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    • 3. 发明授权
    • Integrated mode converter, waveguide, and on-chip function
    • 集成模式转换器,波导和片上功能
    • US06804440B2
    • 2004-10-12
    • US10314431
    • 2002-12-07
    • Kevin K. LeeDesmond R. LimTae H. Park
    • Kevin K. LeeDesmond R. LimTae H. Park
    • G02B612
    • G02B6/4201G02B6/42G02B6/4214G02B6/424G02B6/4245
    • An integrated device includes a waveguide, which may be connected to a photonic circuit and an external fiber, and an on-chip device formed on an optical chip by forming a region in which the waveguide terminates. The region is bounded by reflective surfaces. Light coming from the waveguide is essentially trapped inside the region and directed to an on-chip device disposed in the region. An integrated device consists of a low index difference waveguide, an on-chip mode converter, a high index difference waveguide, and an on-chip function formed on a single optical chip so that the high index difference waveguide is close to the substrate surface upon which the mode converter is formed. Substrate surface height differences are provided to define different substrate surface mounting heights for a low index difference waveguide, high index difference waveguide, a mode converter, and an on-chip device. The height differentials provide close proximity of components allowing on-chip devices, such as a Ge detector or electronics, to be integrated on a chip with the high index difference waveguide that is connected to a mode converter.
    • 集成器件包括可以连接到光子电路和外部光纤的波导,以及通过形成波导终止的区域而形成在光学芯片上的片上器件。 该区域由反射表面限定。 来自波导的光基本上被捕获在区域内并被引导到设置在该区域中的片上器件。集成器件由低折射率差分波导,片上模式转换器,高折射率差分波导和 片上功能形成在单个光学芯片上,使得高折射率差分波导接近形成模式转换器的衬底表面。 提供衬底表面高度差以定义低折射率差分波导,高折射率差分波导,模式转换器和片上器件的不同衬底表面安装高度。 高度差提供了紧密接近的部件,允许诸如Ge检测器或电子器件的片上器件与连接到模式转换器的高折射率差分波导集成在芯片上。