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    • 9. 发明授权
    • Reflective LCD with dark borders
    • 具有黑色边框的反光LCD
    • US06348959B1
    • 2002-02-19
    • US09217409
    • 1998-12-21
    • George A. MelnickRonald D. Pinker
    • George A. MelnickRonald D. Pinker
    • G02F11333
    • G02F1/1339G02F1/133512
    • A projection display device is provided which includes a border structure comprising a dam around the active display area of the device which both shields any underlying drive circuitry from the incidental light by reflecting this light-while passively controlling its birefringence such that this region appears dark to the viewer when no drive voltages are being applied. Preferably, the dam is positioned between the glue seal and the active region, the thickness of the dam being such as to allow a thin layer of LC material on top of the dam for compensated LC effects and in such case, the border structure between the glue seal and the active region is also effective to keep the glue from seeping into the active region when the seal line is squeezed during assembly. With a high birefringence material and an external compensation foil, a high degree of light extinction is achieved over the border. Also, formation of the border on the active plate means that no critical alignment of the passive plate is needed.
    • 提供了一种投影显示装置,其包括边界结构,该边界结构包括围绕该装置的有源显示区域的坝,其两者均通过反射该光屏蔽任何底层的驱动电路与附带的光,同时被动地控制其双折射,使得该区域看起来较暗 当没有驱动电压被施加时的观察者。 优选地,坝被定位在胶水密封件和有源区域之间,坝的厚度允许在坝的顶部上的薄层的LC材料用于补偿的LC效应,并且在这种情况下, 当密封线在组装过程中被挤压时,胶水密封和有源区域也有效地保持胶水渗透到活动区域中。 使用高双折射材料和外部补偿箔,在边界上实现高度的光消光。 此外,活动板上的边界的形成意味着不需要无源板的临界对准。
    • 10. 发明授权
    • Process for making strain-compensated bonded silicon-on-insulator
material free of dislocations
    • 用于制造应变补偿的绝缘体上硅材料无位错的方法
    • US5261999A
    • 1993-11-16
    • US697139
    • 1991-05-08
    • Ronald D. PinkerEmil ArnoldHelmut Baumgart
    • Ronald D. PinkerEmil ArnoldHelmut Baumgart
    • H01L21/20H01L21/762H01L21/00
    • H01L21/76251H01L21/2007
    • A silicon-on-insulator material is formed by a method which includes the steps of forming a p-type silicon epitaxial layer, doped with boron and a higher concentration of germanium, on the surface of a semiconductor silicon substrate, forming an additional silicon epitaxial layer on the p-type silicon epitaxial layer, forming an oxide layer on the additional silicon epitaxial layer, forming an oxide layer on another semiconductor silicon substrate, forming a laminate by bringing into contact, at room temperature, the oxide layers thereby bonding together the substrates, etching the silicon substrate provided with the silicon epitaxial layers, with an isotropic etch to remove most of this silicon substrate, exposing the laminate to an anisotropic etch for this silicon substrate until the remainder of this silicon substrate is removed but only a part of the p-type epitaxial layer is removed and then exposing the resultant structure to an additional isotropic etch for the p-type epitaxial layer for a time sufficient only to remove only the remainder of the p-type epitaxial layer.
    • 通过一种方法形成绝缘体上硅材料,该方法包括以下步骤:在半导体硅衬底的表面上形成掺杂硼和较高浓度的锗的p型硅外延层,形成另外的硅外延 在所述p型硅外延层上形成氧化物层,在另外的硅外延层上形成氧化物层,在另一半导体硅衬底上形成氧化物层,通过在室温下与氧化层接触从而形成层压体, 衬底,蚀刻具有硅外延层的硅衬底,用各向同性蚀刻去除大部分该硅衬底,将该层压体暴露于该硅衬底的各向异性蚀刻,直到除去该硅衬底的其余部分, 去除p型外延层,然后将所得结构暴露于用于p型外延的附加各向同性蚀刻 层的时间足以仅去除p型外延层的剩余部分。