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1. 发明授权

US11537253B2 Touch substrate and manufacturing method therefor, touch display substrate, and touch display device 有权
公开(公告)号：US11537253B2
公开(公告)日：2022-12-27
申请号：US17417478
申请日：2020-09-14
申请人： CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
发明人： Jun Yan , Xiangdan Dong , Fan He , Lingran Wang , Bo Cheng , Mengmeng Du , Bo Zhang
IPC分类号： G06F3/044 , G06F3/041
摘要： A touch substrate and a manufacturing method thereof, a touch display substrate and a touch display device are provided. The touch substrate includes: a touch structure, a first ground line, and at least one second ground line. The touch structure includes a sensor pattern and a touch line, the sensor pattern includes a plurality of first sensor patterns and a plurality of second sensor patterns, and the touch line includes a plurality of first touch lines and a plurality of second touch lines, the first sensor patterns is connected with the first touch line, and the second sensor pattern is connected with the second touch line. The first ground line is located at a periphery of the touch structure. The at least one second ground line is located at a side of the first ground line facing away from the touch structure.

2. 发明申请

US20220304154A1 DISPLAY PANEL AND DISPLAY APPARATUS 有权
公开(公告)号：US20220304154A1
公开(公告)日：2022-09-22
申请号：US17428628
申请日：2020-10-22
申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
发明人： Donghui Tian , Bo Zhang , Zhiwen Chu , Rong Wang , Yulong Wei
IPC分类号： H05K1/11
摘要： A display panel having a bonding region for bonding a flexible printed circuit in a peripheral region is provided. The display panel includes a plurality of first signal lines on a base substrate; and a plurality of bonding pins on the base substrate and in the bonding region. The plurality of bonding pins include a plurality of first bonding pins respectively electrically connected to the plurality of first signal lines. The display panel further includes a plurality of connecting portions respectively connecting the plurality of first signal lines portions to the plurality of first bonding pin portions. A respective one of the plurality of first bonding pin portions and a respective one of the plurality of connecting portions are substantially parallel to each other, and are arranged at a substantially same inclined angle with respect to a respective one of the plurality of first signal line portions.

3. 发明授权

US11183467B2 Flexible circuit board, method for mounting the same, and display device 有权
公开(公告)号：US11183467B2
公开(公告)日：2021-11-23
申请号：US16029276
申请日：2018-07-06
申请人： BOE TECHNOLOGY GROUP CO., LTD. , Ordos Yuansheng Optoelectronics Co., Ltd.
发明人： Chunghao Cheng , Bo Zhang , Bin Zhao
IPC分类号： H05K1/02 , H01L23/00 , H01L23/498 , H01L27/12 , H01L21/48 , H01L27/32
摘要： A flexible circuit board, a display device and a method for mounting a flexible circuit board are disclosed. The flexible circuit board includes: a bendable portion, the flexible circuit board being bendable at the bendable portion to go into a bent state so as to be connected to a workpiece; and at least one opening in the bendable portion. In response to the bent state, a gap is formed between the bendable portion and the workpiece, and the at least one opening is in communication with the gap.

4. 发明授权

US11126036B2 Backlight module assembly, structural adjustment method thereof and display device 有权
公开(公告)号：US11126036B2
公开(公告)日：2021-09-21
申请号：US16820771
申请日：2020-03-17
申请人： HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
发明人： Jiang Zhu , Hongchao He , Jianghui Zhan , Rui Wang , Yuxi Dong , Changjun Zhang , Bo Zhang , Dan Liu , Tongmin Liu
IPC分类号： G02F1/13357
摘要： The present disclosure provides a backlight module assembly, structural adjustment method thereof and display device. The backlight module assembly includes a plastic frame, a film and an adjustment sheet. The plastic frame is presented in a box shape with an opening on the top, and has side walls and a bottom wall, and a space enclosed by the side walls and the bottom wall being a mounting groove. The film is arranged on the bottom wall and received within the mounting groove. The adjustment sheet is arranged on an inner side of the side wall of the mounting groove.

5. 发明授权

US10458636B2 Backlight source and control method thereof, a backlight module, and a display device 有权
公开(公告)号：US10458636B2
公开(公告)日：2019-10-29
申请号：US15577298
申请日：2017-06-07
申请人： Boe Technology Group Co., Ltd.
发明人： Bo Zhang
IPC分类号： F21V23/00 , F21Y115/10 , F21Y107/20 , F21Y115/30 , F21Y115/15
摘要： The present invention provides a backlight source for use in a display device, comprising: a substrate; a plurality of carriers arranged on the substrate in an array, the carrier comprising a bottom surface in contact with the substrate, a top surface parallel to the substrate and a side surface connected between the top surface and the bottom surface; light emitting elements arranged on the carrier, comprising at least one first light emitting element arranged on the top surface of the carrier for emitting collimated light perpendicular to the substrate, and at least one second light emitting element arranged on the side surface of the carrier for emitting scattered light to a plurality of angles; and a controller, configured to control at least one first light emitting element to turn on and all second light emitting elements to turn off in response to a first display mode of the display device and to control at last one first light emitting element to turn on and at least one second light emitting element to turn on in response to a second display mode of the display device. The backlight source of the present invention can realize anti-peeping display of the display and switching between the anti-peeping display and normal display.

6. 发明授权

US10396245B2 Light emitting element having a conductive pattern and fabrication method thereof 有权
公开(公告)号：US10396245B2
公开(公告)日：2019-08-27
申请号：US15545176
申请日：2017-02-07
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Bo Zhang
IPC分类号： H01L51/50 , H01L33/36 , H01L33/00 , H01L27/15 , H01L33/08 , H01L33/14 , H01L25/075 , H01L33/62 , H01L33/58
摘要： The present invention discloses a light emitting element and a fabrication method thereof. The light emitting element includes: an anode electrode, a hole transport layer, a light emitting layer, an electron transport layer and a cathode electrode, all of the light emitting units are divided into a plurality of light emitting sets, each light emitting set includes at least two light emitting units and the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode. In the technical solutions of the present invention, all of the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode, thus effectively reducing the number of the cathode electrodes.

7. 发明授权

US10221345B2 Sealing adhesive, its preparation method, and liquid crystal display device 有权
公开(公告)号：US10221345B2
公开(公告)日：2019-03-05
申请号：US15560419
申请日：2017-03-30
申请人： BOE Technology Group Co., Ltd. , Hefei Xinsheng Optoelectronics Technology Co., Ltd.
发明人： Bo Zhang , Cong Tan , Chengyong Zhan
IPC分类号： C09J163/00 , G02F1/1339 , C08G59/14 , C09K3/10 , C09J11/06
摘要： Disclosed are a sealing adhesive and a method of making the same, and a liquid crystal display device. The sealing adhesive includes a modified epoxy compound obtained by chemical bonding of a piperidine compound with an epoxy compound, wherein the modified epoxy compound contains a nitrogen-hydrogen bond. The method of preparing the above sealing adhesive includes: subjecting a piperidine compound and an epoxy compound to a chemical reaction to obtain a modified epoxy compound; and mixing about 10 to 90 parts by eight of the modified epoxy compound, about 10 to 90 parts by weight of an acrylic resin, about 2 to 5 parts by weight of a filler, about 5 to 10 parts by weight of a heat curing agent and about 3 to 10 parts by weight of a photoinitiator to obtain a sealing adhesive. The liquid crystal display device includes the sealing adhesive described above.

8. 发明授权

US10107925B2 Smart terminal 有权
公开(公告)号：US10107925B2
公开(公告)日：2018-10-23
申请号：US15544904
申请日：2017-02-06
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Bo Zhang
IPC分类号： G08B17/12 , G01T7/12 , G08B21/18
摘要： The present disclosure provides a smart terminal, including a radioactive detector, a communication device, an interactive device and a processor. The radioactivity detector is configured to detect a radioactive parameter and send a detection value of the radioactive parameter to the processor. The interactive device is configured to receive an operation instruction of a user and send the operation instruction to the processor. The communication device is configured to establish a connection and pair with a mobile terminal having a wireless communication function through a short range wireless communication mode. The processor is configured to establish a mapping between the interactive device of the smart terminal and an interactive device of the mobile terminal, and remotely control the interactive device of the mobile terminal according to the operation instruction received by the interactive device of the smart terminal.

9. 发明授权

US10008690B2 Method and system of flattening a surface formed by sealant of packaging cover plate, and packaging method 有权
公开(公告)号：US10008690B2
公开(公告)日：2018-06-26
申请号：US14743472
申请日：2015-06-18
申请人： BOE TECHNOLOGY GROUP CO., LTD. , Ordos Yuansheng Optoelectronics Co., Ltd.
发明人： Zhiliang Jiang , Minghua Xuan , Renrong Gai , Bo Zhang , Fei Chen
IPC分类号： C03C25/68 , H01L51/52 , H01L21/428 , H01L21/02 , H01L21/449
CPC分类号： H01L51/5246 , H01L21/02675 , H01L21/02686 , H01L21/428 , H01L21/449
摘要： The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.

10. 发明授权

US09966340B2 Flexible substrate for packaging and package 有权
公开(公告)号：US09966340B2
公开(公告)日：2018-05-08
申请号：US15319565
申请日：2016-02-16
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Bo Zhang , Wenbo Li
IPC分类号： H01L23/06 , H01L23/538 , H01L23/00 , H01L25/065
CPC分类号： H01L23/5387 , G09F9/301 , H01L23/5386 , H01L23/562 , H01L25/0655 , H01L27/12 , H05K1/028 , H05K2201/09263 , H05K2201/10287
摘要： The present invention provides a flexible substrate for packaging and a package. The flexible substrate for packaging includes a bendable region provided in a central region of the flexible substrate; chips provided at both sides of the bendable region and at both ends of the flexible substrate, respectively; and a wire provided to be connected between the chips and to pass through the bendable region. A portion of the wire corresponding to the bendable region is provided with an anti-stress structure, and the anti-stress structure is configured to release a tensile resistance and a compressive resistance when the bendable region is bent.

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