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1. 发明申请

US20050285214A1 Integrated circuit chip that supports through-chip electromagnetic communication 有权
标题翻译：集成电路芯片，支持片上电磁通讯
公开(公告)号：US20050285214A1
公开(公告)日：2005-12-29
申请号：US11165809
申请日：2005-06-24
申请人： Ashok Krishnamoorthy , Arthur Zingher , Robert Drost
发明人： Ashok Krishnamoorthy , Arthur Zingher , Robert Drost
IPC分类号： H01L21/00 , H01L23/48 , H01L25/065 , H01L27/14 , H01L31/12
CPC分类号： G02B6/43 , H01L23/48 , H01L25/0652 , H01L25/0657 , H01L31/12 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.
摘要翻译：本发明的一个实施例提供一种集成电路芯片，其包括有源电路和信号焊盘所在的有源面以及与有源面相对的背面。集成电路芯片还包括电磁通孔，其有助于集成电路芯片上的信号焊盘与第二集成电路芯片上的信号焊盘之间的通信。电磁通孔将集成电路芯片的有源面上的信号焊盘连接到集成电路芯片的背面，使得集成电路芯片可以与集成电路芯片的背面相邻的第二集成电路芯片连通到第二集成电路芯片的主动面。此外，电磁通孔通过促进通过集成电路芯片的非导电信号来操作。

2. 发明申请

US20060095639A1 Structures and methods for proximity communication using bridge chips 审中-公开
标题翻译：使用桥接芯片的邻近通信的结构和方法
公开(公告)号：US20060095639A1
公开(公告)日：2006-05-04
申请号：US11264956
申请日：2005-11-01
申请人： Bruce Guenin , Arthur Zingher , Ronald Ho , Nyles Nettleton , Ashok Krishnamoorthy , John Cunningham
发明人： Bruce Guenin , Arthur Zingher , Ronald Ho , Nyles Nettleton , Ashok Krishnamoorthy , John Cunningham
IPC分类号： G06F13/36
CPC分类号： H01L23/48 , H01L25/0652 , H01L25/0655 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： One embodiment of the present invention provides a system that facilitates proximity communication using a bridge chip. This system includes a base chip with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The bridge chip is mounted to the base chip using a mounting, interconnection, and communication structure. The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.
摘要翻译：本发明的一个实施例提供一种促进使用桥接芯片的邻近通信的系统。该系统包括具有主动面的基本芯片，有源电路和信号垫位于该基板上，以及与主动面相对的背面。桥芯片使用安装，互连和通信结构安装到基座芯片。桥接芯片被定位成使得自由端靠近相邻的芯片，从而支持基本芯片和相邻芯片之间的邻近通信。

3. 发明申请

US20070152344A1 Engine with cable direct to outboard memory 有权
标题翻译：发动机带电缆直接舷外记忆
公开(公告)号：US20070152344A1
公开(公告)日：2007-07-05
申请号：US11325380
申请日：2006-01-03
申请人： Arthur Zingher , Ashok Krishnamoorthy
发明人： Arthur Zingher , Ashok Krishnamoorthy
IPC分类号： H01L23/52
CPC分类号： H01L23/48 , H01L25/0652 , H01L2924/0002 , H01L2924/12044 , H01L2924/3011 , H01L2924/00
摘要： A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface.
摘要翻译：器件包括具有第一表面和第二表面的第一半导体管芯，耦合到第一半导体管芯的电缆以及耦合到电缆的至少一个存储器件。第一半导体管芯被配置为通过使用靠近和/或耦合到第一表面的多个邻近连接器中的一个或多个的电容耦合进行通信。

4. 发明申请

US20070043894A1 Structures and methods for a flexible bridge that enables high-bandwidth communication 有权
标题翻译：灵活桥梁的结构和方法，可实现高带宽通信
公开(公告)号：US20070043894A1
公开(公告)日：2007-02-22
申请号：US11418985
申请日：2006-05-04
申请人： Arthur Zingher , Bruce Guenin , Ronald Ho , Robert Drost
发明人： Arthur Zingher , Bruce Guenin , Ronald Ho , Robert Drost
IPC分类号： G06F13/36
CPC分类号： H01L25/065 , H01L23/48 , H01L23/50 , H01L23/5383 , H01L23/5385 , H01L23/5386 , H01L23/5387 , H01L24/01 , H01L2924/14 , H01L2924/15787 , H05K1/147 , H05K3/222 , H01L2924/00
摘要： One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.
摘要翻译：本发明的一个实施例提供一种促进使用柔性桥的高带宽通信的系统。该系统包括具有有源电路和信号焊盘所在的有源面的芯片，以及具有有源电路和/或信号焊盘所在的表面的第二部件。柔性桥提供芯片的有源面与第二部件的表面之间的高带宽通信。通过将柔性电桥中的有线线路尺寸与芯片和第二组件上的电路和/或信号焊盘的尺寸相匹配，系统允许在芯片和第二部件之间的电路之间发送信号，而无需更改互连的规模，从而减轻传统芯片封装技术的可线性和带宽限制。

5. 发明申请

US20070023921A1 Structures and methods for an application of a flexible bridge 有权
标题翻译：应用柔性桥梁的结构和方法
公开(公告)号：US20070023921A1
公开(公告)日：2007-02-01
申请号：US11418986
申请日：2006-05-04
申请人： Arthur Zingher , Bruce Guenin , Ronald Ho , Robert Drost
发明人： Arthur Zingher , Bruce Guenin , Ronald Ho , Robert Drost
IPC分类号： H01L21/00 , H01L23/48
CPC分类号： H01L23/5387 , H01L23/48 , H01L25/0655 , H01L2224/16225 , H01L2225/06562 , H01L2924/01067 , H01L2924/15311 , H01R12/62 , H05K3/222 , H05K2201/1053 , H05K2201/10674
摘要： One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.
摘要翻译：本发明的一个实施例提供一种促进使用柔性桥的高带宽通信的系统。该系统包括具有有源电路和信号焊盘所在的有源面的芯片，以及具有有源电路和/或信号焊盘所在的表面的第二部件。柔性桥提供芯片的有源面与第二部件的表面之间的高带宽通信。该柔性桥提供柔性连接，允许芯片相对于第二部件以六个自由度移动，而不影响芯片和第二部件之间的通信。因此，柔性桥允许芯片和第二部件通信，而不需要芯片和第二部件之间的精确对准。

6. 发明申请

US20060017147A1 Method and apparatus for using capacitively coupled communication within stacks of laminated chips 有权
标题翻译：在层叠芯片堆叠内使用电容耦合通信的方法和装置
公开(公告)号：US20060017147A1
公开(公告)日：2006-01-26
申请号：US10966510
申请日：2004-10-14
申请人： Robert Drost , Ronald Ho , Arthur Zingher
发明人： Robert Drost , Ronald Ho , Arthur Zingher
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/48 , H01L25/0652 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of laminated chip assemblies, wherein the semiconductor chips within the laminated chip assembly communicate with each other through electrically conductive connections. Next, laminated chip assemblies are stacked together to form a stack of semiconductor chips without permanently bonding the laminated chip assemblies together, wherein the laminated chip assemblies communicate with each other using capacitive coupling.
摘要翻译：本发明的一个实施例提供了组装半导体芯片的技术。首先，将多个半导体芯片永久地层叠在一起成为多个层叠芯片组件，其中层叠芯片组件内的半导体芯片通过导电连接彼此连通。接下来，层压芯片组件堆叠在一起以形成半导体芯片的堆叠，而不将层叠的芯片组件永久地接合在一起，其中层压芯片组件使用电容耦合彼此连通。

7. 发明授权

US08107245B1 Proximity active connector and cable 有权
标题翻译：接近有源连接器和电缆
公开(公告)号：US08107245B1
公开(公告)日：2012-01-31
申请号：US11165996
申请日：2005-06-24
申请人： Ashok V. Krishnamoorthy , Arthur Zingher , Danny Cohen , Robert Drost
发明人： Ashok V. Krishnamoorthy , Arthur Zingher , Danny Cohen , Robert Drost
IPC分类号： H05K7/00
CPC分类号： H03K3/037 , H01L23/48 , H01L2225/06527 , H01L2924/00013 , H01L2924/0002 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A system that facilitates high-speed signaling between integrated circuit chips comprising a cable, wherein the cable includes a first and second active connector that facilitate communication between integrated circuit chips. The first active connector includes a capacitive receiver which receives a signal from a corresponding capacitive transmitter located on a first integrated circuit chip through capacitive coupling, and a transmitter which transmits a signal received by the capacitive receiver, through the interconnect medium within the cable, to the second active connector. The second active connector includes a receiver which receives a signal transmitted through the interconnect medium of the cable, and a capacitive transmitter which transmits the signal to a corresponding capacitive receiver located on a second integrated circuit chip through capacitive coupling. Note that the capacitive receivers are not permanently attached to the capacitive transmitters, whereby the cable can be easily remated to other integrated circuit chips.
摘要翻译：一种促进包括电缆的集成电路芯片之间的高速信令的系统，其中电缆包括促进集成电路芯片之间的通信的第一和第二有源连接器。第一有源连接器包括容性接收器，其通过电容耦合从位于第一集成电路芯片上的对应的电容式发射器接收信号，以及发射机，其通过电缆中的互连介质传送由电容接收器接收的信号，第二个有源连接器。第二有源连接器包括接收通过电缆的互连介质传输的信号的接收器，以及通过电容耦合将信号发送到位于第二集成电路芯片上的对应的电容接收器的电容式发射器。请注意，电容式接收器不会永久性地连接到电容式发射器，由此电缆可以轻松地重新连接到其他集成电路芯片。

8. 发明申请

US20070101227A1 DIGITAL MEASURING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT CHIP OPERATING PARAMETERS 有权
标题翻译：用于集成电路芯片操作参数的数字测量系统和方法
公开(公告)号：US20070101227A1
公开(公告)日：2007-05-03
申请号：US11557745
申请日：2006-11-08
申请人： Herschel Ainspan , Philip Emma , Rick Rand , Arthur Zingher
发明人： Herschel Ainspan , Philip Emma , Rick Rand , Arthur Zingher
IPC分类号： G01R31/30 , G06F11/00
CPC分类号： G01K1/028 , G01K7/42 , G01K2219/00
摘要： This invention relates to digitally measuring operating parameters, for example, temperature, within a semiconductor chip and making those measurements internally available to hardware, firmware, and software.
摘要翻译：本发明涉及数字测量半导体芯片内的操作参数，例如温度，并且使这些测量在内部可用于硬件，固件和软件。

9. 发明申请

US20060017150A1 Multi-chip module and single-chip module for chips and proximity connectors 有权
公开(公告)号：US20060017150A1
公开(公告)日：2006-01-26
申请号：US11183047
申请日：2005-07-15
申请人： Arthur Zingher , Bruce Guenin , Edward Follmer
发明人： Arthur Zingher , Bruce Guenin , Edward Follmer
IPC分类号： H01L23/48 , H01L23/34 , H01L23/02
CPC分类号： H04B5/0012 , H01L23/48 , H01L23/50 , H01L2224/32 , H01L2924/1461 , H01L2924/19041 , H01L2924/19104 , H01L2924/3011 , H01L2924/00
摘要： A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.

10. 发明授权

US5299939A Spring array connector 失效
标题翻译：弹簧阵列连接器
公开(公告)号：US5299939A
公开(公告)日：1994-04-05
申请号：US847970
申请日：1992-03-05
申请人： George F. Walker , Arthur Zingher
发明人： George F. Walker , Arthur Zingher
IPC分类号： H01R13/24 , H01R12/71 , H01R13/33 , H01R24/00 , H01R9/09
CPC分类号： H01R13/33 , H01R12/57 , H01R12/714 , H01R13/24
摘要： A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from the other conducting lines. All of the springs in the spring array are fabricated simultaneously. Spring embodiments include sine, helix, cantilever and buckling beam shapes in sheet and wire forms.
摘要翻译：弹簧阵列连接器包括具有多个导电线，电触头和电端子层的多个弹簧的单一弹性层。阵列的每个弹簧都是可独立弯曲的，并且每条导线与其它导线电隔离。弹簧阵列中的所有弹簧都是同时制造的。弹簧实施例包括片材和线材形式的正弦，螺旋，悬臂和屈曲梁形状。

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