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1. 发明申请

US20050189956A1 Electronic components with plurality of contoured microelectronic spring contacts 失效
标题翻译：具有多个成型微电子弹簧触头的电子部件
公开(公告)号：US20050189956A1
公开(公告)日：2005-09-01
申请号：US11119715
申请日：2005-05-02
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01R12/61 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01L23/48 , H01R13/24 , H05K3/40 , H05K7/10 , G01R31/02
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
摘要翻译：公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座，梁的第一端和位于梁的与基座相对的自由端的尖端。梁在其自由端和底座之间具有不受支撑的跨距。微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。弹簧触点可以具有各种创新的轮廓形状。在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

2. 发明申请

US20060019027A1 Method for forming microelectronic spring structures on a substrate 审中-公开
标题翻译：在基板上形成微电子弹簧结构的方法
公开(公告)号：US20060019027A1
公开(公告)日：2006-01-26
申请号：US11189954
申请日：2005-07-25
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： H05K3/00 , C23C28/00
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要： A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.
摘要翻译：公开了一种用于制造微电子弹簧结构的方法。在该方法的初始步骤中，在衬底上形成牺牲材料层。然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。如果需要，则牺牲层被固化或硬化。弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。在替代方法的初始步骤中，在衬底上提供一层材料。然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。流体被固化或硬化以稳定弯液面的轮廓形状。然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

3. 发明申请

US20070045874A1 Lithographic Type Microelectronic Spring Structures with Improved Contours 失效
标题翻译：具有改进轮廓的平版印刷型微电子弹簧结构
公开(公告)号：US20070045874A1
公开(公告)日：2007-03-01
申请号：US11551621
申请日：2006-10-20
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01L23/52
CPC分类号： H05K7/1069 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H05K3/4092 , Y10T29/49151 , Y10T29/4922
摘要： Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.
摘要翻译：公开了改进的光刻型微电子弹簧结构和方法，用于提供改善的基板上的尖端高度，改进的弹性范围，增加的强度和可靠性以及增加的弹簧刚度。改进的结构适于由沉积在模制的牺牲衬底上的单个集成层（或一系列层）形成，从而避免多个阶梯式光刻层并降低制造成本。特别地，为了实现上述改进，公开了在z方向上成形的平版印刷结构。例如，公开了具有沿着弹簧的长度延伸的U形横截面，V形横截面和/或一个或多个肋的结构。本发明另外提供了一种平版印刷型弹性接触件，其被波纹化以增加其有效长度和弹性范围并减小其在基底上的覆盖面，以及在俯视图中成形的弹簧。本发明还提供了用于光刻型微电子弹簧结构的组合（串联和并联）电接触尖端。根据本发明的微电子弹簧结构特别适用于制造用于集成电路和其它基板安装的电子设备的电连接器的非常精细的间距阵列，因为它们的性能特性被增强，同时它们可以是与其他光刻型微电子弹簧结构相比大大降低了成本。

4. 发明申请

US20050016251A1 Forming tool for forming a contoured microelectronic spring mold 审中-公开
标题翻译：用于形成轮廓微电子弹簧模具的成型工具
公开(公告)号：US20050016251A1
公开(公告)日：2005-01-27
申请号：US10919151
申请日：2004-08-16
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/768 , H01L23/48 , H01L23/482 , H01R13/24 , H05K3/40 , H05K7/10 , B21D31/00
CPC分类号： G01R3/00 , B33Y80/00 , B81B2203/0118 , B81C1/00611 , B81C2201/0108 , B81C2201/0125 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L23/4822 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01057 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
摘要翻译：公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。还公开了用于制造成形工具的许多方法。这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

5. 发明申请

US20070269997A1 ELECTRONIC COMPONENTS WITH PLURALITY OF CONTOURED MICROELECTRONIC SPRING CONTACTS 失效
标题翻译：具有多层结构的微电子弹簧触头的电子元件
公开(公告)号：US20070269997A1
公开(公告)日：2007-11-22
申请号：US11779183
申请日：2007-07-17
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01R12/10 , G01R31/26
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
摘要翻译：公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座，梁的第一端和位于梁的与基座相对的自由端的尖端。梁在其自由端和底座之间具有不受支撑的跨距。微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。弹簧触点可以具有各种创新的轮廓形状。在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

6. 发明申请

US20070054513A1 METHODS OF FABRICATING AND USING SHAPED SPRINGS 审中-公开
标题翻译：制作和使用形状弹簧的方法
公开(公告)号：US20070054513A1
公开(公告)日：2007-03-08
申请号：US11554485
申请日：2006-10-30
申请人： Gaetan Mathieu , Benjamin Eldridge , Stuart Wenzel
发明人： Gaetan Mathieu , Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01R12/00
CPC分类号： H01L24/13 , G01R1/06761 , G01R1/07342 , G01R1/07378 , G01R3/00 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H05K3/326 , H05K3/4092 , H05K2201/0308 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.
摘要翻译：一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形。

7. 发明授权

US08457336B2 Contamination resistant ports for hearing devices 有权
标题翻译：用于听觉设备的防污端口
公开(公告)号：US08457336B2
公开(公告)日：2013-06-04
申请号：US12819066
申请日：2010-06-18
申请人： Igal Ladabaum , Stuart Wenzel , Ganapati Mauze , Ian Michael Day , Leland Stock , Paul Wagner
发明人： Igal Ladabaum , Stuart Wenzel , Ganapati Mauze , Ian Michael Day , Leland Stock , Paul Wagner
IPC分类号： H04R25/00
CPC分类号： H04R25/656 , H04R25/602 , H04R25/654 , H04R2225/023 , Y10T29/49005
摘要： An in-canal hearing device includes a receiver, battery, and microphone assembly with a housing. The housing has an air and sound opening which is covered with a structure to inhibit the entry of cerumen and moisture. The structure may be in the form of an end cap having passages with walls which are both hydrophobic and oleophobic to prevent the entry of water, cerumen and other liquids. The structure may also include a flexible tube or a rigid perforated shell surrounding the passages that inhibit the deposition of solid cerumen and other debris onto the passages.
摘要翻译：管内听力装置包括具有壳体的接收器，电池和麦克风组件。外壳具有空气和声音开口，覆盖有结构以抑制耳垢和水分的进入。结构可以是端盖的形式，其具有通道，其具有疏水性和疏油性的壁，以防止水，耳垢和其它液体的进入。结构还可以包括柔性管或围绕通道的刚性穿孔壳，其阻止固体耳垢和其它碎屑沉积在通道上。

8. 发明授权

US07756586B2 Wound healing patch with guard electrodes 有权
标题翻译：伤口愈合贴片与保护电极
公开(公告)号：US07756586B2
公开(公告)日：2010-07-13
申请号：US11876134
申请日：2007-10-22
申请人： Stuart Wenzel , Mariam Maghribi , Mark Huang
发明人： Stuart Wenzel , Mariam Maghribi , Mark Huang
IPC分类号： A61N1/04
CPC分类号： A61N1/326 , A61N1/205
摘要： In one example, the present invention is directed to a wound-healing patch including a flexible substrate, at least one wound electrode, at least one guard electrode and at least one return electrode. The guard electrode is positioned between the wound and return electrodes in the electrical path of current traveling between the return and wound electrodes on the surface of the skin, sinking the surface current and force the wound current to travel deeper into the tissue. In the invention, the wound electrode(s) is positioned on a portion of the flexible substrate designed to be placed over wounded tissue and the return electrode is positioned on a portion of the substrate substantially surrounding the wound and guard electrodes and is designed to be placed over healthy tissue.
摘要翻译：在一个实例中，本发明涉及包括柔性基底，至少一个缠绕电极，至少一个保护电极和至少一个返回电极的伤口愈合贴片。保护电极位于卷绕和返回电极之间的电路中，电流在皮肤表面的返回电极和缠绕电极之间传播，从而降低表面电流，并迫使伤口电流更深地进入组织。在本发明中，卷绕电极位于设计成放置在受伤组织上的柔性基板的一部分上，并且返回电极位于基本上围绕伤口和保护电极的基底的一部分上，并被设计为放在健康的组织上。

9. 发明申请

US20080103558A1 FOCUSED ELECTROMAGNETIC-WAVE AND ULTRASONIC-WAVE STRUCTURES FOR TISSUE STIMULATION 审中-公开
标题翻译：用于组织刺激的聚焦电磁波和超声波结构
公开(公告)号：US20080103558A1
公开(公告)日：2008-05-01
申请号：US11876192
申请日：2007-10-22
申请人： Stuart Wenzel , Zara Sieh
发明人： Stuart Wenzel , Zara Sieh
IPC分类号： A61N1/36
CPC分类号： A61N1/3787 , A61N1/36014 , A61N1/36017 , A61N1/36021 , A61N1/37229
摘要： The present invention is directed to small, low profile, antenna-transmitter systems that attach to exterior of the body and focus electromagnetic (EM) wave energy onto one or more precise regions inside the body. The antenna-transmitter system may also deliver energy to the surface of the body without focusing. The present invention is further directed to a method of focusing energy, such as electromagnetic radiation, onto a single nerve to effect selective neurostimulation, super- or sub-threshold, using a small, low profile, antenna-transmitter system that attaches to the body exterior and focuses electromagnetic wave energy onto the nerve.
摘要翻译：本发明涉及附接到身体外部并将电磁（EM）波能量聚焦到身体内的一个或多个精确区域上的小型，薄型的天线 - 发射机系统。天线发射机系统还可以将能量传递到身体的表面而不进行聚焦。本发明还涉及一种将诸如电磁辐射的能量聚焦到单个神经上的方法，以使用附接到身体的小型，矮小型的天线 - 发射器系统来实现选择性神经刺激，超阈值或次阈值将电磁波能量聚焦到神经上。

10. 发明申请

US20100322452A1 CONTAMINATION RESISTANT PORTS FOR HEARING DEVICES 有权
标题翻译：用于听觉设备的耐污染性端口
公开(公告)号：US20100322452A1
公开(公告)日：2010-12-23
申请号：US12819066
申请日：2010-06-18
申请人： Igal Ladabaum , Stuart Wenzel , Ganapati Mauze , Ian Michael Day , Leland Stock , Paul Wagner
发明人： Igal Ladabaum , Stuart Wenzel , Ganapati Mauze , Ian Michael Day , Leland Stock , Paul Wagner
IPC分类号： H04R25/00 , H04R31/00
CPC分类号： H04R25/656 , H04R25/602 , H04R25/654 , H04R2225/023 , Y10T29/49005
摘要： An in-canal hearing device includes a receiver, battery, and microphone assembly with a housing. The housing has an air and sound opening which is covered with a structure to inhibit the entry of cerumen and moisture. The structure may be in the form of an end cap having passages with walls which are both hydrophobic and oleophobic to prevent the entry of water, cerumen and other liquids. The structure may also include a flexible tube or a rigid perforated shell surrounding the passages that inhibit the deposition of solid cerumen and other debris onto the passages.
摘要翻译：管内听力装置包括具有壳体的接收器，电池和麦克风组件。外壳具有空气和声音开口，覆盖有结构以抑制耳垢和水分的进入。结构可以是端盖的形式，其具有通道，其具有疏水性和疏油性的壁，以防止水，耳垢和其它液体的进入。结构还可以包括柔性管或围绕通道的刚性穿孔壳，其阻止固体耳垢和其它碎屑沉积在通道上。

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