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    • 1. 发明授权
    • Component reclamation apparatus and method
    • 组件回收装置和方法
    • US5148969A
    • 1992-09-22
    • US799535
    • 1991-11-27
    • Bernard J. BoucherKerry S. DinsmoreJohn A. MaleskyDouglas A. Brochu
    • Bernard J. BoucherKerry S. DinsmoreJohn A. MaleskyDouglas A. Brochu
    • B23K1/005B23K3/06H05K13/00H05K13/04
    • B23K3/0676B23K1/0053H05K13/0061H05K13/0486Y10S156/935Y10T156/19
    • This invention relates to an apparatus and method by which electronic components can be reclaimed from printed circuit boards. In the preferred embodiment, the reclamation system includes a conveyor which grasps the edges of the boards and holds them at an angle so that the component sides of the boards are facing downward. The conveyor carries the boards past infrared panels which heat each board, so that the solder bonding the components to a given board is made to reflow. While the solder is in a reflow state, each board is struck with a tapper, the impact of which has a tendency to dislodge the components. Falling components are caught in bins where they can be collected. In addition, the reclamation system is configured such that a number of operators are able to work in front of the boards passing on the conveyor. Therefore, if the tapper fails to dislodge any components on a given board, an operator can manually remove the components before the board is itself removed from the conveyor. Given that the system accommodates the simultaneous processing of a number of boards, a high volume throughput can be achieved.
    • 本发明涉及电子元件可以从印刷电路板回收的装置和方法。 在优选实施例中,回收系统包括一个抓住板的边缘并以一定角度保持它们的输送机,使得板的组件侧面向下。 输送机将板移动通过加热每个板的红外线板,使得将组件粘合到给定板上的焊料被回流。 当焊料处于回流状态时,每个板被敲击,其冲击倾向于移除部件。 落下的部件被卡在可以收集的物料箱中。 此外,回收系统被配置为使得许多操作者能够在通过传送带的板的前方工作。 因此,如果分纸器不能移动给定板上的任何部件,操作员可以在板自身从传送带中取出之前手动拆下部件。 考虑到系统适应多个板的同时处理,可以实现高容量的吞吐量。