , Bernard Li
发明人： Alan Shi , Bernard Li
IPC分类号： C23C22/02 , B32B15/01
CPC分类号： C23F1/00 , A61L27/045 , A61L27/50 , A61L2400/18
摘要： The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.
摘要翻译：本发明描述了一种方法和组合物，其中钴和/或镍的存在已经从钴，铬，含镍合金的表面层中耗尽。

5. 发明授权

US07801613B2 Metal injection molded titanium alloy housing for implantable medical devices 有权
标题翻译：用于可植入医疗器械的金属注射成型钛合金外壳
公开(公告)号：US07801613B2
公开(公告)日：2010-09-21
申请号：US11796116
申请日：2007-04-26
申请人： Bernard Li , Reginald D. Robinson , John E. Kast
发明人： Bernard Li , Reginald D. Robinson , John E. Kast
IPC分类号： A61N1/375
CPC分类号： A61L27/06 , A61N1/375 , B22F3/225 , B22F2003/244 , B22F2998/10 , Y10T29/49002 , B22F3/1021 , B22F3/15 , B22F3/24 , B22F7/062
摘要： The housing of an implantable medical device is made of a titanium alloy that provides improved electrical performance, mechanical strength, and reduced MRI heating. The titanium alloy housing includes portions formed by metal injection molding and welded together. Wall thickness of at least a portion of one major face of the housing is reduced by chemical etching a metal injected molded housing portion.
摘要翻译：可植入医疗器械的外壳由钛合金制成，提供改善的电气性能，机械强度和减少MRI加热。钛合金壳体包括通过金属注射成型形成并焊接在一起的部分。壳体的一个主面的至少一部分的壁厚通过化学蚀刻金属注入的模制外壳部分而减少。

6. 发明申请

US20080195187A1 DISCONTINUOUS CONDUCTIVE FILLER POLYMER-MATRIX COMPOSITES FOR ELECTROMAGNETIC SHIELDING 有权
标题翻译：电磁屏蔽不连续导电填充聚合物基复合材料
公开(公告)号：US20080195187A1
公开(公告)日：2008-08-14
申请号：US11674992
申请日：2007-02-14
申请人： Bernard Li , Chad Cai , Xingfu Chen
发明人： Bernard Li , Chad Cai , Xingfu Chen
IPC分类号： A61N1/05
CPC分类号： A61N1/08 , A61N1/05 , A61N1/0563 , A61N1/086
摘要： A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
摘要翻译：一种具有由绝缘层覆盖的导体组件的医疗电引线和位于绝缘层的至少一部分附近或邻近绝缘层的屏蔽罩，以便屏蔽导体组件与一个或多个电磁场。屏蔽罩由聚合物基体复合材料形成。聚合物 - 基质复合材料包括其中提供不连续的导电填料的聚合物树脂。不连续导电填料包括纳米尺寸金属结构和纳米尺寸非金属导电结构中的一种或多种。纳米尺寸的非金属导电结构可以具有由一种或多种金属形成的涂层。纳米尺寸的非金属导电结构可由碳形成。反过来，纳米尺寸的非金属导电结构可以包括一个或多个碳纳米纤维，碳丝，碳纳米管和碳纳米片。

7. 发明申请

US20070251289A1 System and method for producing component for medical device 审中-公开
标题翻译：医疗器械部件的制造方法
公开(公告)号：US20070251289A1
公开(公告)日：2007-11-01
申请号：US11413471
申请日：2006-04-28
申请人： Bernard Li
发明人： Bernard Li
IPC分类号： B21D37/16
CPC分类号： C22F1/183 , A61M5/14276 , A61N1/375
摘要： A method includes applying a constant force to at least a portion of a component configured for use in a medical device and while the constant force is applied, subjecting the component to a temperature above ambient temperature for an amount of time sufficient to-improve the flatness of the component.
摘要翻译：一种方法包括向构造成用于医疗装置的构件的至少一部分施加恒定的力，并且在施加恒定的力的同时，使构件经受高于环境温度的温度足以改善平坦度的组件。

8. 发明授权

US10537730B2 Continuous conductive materials for electromagnetic shielding 有权
公开(公告)号：US10537730B2
公开(公告)日：2020-01-21
申请号：US11674995
申请日：2007-02-14
申请人： Bernard Li , Chad Cai , Xingfu Chen
发明人： Bernard Li , Chad Cai , Xingfu Chen
IPC分类号： A61N1/04 , A61N1/05 , A61N1/37
摘要： A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a material that is electrically conductive, where the material is in a wrapped or woven form. The material is selected so as to have an effective combination of small size and high conductive surface area, e.g., as opposed to metal wire or coatings thinner than metal wire. As such, the shield covering exhibits sufficient conductivity in the presence of one or more high frequency electromagnetic fields so that interference to the operation of the conductor assembly is minimized. The material can have a coating formed of one or more metals. The material can include carbon. In turn, the carbon can be formed of one or more of carbon fiber, carbon nanofiber, and single or multi-walled carbon nanotube.

9. 发明授权

US09284648B2 Process and material solution to reduce metal ion release for implantable medical device application 有权
标题翻译：用于减少可植入医疗器械应用的金属离子释放的工艺和材料解决方案
公开(公告)号：US09284648B2
公开(公告)日：2016-03-15
申请号：US13447873
申请日：2012-04-16
申请人： Alan Shi , Bernard Li
发明人： Alan Shi , Bernard Li
IPC分类号： A61L27/50 , C23F1/00 , A61L27/04
CPC分类号： C23F1/00 , A61L27/045 , A61L27/50 , A61L2400/18
摘要： The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.
摘要翻译：本发明描述了一种方法和组合物，其中钴和/或镍的存在已经从钴，铬，含镍合金的表面层中耗尽。

10. 发明申请

US20050014390A1 Edge bead control method and apparatus 失效
公开(公告)号：US20050014390A1
公开(公告)日：2005-01-20
申请号：US10623351
申请日：2003-07-18
申请人： Bernard Li
发明人： Bernard Li
IPC分类号： H01L21/683 , H01L21/00
CPC分类号： H01L21/6838 , Y10T29/41
摘要： Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.

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