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    • 5. 发明授权
    • Millimeter wave device and method of making
    • 毫米波装置及其制作方法
    • US5503960A
    • 1996-04-02
    • US42449
    • 1993-04-01
    • Garry N. HuldermanEugene PhillipsRichard J. Swanson
    • Garry N. HuldermanEugene PhillipsRichard J. Swanson
    • H03B9/14H03D9/06H04B1/38H05K3/06H05K3/20G03F7/00
    • H03B9/14H03B9/147H03D9/06H04B1/38H05K3/06H05K3/20H05K3/202
    • A method for making a millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture. A second substantially planar conductive cover plate is mounted adjacent the second channel plate so as to form a second cavity in the region defined by the other substrate surface, the second channel plate aperture and the second cover place. A substantially planar conductive back place may be mounted adjacent each cover plate to provide support to the device structure. For the production of large quantity, high yield devices, the channel places, cover plates, and back plates are fabricated by photolithography with chemical milling, to achieve device high performance operation. Alternatively the channel plates and back plates are integrally formed by combining photolithography and electroforming techniques.
    • 一种用于制造具有介电基片的毫米波器件的方法,所述电介质基片具有一对具有至少一个预定的毫米波电路图形的基本上平行的平坦表面,所述至少一个预定的毫米波电路图形成在位于至少一个基底表面上的导电 一个基本上平面的导电通道板被安装在一个衬底表面上与导电层相邻,沟道板具有覆盖在导电层中形成的每个电路图案的孔。 基本上平面的导电盖板安装在一个通道板附近,以便在由基板表面,通道板孔和盖板限定的区域中形成第一腔。 该装置还可以包括邻近另一个衬底表面安装的第二基本上平面的导电通道板,其中第二通道板具有与第一通道板孔对应并对准的孔。 安装在第二通道板附近的第二基本上平面的导电盖板,以便在由另一个基板表面,第二通道板孔和第二盖位置限定的区域中形成第二腔。 基本上平面的导电后部位置可以安装在每个盖板附近以提供对器件结构的支撑。 为了生产大量,高产量的装置,通过化学铣削的光刻制造通道,盖板和背板,以实现器件的高性能操作。 或者,通过组合光刻和电铸技术将通道板和背板一体地形成。
    • 6. 发明授权
    • Millimeter wave device and method of making
    • 毫米波装置及其制作方法
    • US5545511A
    • 1996-08-13
    • US394517
    • 1995-02-27
    • Garry N. HuldermanEugene PhillipsRichard J. Swanson
    • Garry N. HuldermanEugene PhillipsRichard J. Swanson
    • H03B9/14H03D9/06H04B1/38H05K3/06H05K3/20G03F7/20
    • H03B9/14H03B9/147H03D9/06H04B1/38H05K3/06H05K3/20H05K3/202
    • A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture. A second substantially planar conductive cover plate is mounted adjacent the second channel plate so as to form a second cavity in the region defined by the other substrate surface, the second channel plate aperture and the second cover plate. A substantially planar conductive back plate may be mounted adjacent each cover plate to provide support to the device structure. For the production of large quantity, high yield devices, the channel plates, cover plates, and back plates are fabricated by precision techniques such as by photolithography with chemical milling, or electrodischarge machine wire saw fabrication techniques to achieve device high performance operation. In an alternate embodiment of the invention the channel plates, cover plates and back plates are integrally formed by combining photolithography and electroforming techniques.
    • 一种毫米波器件,具有具有一对基本上平行的平坦表面的电介质基底,该平坦表面具有形成在位于至少一个基底表面上的导电层中的至少一个预定毫米波电路图案。 一个基本上平面的导电通道板被安装在一个衬底表面上与导电层相邻,沟道板具有覆盖在导电层中形成的每个电路图案的孔。 基本上平面的导电盖板安装在一个通道板附近,以便在由基板表面,通道板孔和盖板限定的区域中形成第一腔。 该装置还可以包括邻近另一个衬底表面安装的第二基本上平面的导电通道板,其中第二通道板具有与第一通道板孔对应并对准的孔。 安装在第二通道板附近的第二基本上平面的导电盖板,以便在由另一个基板表面,第二通道板孔和第二盖板限定的区域中形成第二腔。 基本上平面的导电背板可以安装在每个盖板附近以提供对器件结构的支撑。 为了生产大量,高产量的装置,通过精密技术制造通道板,盖板和背板,例如通过化学铣削的光刻或电镀放电机线锯制造技术来实现器件高性能操作。 在本发明的替代实施例中,通过组合光刻和电铸技术将通道板,盖板和背板一体地形成。
    • 8. 发明授权
    • Low cost, one-shot switch waveguide window
    • 低成本,单向开关波导窗口
    • US5936493A
    • 1999-08-10
    • US977388
    • 1997-11-24
    • Garry N. HuldermanRichard J. Swanson
    • Garry N. HuldermanRichard J. Swanson
    • H01P1/08H01P1/10
    • H01P1/08
    • Inexpensive and reliable apparatus for blanking the signal path between an antenna and a transmitter or a receiver to protect them from harmful radiation in the absence of power forms supplied thereto. The apparatus is preferably formed as a printed circuit waveguide switch window having a plurality of parallel conductors, such as metal wires or printed circuit traces, disposed on a dielectric substrate. The waveguide switch window is secured between two sections of waveguide. The conductors have a predetermined separation and width that are designed to appear as a solid metal surface that rejects radiation over a wide bandwidth. A bias terminal is coupled to the plurality of conductors, and insulating material is disposed between the bias terminal and the conductors to insulate the top portion of the grid array from the adjacent waveguide. The lower portion of the grid array is grounded to the adjacent waveguide. When the waveguide switch window is in its protective, blanked state, it blocks undesired radiation from entering the antenna and destroying sensitive components in the receiver. When a predetermined voltage is supplied to the bias terminal, it vaporizes the grid array and opens the waveguide switch window to allow normal operation of the antenna and receiver. As proven by tests, the waveguide switch window provides radiation immunity against high level input radiation power and high isolation (30 dB) for receiver protection in the blanked state, and with no measurable loss in the unblanked state.
    • 用于消除天线和发射机或接收机之间的信号路径的廉价可靠的设备,以在没有提供给其的电力形式的情况下保护它们免受有害辐射。 该装置优选地形成为布置在介质基板上的具有多个平行导体(例如金属线或印刷电路迹线)的印刷电路波导开关窗口。 波导开关窗固定在波导的两个部分之间。 导体具有预定的分离宽度,被设计成出现为在宽带宽上抑制辐射的固体金属表面。 偏置端子耦合到多个导体,并且绝缘材料设置在偏置端子和导体之间,以将栅格阵列的顶部部分与相邻的波导绝缘。 栅格阵列的下部接地到相邻的波导。 当波导开关窗处于保护状态时,阻挡不需要的辐射进入天线,并破坏接收器中的敏感元件。 当向偏置端子提供预定电压时,它使电网阵列蒸发并打开波导开关窗口以允许天线和接收器的正常操作。 通过测试证明,波导开关窗口在消隐状态下提供高电平输入辐射功率和高隔离度(30 dB)的辐射抗扰度,并且在未钝化状态下没有可测量的损耗。
    • 9. 发明授权
    • Millimeter wave device and method of making
    • 毫米波装置及其制作方法
    • US5688618A
    • 1997-11-18
    • US446025
    • 1995-05-19
    • Garry N. HuldermanEugene PhillipsRichard J. Swanson
    • Garry N. HuldermanEugene PhillipsRichard J. Swanson
    • H03B9/14H03D9/06H04B1/38H05K3/06H05K3/20G03F7/00G03F9/00
    • H03B9/14H03B9/147H03D9/06H04B1/38H05K3/06H05K3/20H05K3/202
    • A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture. A second substantially planar conductive cover plate is mounted adjacent the second channel plate so as to form a second cavity in the region defined by the other substrate surface, the second channel plate aperture and the second cover plate. A substantially planar conductive back plate may be mounted adjacent each cover plate to provide support to the device structure. For the production at large quantity, high yield devices, the channel plates, cover plates, and back plates are fabricated by precision techniques such as by photolithography with chemical milling, or electrodischarge machine wire saw fabrication techniques to achieve device high performance operation. In an alternate embodiment of the invention the channel plates, cover plates and back plates are integrally formed for combining photolithography and electroforming techniques.
    • 一种毫米波器件,具有具有一对基本上平行的平坦表面的电介质基底,该平坦表面具有形成在位于至少一个基底表面上的导电层中的至少一个预定毫米波电路图案。 一个基本上平面的导电通道板被安装在一个衬底表面上与导电层相邻,沟道板具有覆盖在导电层中形成的每个电路图案的孔。 基本上平面的导电盖板安装在一个通道板附近,以便在由基板表面,通道板孔和盖板限定的区域中形成第一空腔。该装置还可包括第二基本上平面的导电通道板 安装在另一个衬底表面上,其中第二通道板具有与第一通道板孔对应并对准的孔。 安装在第二通道板附近的第二基本上平面的导电盖板,以便在由另一个基板表面,第二通道板孔和第二盖板限定的区域中形成第二腔。 基本上平面的导电背板可以安装在每个盖板附近以提供对器件结构的支撑。 对于大批量生产高产量装置,通过精密技术制造通道板,盖板和背板,例如通过化学铣削的光刻或电镀放电机线锯制造技术来实现器件高性能操作。 在本发明的替代实施例中,通道板,盖板和背板是一体形成的,用于组合光刻和电铸技术。