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1. 发明申请

US20130121007A1 Manufacture Method for a Surface Mounted Power LED Support and its Product 有权
标题翻译：表面贴装电源LED支架及其产品的制造方法
公开(公告)号：US20130121007A1
公开(公告)日：2013-05-16
申请号：US13579110
申请日：2010-08-25
申请人： Binhai Yu , Bairong Sun , Weiping Li , Xunli Xia , Cheng Li , Menghua Long , Lifang Liang
发明人： Binhai Yu , Bairong Sun , Weiping Li , Xunli Xia , Cheng Li , Menghua Long , Lifang Liang
IPC分类号： F21V21/00 , B23P11/00
CPC分类号： F21V21/00 , B23P11/00 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H05K1/183 , H05K2201/0394 , H05K2201/10106 , Y10T29/49996 , H01L2224/48091 , H01L2924/00014
摘要： A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
摘要翻译：一种用于表面贴装电源LED支架的制造方法，包括提供具有双面金属层的布线板。另外，该方法包括形成孔。此外，该方法包括在孔的表面设置金属层。此外，该方法包括使布线板的金属层变厚。该方法还包括蚀刻布线板的金属层。此外，该方法包括切割布线板以形成单个支撑单元。表面安装的功率LED支撑件包括双面布线板，形成在布线板中的孔和设置在布线板表面上的布线层。

2. 发明授权

US09157610B2 Manufacture method for a surface mounted power LED support and its product 有权
标题翻译：表面贴装电源LED支架及其产品的制造方法
公开(公告)号：US09157610B2
公开(公告)日：2015-10-13
申请号：US13579110
申请日：2010-08-25
申请人： Binhai Yu , Bairong Sun , Weiping Li , Xunli Xia , Cheng Li , Menghua Long , Lifang Liang
发明人： Binhai Yu , Bairong Sun , Weiping Li , Xunli Xia , Cheng Li , Menghua Long , Lifang Liang
IPC分类号： F21V19/00 , F21V21/00 , H01L33/48 , B23P11/00 , H05K1/18 , H01L33/62
CPC分类号： F21V21/00 , B23P11/00 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H05K1/183 , H05K2201/0394 , H05K2201/10106 , Y10T29/49996 , H01L2224/48091 , H01L2924/00014
摘要： A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
摘要翻译：一种用于表面贴装电源LED支架的制造方法，包括提供具有双面金属层的布线板。另外，该方法包括形成孔。此外，该方法包括在孔的表面设置金属层。此外，该方法包括使布线板的金属层变厚。该方法还包括蚀刻布线板的金属层。此外，该方法包括切割布线板以形成单个支撑单元。表面安装的功率LED支撑件包括双面布线板，形成在布线板中的孔和设置在布线板表面上的布线层。

3. 发明申请

US20120002407A1 LIGHT EMITTING DIODE LIGHT SOURCE MODULES 有权
标题翻译：发光二极管光源模块
公开(公告)号：US20120002407A1
公开(公告)日：2012-01-05
申请号：US12975445
申请日：2010-12-22
申请人： Qing (Charles) Li , Yangcheng Huang , Haijun Wang , Guowen Lei , Cuie Wei , Menghua Long , GuiLin Wang
发明人： Qing (Charles) Li , Yangcheng Huang , Haijun Wang , Guowen Lei , Cuie Wei , Menghua Long , GuiLin Wang
IPC分类号： F21V7/00 , F21V29/00 , F21V15/01
CPC分类号： F21V31/04 , F21S4/10 , F21Y2115/10
摘要： The present invention provides a highly-protective, heat dissipating LED light source module that may be waterproof or non-waterproof. In an embodiment, the present invention provides an LED light source module comprising: a waterproof housing comprising a metal substrate and a plastic cover integrally disposed on one or more surfaces of the metal substrate; and at least one light emitting diode, electronic component, and power line disposed on and operably connected with the metal substrate and encapsulated thereon by the plastic cover. In other embodiments are provided LED light source modules comprising: a circuit board with at least two through holes disposed at selected positions; at least one light emitting diode, electronic component, and power line disposed on the circuit board and operably connected therewith; and a plastic cover comprising at least two pins disposed and shaped for interconnection with corresponding through holes of the circuit board. The simple LED light source models disclosed may be efficiently and inexpensively produced and are capable of withstanding the harsh environments in which they are sometimes used.
摘要翻译：本发明提供一种可防水或不防水的高保护性散热LED光源模块。在一个实施例中，本发明提供了一种LED光源模块，包括：防水壳体，包括金属基板和整体设置在所述金属基板的一个或多个表面上的塑料盖; 以及至少一个发光二极管，电子元件和电力线，其设置在金属基板上并与金属基板可操作地连接，并由塑料盖封装在其上。在其它实施例中，提供了LED光源模块，包括：具有设置在选定位置处的至少两个通孔的电路板; 至少一个发光二极管，电子部件和设置在电路板上并与其可操作地连接的电力线; 以及塑料盖，其包括设置和成形为用于与电路板的相应通孔相互连接的至少两个销。所公开的简单的LED光源模型可以有效且廉价地产生，并且能够承受有时使用它们的恶劣环境。

4. 发明授权

US09303861B2 Light emitting diode light source modules 有权
标题翻译：发光二极管光源模块
公开(公告)号：US09303861B2
公开(公告)日：2016-04-05
申请号：US12975445
申请日：2010-12-22
申请人： Qing (Charles) Li , Yangcheng Huang , Haijun Wang , Guowen Lei , Cuie Wei , Menghua Long , GuiLin Wang
发明人： Qing (Charles) Li , Yangcheng Huang , Haijun Wang , Guowen Lei , Cuie Wei , Menghua Long , GuiLin Wang
IPC分类号： F21V7/20 , F21V31/04 , F21S4/00 , F21Y101/02
CPC分类号： F21V31/04 , F21S4/10 , F21Y2115/10
摘要： The present invention provides a highly-protective, heat dissipating LED light source module that may be waterproof or non-waterproof. In an embodiment, the present invention provides an LED light source module comprising: a waterproof housing comprising a metal substrate and a plastic cover integrally disposed on one or more surfaces of the metal substrate; and at least one light emitting diode, electronic component, and power line disposed on and operably connected with the metal substrate and encapsulated thereon by the plastic cover. In other embodiments are provided LED light source modules comprising: a circuit board with at least two through holes disposed at selected positions; at least one light emitting diode, electronic component, and power line disposed on the circuit board and operably connected therewith; and a plastic cover comprising at least two pins disposed and shaped for interconnection with corresponding through holes of the circuit board. The simple LED light source models disclosed may be efficiently and inexpensively produced and are capable of withstanding the harsh environments in which they are sometimes used.
摘要翻译：本发明提供一种可防水或不防水的高保护性散热LED光源模块。在一个实施例中，本发明提供了一种LED光源模块，包括：防水壳体，包括金属基板和整体设置在所述金属基板的一个或多个表面上的塑料盖; 以及至少一个发光二极管，电子元件和电力线，其设置在金属基板上并与金属基板可操作地连接，并由塑料盖封装在其上。在其它实施例中，提供了LED光源模块，包括：具有设置在选定位置处的至少两个通孔的电路板; 至少一个发光二极管，电子部件和设置在电路板上并与其可操作地连接的电力线; 以及塑料盖，其包括设置和成形为用于与电路板的相应通孔相互连接的至少两个销。所公开的简单的LED光源模型可以有效且廉价地产生，并且能够承受有时使用它们的恶劣环境。

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