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1. 发明申请

US20130063918A1 LOW CTE INTERPOSER 有权
公开(公告)号：US20130063918A1
公开(公告)日：2013-03-14
申请号：US13232436
申请日：2011-09-14
申请人： Belgacem Haba , Kishor Desai
发明人： Belgacem Haba , Kishor Desai
IPC分类号： H05K7/00 , B32B38/08 , H05K1/00 , H05K1/11 , H05K1/16
CPC分类号： H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/498 , H01L23/49811 , H01L23/49833 , H01L24/17 , H01L24/73 , H01L2224/16225 , H01L2224/17104 , H01L2224/32225 , H01L2224/48227 , H01L2224/4911 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/19107 , Y10T29/49128 , Y10T428/24521 , Y10T428/24802 , H01L2924/00 , H01L2924/00012
摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).
摘要翻译：互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。第一和第二支撑部分的热膨胀系数（CTE）可以低于每百万摄氏度（ppm /℃）的百万分之十二。

2. 发明申请

US20120126389A1 ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND VIAS CONNECTED TO THE CENTRAL CONTACTS 有权
标题翻译：与中央联系的增强型堆叠微电子组件和连接到中央联系人的VIAS
公开(公告)号：US20120126389A1
公开(公告)日：2012-05-24
申请号：US12953994
申请日：2010-11-24
申请人： Kishor Desai , Belgacem Haba , Wael Zohni
发明人： Kishor Desai , Belgacem Haba , Wael Zohni
IPC分类号： H01L25/07 , H01L21/98
CPC分类号： H01L21/568 , H01L21/561 , H01L24/19 , H01L24/96 , H01L25/0657 , H01L25/105 , H01L2224/12105 , H01L2224/13024 , H01L2224/32145 , H01L2224/32225 , H01L2224/73217 , H01L2224/73267 , H01L2224/92144 , H01L2225/06562 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/01087 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103
摘要： The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.
摘要翻译：微电子组件包括具有前表面的第一微电子元件，在前表面处暴露的多个触点以及远离前表面的后表面; 第二微电子元件具有面向第一微电子元件的后表面并且突出超过第一微电子元件的边缘的前表面，第二微电子元件具有在其前表面处暴露的多个触点; 位于所述微电子元件的前表面上方的电介质区域，所述电介质区域具有背离所述微电子元件的主表面; 在从第一和第二微电子元件的多个触点延伸的电介质区域内的开口内的金属化通孔; 并且引线沿着介电区域的主表面从通孔暴露在主表面处的端子延伸。

3. 发明授权

US08780576B2 Low CTE interposer 有权
标题翻译：低CTE插值器
公开(公告)号：US08780576B2
公开(公告)日：2014-07-15
申请号：US13232436
申请日：2011-09-14
申请人： Belgacem Haba , Kishor Desai
发明人： Belgacem Haba , Kishor Desai
IPC分类号： H05K7/00
CPC分类号： H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/498 , H01L23/49811 , H01L23/49833 , H01L24/17 , H01L24/73 , H01L2224/16225 , H01L2224/17104 , H01L2224/32225 , H01L2224/48227 , H01L2224/4911 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/19107 , Y10T29/49128 , Y10T428/24521 , Y10T428/24802 , H01L2924/00 , H01L2924/00012
摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).
摘要翻译：互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。第一和第二支撑部分的热膨胀系数（“CTE”）可以低于每摄氏度12ppm（“ppm /℃”）。

4. 发明授权

US08697492B2 No flow underfill 有权
标题翻译：没有流动的底部填充
公开(公告)号：US08697492B2
公开(公告)日：2014-04-15
申请号：US12938068
申请日：2010-11-02
申请人： Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
发明人： Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
IPC分类号： H01L25/065 , H01L21/56 , H01L21/60
CPC分类号： H01L23/49811 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1601 , H01L2224/1605 , H01L2224/16225 , H01L2224/1703 , H01L2224/73104 , H01L2224/73204 , H01L2224/81143 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and other of the first or second conductive elements may include a bond metal disposed between some of the conductive posts. An underfill layer may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer and at least deform the bond metal. The microelectronic element and the dielectric element can be heated to join them together. The height of the posts above the surface may be at least forty percent of a distance between surfaces of the microelectronic element and dielectric element.
摘要翻译：一种用于制造微电子组件的方法包括：提供具有第一导电元件的微电子元件和具有第二导电元件的介质元件。第一导电元件或第二导电元件中的至少一些可以是导电柱，并且第一或第二导电元件中的另一个可以包括设置在一些导电柱之间的接合金属。底部填充层可能过度地部分第一或第二导电元件。第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得支柱刺穿底部填充层并且至少使接合金属变形。微电子元件和电介质元件可以被加热以将它们连接在一起。表面上方的柱的高度可以是微电子元件和电介质元件的表面之间的距离的至少40％。

5. 发明申请

US20120104595A1 NO FLOW UNDERFILL 有权
标题翻译：没有FLOW UNDERFILL
公开(公告)号：US20120104595A1
公开(公告)日：2012-05-03
申请号：US12938068
申请日：2010-11-02
申请人： Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
发明人： Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L23/49811 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1601 , H01L2224/1605 , H01L2224/16225 , H01L2224/1703 , H01L2224/73104 , H01L2224/73204 , H01L2224/81143 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and other of the first or second conductive elements may include a bond metal disposed between some of the conductive posts. An underfill layer may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer and at least deform the bond metal. The microelectronic element and the dielectric element can be heated to join them together. The height of the posts above the surface may be at least forty percent of a distance between surfaces of the microelectronic element and dielectric element.
摘要翻译：一种用于制造微电子组件的方法包括：提供具有第一导电元件的微电子元件和具有第二导电元件的介质元件。第一导电元件或第二导电元件中的至少一些可以是导电柱，并且第一或第二导电元件中的另一个可以包括设置在一些导电柱之间的接合金属。底部填充层可能过度地部分第一或第二导电元件。第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得支柱刺穿底部填充层并且至少使接合金属变形。微电子元件和电介质元件可以被加热以将它们连接在一起。表面上方的柱的高度可以是微电子元件和电介质元件的表面之间的距离的至少40％。

6. 发明授权

US08378478B2 Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts 有权
标题翻译：具有中心触点和连接到中心触点的通孔的增强堆叠微电子组件
公开(公告)号：US08378478B2
公开(公告)日：2013-02-19
申请号：US12953994
申请日：2010-11-24
申请人： Kishor Desai , Belgacem Haba , Wael Zohni
发明人： Kishor Desai , Belgacem Haba , Wael Zohni
IPC分类号： H01L23/02
CPC分类号： H01L21/568 , H01L21/561 , H01L24/19 , H01L24/96 , H01L25/0657 , H01L25/105 , H01L2224/12105 , H01L2224/13024 , H01L2224/32145 , H01L2224/32225 , H01L2224/73217 , H01L2224/73267 , H01L2224/92144 , H01L2225/06562 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/01087 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103
摘要： The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.
摘要翻译：微电子组件包括具有前表面的第一微电子元件，在前表面处暴露的多个触点以及远离前表面的后表面; 第二微电子元件具有面向第一微电子元件的后表面并且突出超过第一微电子元件的边缘的前表面，第二微电子元件具有在其前表面处暴露的多个触点; 位于所述微电子元件的前表面上方的电介质区域，所述电介质区域具有背离所述微电子元件的主表面; 在从第一和第二微电子元件的多个触点延伸的电介质区域内的开口内的金属化通孔; 并且引线沿着介电区域的主表面从通孔暴露在主表面处的端子延伸。

7. 发明授权

US09125333B2 Electrical barrier layers 有权
标题翻译：电阻层
公开(公告)号：US09125333B2
公开(公告)日：2015-09-01
申请号：US13183870
申请日：2011-07-15
申请人： Cyprian Uzoh , Vage Oganesian , Ilyas Mohammed , Belgacem Haba , Piyush Savalia , Craig Mitchell
发明人： Cyprian Uzoh , Vage Oganesian , Ilyas Mohammed , Belgacem Haba , Piyush Savalia , Craig Mitchell
IPC分类号： H05K1/03 , H05K1/09 , H05K3/40
CPC分类号： H01L24/05 , H01L2224/04042 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/056 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01074 , H01L2924/013 , H05K1/09 , H05K3/4007 , H05K2201/032 , H05K2201/0326 , H05K2201/0338
摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.
摘要翻译：用于电气应用的阻隔层。在一些实施例中，阻挡层是层压阻挡层。在一些实施例中，阻挡层包括梯度阻挡层。

8. 发明授权

US08988895B2 Interconnection elements with encased interconnects 有权
标题翻译：具有封装互连的互连元件
公开(公告)号：US08988895B2
公开(公告)日：2015-03-24
申请号：US13215725
申请日：2011-08-23
申请人： Ilyas Mohammed , Belgacem Haba
发明人： Ilyas Mohammed , Belgacem Haba
IPC分类号： H05K7/04 , H01B7/00 , H01R43/00 , H01L21/50 , H05K3/46 , H01L23/498 , H01L21/48 , H01R12/52
CPC分类号： H05K3/4602 , H01L21/486 , H01L23/49827 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H01R12/523 , H05K2201/10378 , H05K2203/0235 , Y10T29/49176
摘要： An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.
摘要翻译：公开了一种互连元件，其包括多个拉制的金属导体，电介质层和在其上具有多个可湿接触点的相对表面。导体可以包括具有沿导体的第一和第二端之间的方向定向的长度的晶粒。用于绝缘导体的电介质层可以具有第一和第二相对表面，并且在第一和第二表面之间可以具有小于1毫米的厚度。一个或多个导体可以被配置为将信号传送到微电子元件或从微电子元件传送信号。可以使用第一和第二可湿触点将互连元件接合到微电子元件和电路板中的至少一个。可湿性触点可以匹配微电子元件的表面处的元件触点的空间分布或暴露在微电子元件以外的部件的表面处的电路触点。

9. 发明授权

US08937361B2 BSI image sensor package with variable-height silicon for even reception of different wavelengths 有权
标题翻译： BSI图像传感器封装，具有可变高度的硅，用于均匀接收不同的波长
公开(公告)号：US08937361B2
公开(公告)日：2015-01-20
申请号：US13114243
申请日：2011-05-24
申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
发明人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
IPC分类号： H01L31/0232 , H01L27/146
CPC分类号： H01L27/14625 , H01L27/1461 , H01L27/14629 , H01L27/14632 , H01L27/1464 , H01L27/14645 , H01L27/14687
摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.
摘要翻译：提供了一种用于背面照明的微电子图像传感器组件及其制造方法。该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。电介质区域可以包括至少一个光导。

10. 发明授权

US08916781B2 Cavities containing multi-wiring structures and devices 有权
标题翻译：包含多层结构和设备的腔
公开(公告)号：US08916781B2
公开(公告)日：2014-12-23
申请号：US13296785
申请日：2011-11-15
申请人： Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Cyprian Emeka Uzoh
发明人： Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Cyprian Emeka Uzoh
IPC分类号： H05K1/11 , H05K1/03 , H05K1/09 , H05K1/00 , H01L23/498 , H01R12/71 , H05K3/42
CPC分类号： H05K1/0271 , H01L23/49827 , H01L2924/0002 , H01R12/714 , H05K1/114 , H05K1/115 , H05K3/42 , H05K2201/09645 , H05K2201/10378 , H05K2203/0242 , H05K2203/025 , Y10T29/49165 , H01L2924/00
摘要： An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.
摘要翻译：互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。该元件由热膨胀系数小于10ppm /℃的材料构成。至少一些导体沿开口的至少一个内表面延伸。导体在第一表面限定多个可润湿的第一接触。第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。

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