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1. 发明授权

US09761826B2 Display panel and method of manufacturing the same, and display device 有权
公开(公告)号：US09761826B2
公开(公告)日：2017-09-12
申请号：US14906319
申请日：2015-05-04
申请人： BOE Technology Group Co., Ltd.
发明人： Donghui Yu , Chun-Jan Wang , Huai-Ting Shih
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/5246 , H01L51/5259 , H01L51/56
摘要： Embodiments of the present disclosure relates to a display panel and a method of manufacturing the same, and a display device. The display panel comprises: a first substrate and a second substrate, at least one of which is provided with a first sealant, a second sealant and a third sealant; the first sealant is arranged at an outer side of the package region away from the display region, the second sealant is arranged inside the first sealant and at least within a peripheral region at a corner of the display region, and the third sealant is arranged inside the first sealant and fills the package region and the display region except parts thereof where the first sealant and the second sealant are arranged. With the display panel and the method of manufacturing the same, and the display device provided according to embodiments of the present disclosure, the display panel can be appropriately packaged by providing water resistive and/or water absorptive materials outside corners of the display region, so that infiltration of external moisture into the display region to adversely affect display performance of the display region can be alleviated while ensuring light transmittance of the display region, thereby improving image display quality.

2. 发明申请

US20160329519A1 Display Panel And Method of Manufacturing the Same, And Display Device 有权
标题翻译：显示面板及其制造方法及显示装置
公开(公告)号：US20160329519A1
公开(公告)日：2016-11-10
申请号：US14906319
申请日：2015-05-04
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Donghui Yu , Chun-Jan Wang , Huai-Ting Shih
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/5246 , H01L51/5259 , H01L51/56
摘要： The present disclosure relates to a display panel and a method of manufacturing the same, and a display device. The display panel comprises: a first substrate and a second substrate, at least one of which is provided with a first sealant, a second sealant and a third sealant; the first sealant is arranged at an outer side of the package region away from the display region, the second sealant is arranged inside the first sealant and at least within a peripheral region at a corner of the display region, and the third sealant is arranged inside the first sealant and fills the package region and the display region except parts thereof where the first sealant and the second sealant are arranged. With the display panel and the method of manufacturing the same, and the display device provided according to the present disclosure, the display panel can be appropriately packaged by providing water resistive and/or water absorptive materials outside corners of the display region, so that infiltration of external moisture into the display region to adversely affect display performance of the display region can be alleviated while ensuring light transmittance of the display region, thereby improving image display quality.
摘要翻译：显示面板及其制造方法技术领域本发明涉及显示面板及其制造方法以及显示装置。显示面板包括：第一基板和第二基板，其中至少一个设置有第一密封剂，第二密封剂和第三密封剂; 所述第一密封剂配置在所述封装区域的远离所述显示区域的外侧，所述第二密封剂配置在所述第一密封剂的内部，并且至少在所述显示区域的角部的周边区域内，所述第三密封剂配置在第一密封剂并填充除了其中布置有第一密封剂和第二密封剂的部分之外的包装区域和显示区域。通过显示面板及其制造方法以及根据本公开的显示装置，可以通过在显示区域的角落外提供水阻力和/或吸水材料来适当地包装显示面板，使得渗透可以在确保显示区域的透光率的同时减轻显示区域的显示区域的不良影响，从而提高图像显示质量。

3. 发明授权

US09960384B2 Organic light emitting diode packaging method and packaging structure and device having the same 有权
公开(公告)号：US09960384B2
公开(公告)日：2018-05-01
申请号：US15121889
申请日：2015-10-14
申请人： BOE Technology Group Co., Ltd.
发明人： Chengyuan Luo , Chun-Jan Wang
IPC分类号： H01L51/52 , H01L51/56 , H01L51/00
CPC分类号： H01L51/5253 , H01L51/0097 , H01L51/5246 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/5315 , H01L2251/5338 , Y02E10/549
摘要： The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.

4. 发明申请

US20170155083A1 ORGANIC LIGHT EMITTING DIODE PACKAGING METHOD AND PACKAGING STRUCTURE AND DEVICE HAVING THE SAME 有权
公开(公告)号：US20170155083A1
公开(公告)日：2017-06-01
申请号：US15121889
申请日：2015-10-14
申请人： BOE Technology Group Co., Ltd.
发明人： Chengyuan Luo , Chun-Jan Wang
IPC分类号： H01L51/52 , H01L51/00 , H01L51/56
CPC分类号： H01L51/5253 , H01L51/0097 , H01L51/5246 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/5315 , H01L2251/5338 , Y02E10/549
摘要： The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.

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