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    • 8. 发明授权
    • Selective epitaxy process control
    • 选择性外延过程控制
    • US09064960B2
    • 2015-06-23
    • US11669550
    • 2007-01-31
    • Andrew LamYihwan Kim
    • Andrew LamYihwan Kim
    • C30B25/04H01L29/78C30B23/04H01L21/02H01L29/165H01L29/66C30B35/00H01L21/8238
    • H01L29/7834C30B23/04C30B25/04C30B35/00H01L21/02529H01L21/02532H01L21/02573H01L21/0262H01L21/02636H01L21/823807H01L21/823814H01L29/165H01L29/6656H01L29/66636H01L29/7848
    • Methods of selectively and epitaxially forming a silicon-containing material on a substrate surface contained within a process chamber are provided. In one or more embodiments, the pressure in the process chamber is reduced during deposition of material on the substrate and increased during etching of material from the substrate. According to an embodiment, process gases are flowed into the chamber through first zone and a second zone to provide a ratio of the amount of gas flowed to the first zone and the amount of gas flowed to the second zone. In one or more embodiments, the first zone is an inner radial zone and the second zone is an outer radial zone, and ratio of inner zone gas flow to outer zone gas flow is less during deposition than during etching. According to one or more embodiments, the selective epitaxial process includes repeating a cycle of a deposition and then an etching process, and an optional purge until the desired thickness of an epitaxial layer is grown.
    • 提供在处理室内包含的衬底表面上选择性地和外延地形成含硅材料的方法。 在一个或多个实施例中,在材料沉积在衬底上时,处理室中的压力降低,并且在从衬底蚀刻材料期间增加。 根据实施例,工艺气体通过第一区域和第二区域流入腔室,以提供流入第一区域的气体量与流向第二区域的气体的量的比率。 在一个或多个实施例中,第一区域是内部径向区域,第二区域是外部径向区域,并且内部区域气体流与外部区域气体流量的比例在沉积期间比在蚀刻期间更小。 根据一个或多个实施例,选择性外延工艺包括重复沉积周期,然后重复蚀刻工艺,以及任选的清洗直到生长外延层的期望厚度。