专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20220199939A1 Display Panel and Manufacture Method Thereof, and Display Apparatus 有权
公开(公告)号：US20220199939A1
公开(公告)日：2022-06-23
申请号：US17274324
申请日：2020-06-12
申请人： Hefei Xinsheng Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
发明人： Xinwei Gao , Dacheng Zhang , Lang Liu , Chen Xu
IPC分类号： H01L51/52 , H01L27/32 , H01L51/56
摘要： A display panel and a manufacture method thereof, and a display apparatus are provided. The display panel includes an array substrate, an encapsulation cover plate and a plurality of organic layers. The display region includes a plurality of pixels, each pixel includes a plurality of sub-pixels; each sub pixel includes a light-emitting device. The encapsulation cover plate is opposite to the array substrate and includes a first base substrate and a plurality of organic layers on a side of the first base substrate close to the array substrate. The frame sealant is in the non-display region and adheres the array substrate and the encapsulation cover plate; a gap region is between an organic layer of the plurality of the organic layers closest to the frame sealant, the gap region separates the organic layer closest to the frame sealant from the frame sealant; the gap region is in the non-display region.

2. 发明授权

US11256007B2 Optical brightening structure, preparation method therefor, and electronic device 有权
公开(公告)号：US11256007B2
公开(公告)日：2022-02-22
申请号：US16321178
申请日：2018-04-26
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Xinwei Gao
IPC分类号： G02B5/02 , B29D11/00
摘要： An optical brightness enhancement structure and a manufacturing method thereof and an electronic device are provided. The method for manufacturing an optical brightness enhancement structure includes: providing a light-transmissive carrier, and forming a buffer layer on a first surface of the light-transmissive carrier; forming a plurality of microstructures for converging light on a surface of the buffer layer away from the light-transmissive carrier; and surface energy of each of the microstructures is greater than surface energy of the buffer layer.

3. 发明授权

US11245087B2 Display substrate and its manufacturing method 有权
公开(公告)号：US11245087B2
公开(公告)日：2022-02-08
申请号：US16640050
申请日：2019-07-24
申请人： BOE Technology Group Co., Ltd.
发明人： Xinwei Gao , Peng Li , Dandan Zang , Qihe Chen , Xiaoning Liu
IPC分类号： H01L29/08 , H01L51/52 , H01L51/50 , H01L51/56
摘要： Disclosed herein is a display substrate comprising: first electrode; an auxiliary electrode; a first layer of an electrically insulating material over the auxiliary electrode, wherein the first layer does not cover a first portion of a sidewall of the auxiliary electrode; a second layer of a material that exhibits electroluminescence (EL), wherein the second layer is in electric contact with the first electrode and does not cover the first portion of the sidewall; a second electrode in electric contact with the second layer and in electric contact with the auxiliary electrode at the first portion of the sidewall.

4. 发明申请

US20210014625A1 COMPOSITE ELECTRODE, ACOUSTIC SENSOR USING THE SAME, AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20210014625A1
公开(公告)日：2021-01-14
申请号：US16305229
申请日：2018-03-27
申请人： BOE TECHNOLOGY GROUP CO., LTD. , Hefei Xinsheng Optoelectronics Technology Co., Ltd.
发明人： Rui Peng , Qinghe Wang , Xiang Wan , Xinwei Gao , Xinxin Wang , Zhaokang Fan
IPC分类号： H04R31/00 , H04R19/00
摘要： The present disclosure provides a composite electrode, an acoustic sensor using the composite electrode, and a manufacturing method of the composite electrode. The composite electrode includes a conductive layer, and a semiconductor high-molecular polymer layer formed on the conductive layer. The semiconductor high-molecular polymer layer has a three-dimensional mesh structure. The acoustic sensor includes a base; the above-mentioned composite electrode formed on the base; an organic layer formed on the composite electrode; and a top electrode formed on the organic layer.

5. 发明申请

US20160359142A1 PIXEL STRUCTURE, DISPLAY DEVICE AND MANUFACTURING METHOD OF PIXEL STRUCTURE 有权
标题翻译：像素结构，显示设备和像素结构的制造方法
公开(公告)号：US20160359142A1
公开(公告)日：2016-12-08
申请号：US14912633
申请日：2015-07-21
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Lujiang Huangfu , Wenyu Ma , Xinwei Gao , Liangjian Li , Can Zhang
IPC分类号： H01L51/52 , H01L51/00 , H01L27/32
CPC分类号： H01L51/5271 , H01L27/32 , H01L27/3246 , H01L27/3283 , H01L51/001 , H01L51/0011 , H01L51/5218 , H01L2227/323 , H01L2251/5307 , H01L2251/533
摘要： A pixel structure, a display device having the pixel structure and a manufacturing method of the pixel structure are disclosed. The pixel structure comprises: a first insulation layer; a luminescent unit disposed on the first insulation layer and comprising a first electrode layer, a luminescent layer and a second electrode layer; a pixel defining layer configured for defining a pixel aperture, in which the luminescent unit is disposed; and a reflective assembly disposed around the pixel defining layer so as to reflect light entering the pixel defining layer from the luminescent layer to exit from an exit surface of the pixel structure. The reflective assembly is provided to reflect the light entering the pixel defining layer from the luminescent layer, so as to exit from the exit surface of the pixel structure. As a result, the light beams entering the pixel defining layer may be converted into effective beams for the pixel structure, thereby improving the display effect and reducing light dissipation.
摘要翻译：公开了像素结构，具有像素结构的显示装置和像素结构的制造方法。像素结构包括：第一绝缘层; 布置在所述第一绝缘层上并包括第一电极层，发光层和第二电极层的发光单元; 配置用于限定发光单元的像素孔径的像素限定层; 以及反射组件，其设置在所述像素限定层周围，以便反射从所述发光层进入所述像素限定层的光从所述像素结构的出射表面离开。反射组件被提供以从发光层反射进入像素限定层的光，以便从像素结构的出射表面离开。结果，进入像素限定层的光束可以被转换为用于像素结构的有效光束，从而提高显示效果并减少光散射。

6. 发明授权

US11239442B2 Display panel and display device 有权
公开(公告)号：US11239442B2
公开(公告)日：2022-02-01
申请号：US16649531
申请日：2019-06-06
申请人： HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
发明人： Dandan Zang , Xinwei Gao , Peng Li , Wentong Huang
IPC分类号： H01L51/52 , H01L27/32
摘要： A display panel includes a base substrate including a first surface; another base substrate including a second surface disposed face the first surface; a first insulating layer disposed above the first surface of the base substrate, a plurality of grooves being disposed in a surface of the first insulating layer away from the base substrate; a first conductive layer disposed at a side of the first insulating layer away from the base substrate, the first conductive layer at least covering bottom faces and side walls of the plurality of grooves; a plurality of support portions disposed above the second surface of the another base substrate; and a second conductive layer disposed at a side of the plurality of support portions away from the another base substrate, the second conductive layer at least covering surfaces of the plurality of support portions facing away from the another base substrate and side faces of the plurality of support portions. Each support portion is embedded into a respective one of the plurality of grooves, and the first conductive layer is in electrical contact with the second conductive layer at the bottom faces and side walls of the plurality of grooves.

7. 发明授权

US11121337B2 OLED display substrate and method for manufacturing the same, display device and packaging method thereof 有权
公开(公告)号：US11121337B2
公开(公告)日：2021-09-14
申请号：US16075243
申请日：2018-02-08
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Xinwei Gao
IPC分类号： H01L51/50 , H01L51/52 , H01L51/00 , H01L51/56
摘要： Disclosed is a method for manufacturing an OLED display substrate, including: providing an substrate; forming a first electrode layer on the substrate; forming an initial solid buffer layer with a material including a component having an azobenzene group on the first electrode layer; liquefying the initial solid buffer layer into a liquid buffer layer by irradiating it with ultraviolet light; curing the liquid buffer layer to obtain a final solid buffer layer by irradiating it with visible light, wherein the final solid buffer layer has a HOMO energy level between −6 eV and −4.5 eV and a LUMO energy level between −3 eV and −2 eV; forming a light emitting functional layer on the final solid buffer layer; and forming a second electrode layer on the light emitting functional layer. An OLED display substrate, a method for packaging a display device, and a display device are also provided.

8. 发明授权

US09685634B2 Pixel structure, display device and manufacturing method of pixel structure 有权
公开(公告)号：US09685634B2
公开(公告)日：2017-06-20
申请号：US14912633
申请日：2015-07-21
申请人： BOE Technology Group Co., Ltd.
发明人： Lujiang Huangfu , Wenyu Ma , Xinwei Gao , Liangjian Li , Can Zhang
IPC分类号： H01L33/00 , H01L51/52 , H01L27/32 , H01L51/00
CPC分类号： H01L51/5271 , H01L27/32 , H01L27/3246 , H01L27/3283 , H01L51/001 , H01L51/0011 , H01L51/5218 , H01L2227/323 , H01L2251/5307 , H01L2251/533
摘要： A pixel structure, a display device having the pixel structure and a manufacturing method of the pixel structure are disclosed. The pixel structure comprises: a first insulation layer; a luminescent unit disposed on the first insulation layer and comprising a first electrode layer, a luminescent layer and a second electrode layer; a pixel defining layer configured for defining a pixel aperture, in which the luminescent unit is disposed; and a reflective assembly disposed around the pixel defining layer so as to reflect light entering the pixel defining layer from the luminescent layer to exit from an exit surface of the pixel structure. The reflective assembly is provided to reflect the light entering the pixel defining layer from the luminescent layer, so as to exit from the exit surface of the pixel structure. As a result, the light beams entering the pixel defining layer may be converted into effective beams for the pixel structure, thereby improving the display effect and reducing light dissipation.

9. 发明授权

US09660215B2 Display panel and encapsulation method thereof 有权
公开(公告)号：US09660215B2
公开(公告)日：2017-05-23
申请号：US14891915
申请日：2015-04-13
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Xinwei Gao , Dan Wang , Rui Hong , Chao Kong
IPC分类号： H01L51/56 , H01L51/52
CPC分类号： H01L51/524 , H01L51/52 , H01L51/5237 , H01L51/5246 , H01L51/56
摘要： Embodiments of the present invention disclose a display panel and an encapsulation method thereof, and relate to the field of display technology. The display panel comprises a first substrate and a second substrate which are disposed in opposition to each other. The first substrate and the second substrate are encapsulated by a sealant. In a non-display area of the display panel, a first adsorption layer is disposed on one of the first substrate and the second substrate, and a second adsorption layer is disposed on the other of the first substrate and the second substrate. The first adsorption layer and the second adsorption layer may be attracted to each other by magnetic force. Embodiments of the present invention can effectively avoid the separation of the first substrate and the second substrate due to the stress released during the process of melting the sealant, thereby improving the problem of poor encapsulation caused thereby.

10. 发明授权

US11575107B2 Packaging structure, packaging method and display apparatus 有权
公开(公告)号：US11575107B2
公开(公告)日：2023-02-07
申请号：US17256085
申请日：2020-04-17
申请人： HEFEI BOE JOINT TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
发明人： Wenbin Jia , Xinwei Gao , Peng Li
IPC分类号： H01L51/52 , H01L51/56
摘要： A packaging structure, a packaging method, and a display apparatus are disclosed. The packaging structure includes: a first substrate and a second substrate opposite to each other; a plurality of first sealing frames located between the first substrate and the second substrate, wherein the first substrate, the second substrate and the plurality of first sealing frames enclose a plurality of sealed cavities not communicating with each other, and each of the sealed cavities is configured to package at least one to-be-packaged unit of a to-be-packaged device; and a first filler located in the sealed cavity.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式