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    • 1. 发明授权
    • Method for bonding components made of material with a high silicic acid content
    • 用于将由硅酸含量高的材料制成的部件接合的方法
    • US07937968B2
    • 2011-05-10
    • US11038789
    • 2005-01-18
    • Armin MaulThorsten HerbertJürgen WeberWaltraud WerdeckerRolf Gerhardt
    • Armin MaulThorsten HerbertJürgen WeberWaltraud WerdeckerRolf Gerhardt
    • C03B19/01C03B19/06C03C17/02C03C27/00
    • C03C1/008C03B19/06C03B37/0126C03C27/06C03C27/10
    • In a known method for bonding components made of material with a high silicic acid content by means of a substance to substance bond, a SiO2-containing bonding mass is formed between connecting surfaces of the components. In order to provide for cost-efficient manufacture of a thermally stable composite, the invention proposes to generate a SiO2-containing bonding mass that is generic with regard to the material with a high silicic acid content, comprising the following procedural steps: provision of a slurry containing amorphous SiO2 particles; formation of a slurry mass between the connecting surfaces which are fixed in position with regard to each other; drying of the slurry mass; and solidification of the slurry mass by heating under formation of the SiO2-containing bonding mass. A component assembly manufactured according to the method of the invention shows high temperature resistance and thermal fatigue resistance and can also be used in contamination-sensitive applications. The component assembly is characterized by an amorphous SiO2-containing bonding mass, whose chemical composition is generic with regard to the material with the high silicic acid content of the basic material of the components, whereby the specific density of the SiO2-containing bonding mass is at least 2.0 g/cm3.
    • 在通过物质与物质接合的用于将由高硅酸含量的材料制成的部件的已知方法中,在部件的连接表面之间形成含SiO 2的粘结物质。 为了提供热稳定复合材料的成本有效的制造,本发明提出产生相对于具有高硅酸含量的材料而言通用的含SiO 2的粘结物质,包括以下程序步骤:提供 含有无定形SiO 2颗粒的浆料; 在连接表面之间形成相对于彼此固定的位置的浆料; 干燥浆料; 并在形成含SiO 2的结合物质的同时通过加热固化浆料。 根据本发明的方法制造的组件组件显示出耐高温性和耐热疲劳性,并且还可以用于污染敏感的应用中。 组分组合物的特征在于含有非晶态SiO 2的结合物质,其化学组成对于组分的碱性材料的高硅酸含量的材料而言是通用的,由此含SiO 2的粘合物质的比密度为 至少2.0g / cm 3。
    • 2. 发明申请
    • Method for bonding components made of material with a high silicic acid content, and assembly composed of such components
    • 用于将由硅酸含量高的材料制成的部件接合的方法以及由这些部件组成的组件
    • US20060046075A1
    • 2006-03-02
    • US11038789
    • 2005-01-18
    • Armin MaulThorsten HerbertJurgen WeberWaltraud WerdeckerRolf Gerhardt
    • Armin MaulThorsten HerbertJurgen WeberWaltraud WerdeckerRolf Gerhardt
    • C03B8/00B32B17/06B32B19/00
    • C03C1/008C03B19/06C03B37/0126C03C27/06C03C27/10
    • In a known method for bonding components made of material with a high silicic acid content by means of a substance to substance bond, a SiO2-containing bonding mass is formed between connecting surfaces of the components. In order to provide for cost-efficient manufacture of a thermally stable composite, the invention proposes to generate a SiO2-containing bonding mass that is generic with regard to the material with a high silicic acid content, comprising the following procedural steps: provision of a slurry containing amorphous SiO2 particles; formation of a slurry mass between the connecting surfaces which are fixed in position with regard to each other; drying of the slurry mass; and solidification of the slurry mass by heating under formation of the SiO2-containing bonding mass. A component assembly manufactured according to the method of the invention shows high temperature resistance and thermal fatigue resistance and can also be used in contamination-sensitive applications. The component assembly is characterized by an amorphous SiO2-containing bonding mass, whose chemical composition is generic with regard to the material with the high silicic acid content of the basic material of the components, whereby the specific density of the SiO2-containing bonding mass is at least 2.0 g/cm3.
    • 在通过物质与物质接合的用于将由高硅酸含量的材料制成的部件的已知方法中,在部件的连接表面之间形成含SiO 2的结合块。 为了提供热稳定复合材料的成本有效的制造,本发明提出产生一种关于具有高硅酸含量的材料通用的含SiO 2的粘结块,包括 以下程序步骤:提供含有无定形SiO 2颗粒的浆料; 在连接表面之间形成相对于彼此固定的位置的浆料; 干燥浆料; 以及通过在形成含SiO 2的粘合剂块的同时加热使浆料质量固化。 根据本发明的方法制造的组件组件显示出耐高温性和耐热疲劳性,并且还可以用于污染敏感的应用中。 组分组合物的特征在于含有无定形SiO 2 N 2的键合物质,其化学组成对于组分的碱性材料的高硅酸含量的材料而言是通用的,由此具体的密度 的含SiO 2的粘合物质为至少2.0g / cm 3以上。
    • 5. 发明申请
    • Support jig of quartz glass for receiving wafer-like substrates of semiconductor material
    • 用于接收半导体材料的晶片状基板的石英玻璃支撑夹具
    • US20050224429A1
    • 2005-10-13
    • US10952095
    • 2004-09-28
    • Armin MaulRoland StockJurgen WeberThorsten Herbert
    • Armin MaulRoland StockJurgen WeberThorsten Herbert
    • H01L21/673A47G19/08
    • H01L21/67313
    • A support jig of quartz glass for receiving wafer-like substrates of semiconductor material in a vertical orientation comprises two spaced-apart circular end plates (10) which are interconnected by means of at least three transverse rods (1, 2, 3) extending in parallel with one another and between the end plates. They are provided with slots (4) for receiving the substrates, the slots (4) being open towards the substrate to be received and having a predetermined maximum slot depth, and they are arranged in a partial circle around the circular edge (5) of the end plates (10) such that an envelope (6) which encloses the partial circle on the outside projects nowhere beyond the circular edge (5). At least part of the transverse rods (1, 2, 3) have a radial cross-sectional profile which is configured as a circular form with a flattening (21, 31). The transverse rods (1, 2, 3) are arranged around the partial circle such that the flattening (21, 31) is oriented towards the circular edge of the end plates.
    • 石英玻璃的支撑夹具用于接收垂直取向的半导体材料的晶片状基板包括两个间隔开的圆形端板(10),其通过至少三个横向杆(1,2,3)相互连接,所述横向杆(1,2,3) 彼此平行并且在端板之间。 它们设置有用于接收基板的槽(4),槽(4)朝向待接收的基板开口并且具有预定的最大槽深度,并且它们围绕圆周边缘(5)的部分圆周布置 端板(10)使得在外部包围部分圆圈的外壳(6)突出超过圆形边缘(5)。 至少一部分横杆(1,2,3)具有径向横截面轮廓,其被构造成具有平坦化(21,31)的圆形形状。 横向杆(1,2,3)围绕部分圆布置,使得扁平化(21,31)朝向端板的圆形边缘定向。