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    • 1. 发明授权
    • Evaporator, loop heat pipe module and heat generating apparatus
    • 蒸发器,回路热管模块和发热装置
    • US08100170B2
    • 2012-01-24
    • US11831973
    • 2007-08-01
    • Bin-Juine HuangHuan-Hsiang HuangFu-Sheng SunYi-Hai Lian
    • Bin-Juine HuangHuan-Hsiang HuangFu-Sheng SunYi-Hai Lian
    • H05K7/20
    • F28D15/046F21V29/51F21Y2115/10F28D15/0233F28D15/0266F28F3/12
    • An evaporator suitable for absorbing heat from a heat source is provided. The evaporator includes a top board, a bottom board, a side frame, and at least one porous member. The side frame connects the top board and the bottom board. The porous member is disposed between the top board and the bottom board and within the side frame. The part of the top board covering the porous member is a heat conducting portion near the heat source. The evaporator has at least one first channel, at least one second channel, a fluid inlet, and a fluid outlet. The first channel is adjacent to the bottom board and the porous member for containing a working fluid. The second channel is adjacent to the top board and the porous member for containing the working fluid. The fluid inlet communicates with the first channel. The fluid outlet communicates with the second channel.
    • 提供适于从热源吸收热量的蒸发器。 蒸发器包括顶板,底板,侧框架和至少一个多孔构件。 侧框架连接顶板和底板。 多孔构件设置在顶板和底板之间并且在侧框架内。 覆盖多孔构件的顶板的部分是靠近热源的导热部。 蒸发器具有至少一个第一通道,至少一个第二通道,流体入口和流体出口。 第一通道邻近底板和用于容纳工作流体的多孔构件。 第二通道邻近顶板和用于容纳工作流体的多孔构件。 流体入口与第一通道连通。 流体出口与第二通道连通。
    • 3. 发明申请
    • LIGHT EMITTING DIODE ILLUMINATION APPARATUS AND HEAT DISSIPATING METHOD THEREFOR
    • 发光二极管照明装置及其散热方法
    • US20070189012A1
    • 2007-08-16
    • US11738522
    • 2007-04-23
    • Bin-Juine HuangYi-Hai LianFu-Sheng Sun
    • Bin-Juine HuangYi-Hai LianFu-Sheng Sun
    • F21V29/00
    • F21V29/51F21V29/56F21V29/77F21Y2115/10F28D15/043
    • A light emitting diode (LED) illumination apparatus including an illumination module, a heat dissipating unit and a loop heat pipe (LHP) device is provided. The illumination module includes a base and many LEDs. The LEDs are disposed on the base. The LHP device contains working fluid and includes an evaporator, a condenser, a first transmitting pipe and a second transmitting pipe. The evaporator is associated with the base and has an outlet, an inlet and a chamber. The condenser is conformably associated with the heat dissipating unit. The condenser has an inlet and an outlet, wherein at least one part of the condenser stretches in a curved pipe shape along a surface of the heat dissipating unit. The first transmitting pipe communicates the evaporator outlet to the condenser inlet. The second transmitting pipe communicates the condenser outlet to the evaporator inlet.
    • 提供了包括照明模块,散热单元和环路热管(LHP)装置的发光二极管(LED)照明装置。 照明模块包括基座和许多LED。 LED设置在基座上。 LHP装置包含工作流体,并包括蒸发器,冷凝器,第一传输管和第二传输管。 蒸发器与基座相关联,并具有出口,入口和室。 冷凝器与散热装置一致。 冷凝器具有入口和出口,其中冷凝器的至少一部分沿着散热单元的表面弯曲成管状。 第一传输管将蒸发器出口连通到冷凝器入口。 第二传输管将冷凝器出口连通到蒸发器入口。
    • 9. 发明授权
    • Heat transfer device
    • 传热装置
    • US07461688B2
    • 2008-12-09
    • US10710663
    • 2004-07-27
    • Bin-Juine HuangChern-Shi LamChih-Hung WangHuan-Hsiang HuangYu-Yuan Yen
    • Bin-Juine HuangChern-Shi LamChih-Hung WangHuan-Hsiang HuangYu-Yuan Yen
    • F28D15/00H05K7/20
    • F28D15/046F28D15/0266Y10T29/4935Y10T29/49353Y10T29/49361Y10T29/49396
    • The heat transfer device at least comprises: an evaporator, a heat conductor and a connecting pipe. The evaporator comprises: a first hollow tube; a porous core mortised inside the first hollow tube; and a second hollow tube mortised on the first hollow tube. The heat conductor 220 covers the evaporator. The heat conductor is on the heating device. The connecting pipe is connected to first and second hollow tubes. The connecting pipe is used for containing a working fluid. The condenser is on the connecting pipe. The porous core, the first and second hollow tube, and the heat conductor are mortised together so as to simplify the manufacturing process, and reduce the cost. Further, the evaporator is tightly covered and fixed by the heat conductor so that the heat generated by the heating device can be uniformly conducted to the evaporator to enhance the heat conductivity.
    • 传热装置至少包括:蒸发器,导热体和连接管。 蒸发器包括:第一中空管; 在第一中空管内部捣毁的多孔芯; 以及在第一中空管上榫接的第二中空管。 热导体220覆盖蒸发器。 导热体位于加热装置上。 连接管连接到第一和第二中空管。 连接管用于容纳工作流体。 冷凝器在连接管上。 将多孔芯,第一和第二中空管以及导热体彼此拼接在一起,以简化制造工艺,降低成本。 此外,蒸发器被热导体紧密地覆盖和固定,使得由加热装置产生的热量可以均匀地传导到蒸发器以增强导热性。