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    • 9. 发明授权
    • Microelectronic package comprising offset conductive posts on compliant layer
    • 微电子封装包括柔性层上的偏移导电柱
    • US08207604B2
    • 2012-06-26
    • US10985126
    • 2004-11-10
    • Belgacem HabaMasud BerozGiles HumpstonJae M. Park
    • Belgacem HabaMasud BerozGiles HumpstonJae M. Park
    • H01L23/485
    • H01L23/13H01L21/4846H01L2924/0002H01R13/2414H01R13/2464H01L2924/00
    • A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
    • 微电子封装包括安装结构,与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。 导电柱从安装结构沿向上的方向突出,至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构的基座,每个偏置柱的基部限定质心。 每个偏移柱还限定具有质心的上肢,上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。 安装结构适于允许每个偏移柱绕水平轴线倾斜,使得上端部可以擦过相对电路板的接触垫。
    • 10. 发明申请
    • Micro pin grid array with wiping action
    • 微针格栅阵列与擦拭动作
    • US20050181655A1
    • 2005-08-18
    • US10985126
    • 2004-11-10
    • Belgacem HabaMasud BerozGiles HumpstonJae Park
    • Belgacem HabaMasud BerozGiles HumpstonJae Park
    • H01L21/48H01L23/13H01R13/24H01R13/62
    • H01L23/13H01L21/4846H01L2924/0002H01R13/2414H01R13/2464H01L2924/00
    • A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
    • 微电子封装包括安装结构,与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。 导电柱从安装结构沿向上的方向突出,至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构的基座,每个偏置柱的基部限定质心。 每个偏移柱还限定具有质心的上肢,上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。 安装结构适于允许每个偏移柱绕水平轴线倾斜,使得上端部可以擦过相对电路板的接触垫。