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    • 8. 发明申请
    • ELECTROLUMINESCENT DEVICE AND MANUFACTURING METHOD THEREOF
    • 电致发光器件及其制造方法
    • US20150325632A1
    • 2015-11-12
    • US14416904
    • 2014-06-26
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Hongfei CHENGYuxin ZHANG
    • H01L27/32
    • H01L27/3258H01L27/322H01L27/3248H01L27/3253H01L51/0024H01L2227/323H01L2251/301H01L2251/558
    • An electroluminescent device and manufacturing method thereof are provided. The electroluminescence device comprises an array substrate (10). The array substrate (10) comprises a substrate (11); and a thin film transistor (12), a protection layer (13) and a connection electrode (14) provided in turn on the substrate (11). The protection layer (13) covers the thin film transistor (12); and the connection electrode (14) is provided on the protection layer (13). The protection layer (13) below the connection electrode (14) protrudes towards a side away from the substrate (11) to form a boss (131). The protection layer (13) comprises a via hole (132) provided at a position corresponding to a drain electrode (122) of the thin film transistor (12). The connection electrode (14) is connected with the drain electrode (122) of the thin film transistor (12) through the via hole (132). The electroluminescent device and manufacturing method thereof shorten the film formation time, reduce the etching difficulty and accordingly improves the production efficiency in the process of manufacturing the connection electrode while the reliability of electrical connection between a thin film transistor and a second electrode is improved.
    • 提供一种电致发光器件及其制造方法。 电致发光器件包括阵列衬底(10)。 阵列基板(10)包括基板(11); 以及依次设置在基板(11)上的薄膜晶体管(12),保护层(13)和连接电极(14)。 保护层(13)覆盖薄膜晶体管(12); 并且所述连接电极(14)设置在所述保护层(13)上。 连接电极(14)下方的保护层(13)向远离基板(11)的一侧突出以形成凸台(131)。 保护层(13)包括设置在对应于薄膜晶体管(12)的漏极(122)的位置处的通孔(132)。 连接电极(14)通过通孔(132)与薄膜晶体管(12)的漏电极(122)连接。 电致发光器件及其制造方法缩短了成膜时间,降低了蚀刻困难,并且因此在制造连接电极的过程中提高了生产效率,同时提高了薄膜晶体管和第二电极之间的电连接的可靠性。