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    • 4. 发明授权
    • LED module having a platform with a central recession
    • LED模块具有中央衰退的平台
    • US08716730B2
    • 2014-05-06
    • US12935559
    • 2009-04-01
    • Yanqi WangHiroaki KawaguchiFriedrich Wagner
    • Yanqi WangHiroaki KawaguchiFriedrich Wagner
    • H01L33/60
    • H01L33/62H01L24/73H01L33/486H01L33/54H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/48465H01L2224/73265H01L2924/01068H01L2924/10253H01L2924/14H01L2924/00014H01L2924/00H01L2924/00012
    • An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform. A second conducting path, electrically isolated from the first conducting path, leads from a second electrode of the LED chip across the side wall of the recession to the to surface of the platform and from there across a lateral wall of the platform to the back side of the platform.
    • LED模块包括具有凹陷的平台,其中所述凹部具有带有底部的中心部分和围绕所述中心部分的放大部分。 LED芯片布置在中心部分的底部。 接合线从LED芯片引出到放大部分的底部,以便接触LED芯片的第一电极。 在一个实施例中,接合线通过从扩大部分的底部穿过平台引导到平台的后侧的通过接触端电连接到平台的后侧。 在另一个实施例中,第一导电路径从LED芯片的第一电极跨越凹陷的侧壁穿过平台的表面,并且从那里穿过平台的侧壁到达平台的背面。 与第一导电路径电隔离的第二导电路径从LED芯片的第二电极穿过凹陷的侧壁穿过平台的表面,并从该平台的侧壁穿过平台的侧壁 的平台。