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1. 发明授权

US06550531B1 Vapor chamber active heat sink 有权
标题翻译：蒸气室主动散热器
公开(公告)号：US06550531B1
公开(公告)日：2003-04-22
申请号：US09572926
申请日：2000-05-16
申请人： Damion T. Searls , Terrance J. Dishongh , Prateek J. Dujari , Bin Lian
发明人： Damion T. Searls , Terrance J. Dishongh , Prateek J. Dujari , Bin Lian
IPC分类号： F28D1500
CPC分类号： F28D15/0233 , F28D2021/0029 , F28F3/022 , F28F3/04 , H01L23/427 , H01L2224/16 , H01L2224/73253
摘要： A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).
摘要翻译：一种散热装置，包括具有从其延伸的多个突起的基部。基部可以具有限定在其中的蒸气室，并且可以具有从中心顶点部分到基部的边缘的第一表面倾斜。蒸气室包括在蒸气室上表面上的至少一个延伸部，其适于将冷凝的工作流体引导到蒸气室下表面上的期望位置。蒸汽室下表面可以具有至少一个凹陷以在期望的位置收集更大部分的工作流体。

2. 发明授权

US06774310B1 Surface mount connector lead 失效
标题翻译：表面贴装连接器引线
公开(公告)号：US06774310B1
公开(公告)日：2004-08-10
申请号：US09698898
申请日：2000-10-27
申请人： Terrance J. Dishongh , Prateek J. Dujari , Bin Lian , Damion T. Searls
发明人： Terrance J. Dishongh , Prateek J. Dujari , Bin Lian , Damion T. Searls
IPC分类号： H01R402
CPC分类号： H01R12/57 , H01R12/7011 , H01R12/707 , H05K3/3426 , Y02P70/613
摘要： An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.
摘要翻译：用于将电子器件表面安装到基底的增强的接合厚度引线，其中增强的接合厚度引线的一部分基本上平行于物质。增强的接头厚度引线包括弓形结构，其为用于将引线连接到衬底的焊料提供增强的接合厚度。焊料的增强的接合厚度导致电子器件的更牢固的附着。

3. 发明授权

US06327145B1 Heat sink with integrated fluid circulation pump 失效
标题翻译：集成流体循环泵散热器
公开(公告)号：US06327145B1
公开(公告)日：2001-12-04
申请号：US09654215
申请日：2000-09-01
申请人： Bin Lian , Terrance J. Dishongh , Damion T. Searls , Prateek J. Dujari
发明人： Bin Lian , Terrance J. Dishongh , Damion T. Searls , Prateek J. Dujari
IPC分类号： H05K720
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/15311
摘要： A heat dissipation device including a base portion having a plurality of projections extending radially therefrom. A cooling fluid and circulation tubes are used to increase the efficiency of the heat dissipation device by pumping the heat (via the cooling fluid) from the hot base portion to the tips of the projections. The cooling fluid is circulated by a small centrifugal pump, which is driven by a fan attached to the heat dissipation device used for creating forced air-cooling.
摘要翻译：一种散热装置，包括具有从其径向延伸的多个突起的基部。使用冷却流体和循环管来通过将热（经由冷却流体）从热基部分泵送到突起的尖端来提高散热装置的效率。冷却流体由小型离心泵循环，该离心泵由附接到用于产生强制空气冷却的散热装置的风扇驱动。

4. 发明授权

US06649937B2 Semiconductor device with components embedded in backside diamond layer 失效
标题翻译：半导体器件具有嵌入在背面金刚石层中的部件
公开(公告)号：US06649937B2
公开(公告)日：2003-11-18
申请号：US10109143
申请日：2002-03-26
申请人： Damion T. Searls , Prateek J. Dujari , Bin Lian
发明人： Damion T. Searls , Prateek J. Dujari , Bin Lian
IPC分类号： H01L310312
CPC分类号： H01L28/40 , H01L21/0405 , H01L21/76898 , H01L23/3732 , H01L23/481 , H01L2224/73253 , H01L2924/12044 , Y10S257/924
摘要： A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.
摘要翻译：在其前侧具有集成电路器件的半导体衬底和在其背面具有高导热性层（例如金刚石），其中诸如电容器的部件嵌入在高热导率层中并且通过穿过衬底的通孔耦合到前侧集成电路。

5. 发明授权

US06913999B2 Semiconductor device with components embedded in backside diamond layer 失效
标题翻译：半导体器件具有嵌入在背面金刚石层中的部件
公开(公告)号：US06913999B2
公开(公告)日：2005-07-05
申请号：US10670025
申请日：2003-09-24
申请人： Damion T. Searls , Prateek J. Dujari , Bin Lian
发明人： Damion T. Searls , Prateek J. Dujari , Bin Lian
IPC分类号： H01L21/02 , H01L21/04 , H01L21/768 , H01L23/373 , H01L23/48 , H01L21/44
CPC分类号： H01L28/40 , H01L21/0405 , H01L21/76898 , H01L23/3732 , H01L23/481 , H01L2224/73253 , H01L2924/12044 , Y10S257/924
摘要： A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.
摘要翻译：在其前侧具有集成电路器件的半导体衬底和在其背面具有高导热性层（例如金刚石），其中诸如电容器的部件嵌入在高热导率层中并且通过穿过衬底的通孔耦合到前侧集成电路。

6. 发明授权

US06486589B1 Circuit card assembly having controlled vibrational properties 失效
标题翻译：电路卡组件具有受控的振动特性
公开(公告)号：US06486589B1
公开(公告)日：2002-11-26
申请号：US09563378
申请日：2000-05-03
申请人： Prateek Dujari , Terrance J. Dishongh , Bin Lian , Damion T. Searls
发明人： Prateek Dujari , Terrance J. Dishongh , Bin Lian , Damion T. Searls
IPC分类号： B06B106
CPC分类号： H05K1/0271 , F16F15/005 , H05K1/181 , H05K2201/10083 , H05K2201/10151 , H05K2201/2045
摘要： Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.
摘要翻译：压电晶片固定在电路卡上，以控制振动时电路卡的位移。位于主模式的反节点处的触发晶片产生作为模态位移的函数的电压。响应于触发晶片的控制系统产生施加到主模式形状的不同反节点处的柔性晶片的电压。柔性晶片以减小电路卡的模态位移的方式膨胀和收缩。可以存在多个柔性晶片，其固定到基本上彼此相对的电路卡，或者单个触发晶片可以存在单个柔性晶片。触发晶片可以位于基本上与柔性晶片相对的位置，或者可以位于电路卡上的其他位置。

7. 发明授权

US06359372B1 Circuit card assembly having controlled expansion properties 失效
标题翻译：具有受控膨胀特性的电路卡组件
公开(公告)号：US06359372B1
公开(公告)日：2002-03-19
申请号：US09564144
申请日：2000-05-03
申请人： Prateek Dujari , Terrance J. Dishongh , Bin Lian , Damion T. Searls
发明人： Prateek Dujari , Terrance J. Dishongh , Bin Lian , Damion T. Searls
IPC分类号： H01L4108
CPC分类号： H05K1/0271 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/185 , H05K2201/068 , H05K2201/10083 , H05K2201/10151
摘要： Piezoelectric material is embedded in epoxy layers of circuit cards to control thermal expansion and contraction as a function of temperature changes. A temperature sensor and thermostat generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material or different thermostats. Piezoelectric blocks can be arranged in regular patterns or can be randomly or pseudo-randomly placed.
摘要翻译：压电材料嵌入在电路卡的环氧树脂层中，以控制热膨胀和收缩作为温度变化的函数。温度传感器和恒温器产生作为温度的函数的受控电压，并将电压施加到电路卡内的压电块。电路卡的局部区域可以具有不同数量的压电材料或不同的恒温器。压电块可以以规则图案排列，也可以随机或伪随机放置。

8. 发明授权

US07886809B2 Apparatus and method for passive phase change thermal management 有权
标题翻译：被动相变热管理的装置和方法
公开(公告)号：US07886809B2
公开(公告)日：2011-02-15
申请号：US11930781
申请日：2007-10-31
申请人： Damion T. Searls , Terrance J. Dishongh , David Pullen
发明人： Damion T. Searls , Terrance J. Dishongh , David Pullen
IPC分类号： F28D15/00 , F28F17/00
CPC分类号： F28D15/00 , C09K5/063 , F28D20/021 , F28D2021/0031 , F28F23/00 , G06F1/20 , H01L23/4275 , H01L2924/0002 , Y02E60/145 , Y10T29/49353 , H01L2924/00
摘要： In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.
摘要翻译：在一个实施例中，装置包括相变材料，与相变材料混合的多个颗粒以及封装相变材料的导电结构。导电结构包括包括锥形的空腔。在一个实施例中，一种方法包括形成具有空腔的导电结构，将相变材料注入到空腔中，将多个球注入空腔中并密封空腔。

9. 发明授权

US06627822B2 Electronic assembly with separate power and signal connections 有权
标题翻译：具有独立电源和信号连接的电子组件
公开(公告)号：US06627822B2
公开(公告)日：2003-09-30
申请号：US09893307
申请日：2001-06-27
申请人： James Daniel Jackson , Terrance J. Dishongh , Damion T. Searls
发明人： James Daniel Jackson , Terrance J. Dishongh , Damion T. Searls
IPC分类号： H05K116
CPC分类号： H05K3/3415 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/14051 , H01L2224/16 , H01L2924/00014 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H05K3/308 , H05K3/3447 , H05K2201/1059 , H05K2201/10659 , H05K2201/10734 , Y02P70/613 , Y10T29/49126 , Y10T29/49144 , Y10T29/49147 , H01L2224/05599
摘要： A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate and the second substrate and a multiplicity of signal connections separate from the plurality of power connections are also coupled between the first substrate and the second substrate. Each of the plurality of power connections have a substantially different size and shape compared to each of the multiplicity of signal connections.
摘要翻译：公开并要求保护电子组件。电子组件包括第一基板和第二基板。多个电源连接耦合在第一基板和第二基板之间，并且与多个电源连接分离的多个信号连接也耦合在第一基板和第二基板之间。与多个信号连接中的每一个相比，多个电源连接中的每一个具有基本上不同的大小和形状。

10. 发明授权

US07791585B2 Method of fabricating flexible display 有权
标题翻译：柔性显示器的制作方法
公开(公告)号：US07791585B2
公开(公告)日：2010-09-07
申请号：US11561068
申请日：2006-11-17
申请人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
发明人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
IPC分类号： G09G3/34
CPC分类号： G02F1/091 , G09F9/375 , Y10T428/24008 , Y10T428/25
摘要： A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
摘要翻译：一种制造柔性显示器的方法，所述方法包括选择第一柔性片和第二柔性片; 以及在所述第一柔性片和所述第二柔性片之间形成具有磁性可控反射率的多个磁性显示元件。在一些实施例中，显示器包括具有磁可控反射率的像素。像素形成在一对柔性非导电片之间。每个磁性可控像素包括位于柔性非导电片之间的柔性环。每个磁性可控像素还包括位于柔性环内的磁性颗粒。磁性颗粒相对于柔性非导电片的位置确定像素的反射率。显示器特别适用于便携式电子设备的使用。

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