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    • 3. 发明授权
    • Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
    • 电子部件处理装置,电子部件检测装置以及电子部件检测方法
    • US08941729B2
    • 2015-01-27
    • US13082668
    • 2011-04-08
    • Aritomo KikuchiHiroto Nakamura
    • Aritomo KikuchiHiroto Nakamura
    • H04N7/18G01R31/28
    • G01R31/2893G01R31/2891
    • An electronic device handling apparatus, which handles an electronic device under test having a first main surface provided thereon with first device terminals and a second main surface provided thereon with second device terminals, includes: a contact arm having a holding-side contact arm to which a first socket is attached and a suction pad which holds the electronic device under test; an alignment apparatus which positions the first socket and the electronic device under test; and the alignment apparatus which positions, with respect to a second socket, the electronic device under test being held by the suction pad and contacting the first socket, wherein the contact arm presses the second device terminals of the electronic device under test to the second socket.
    • 一种电子设备处理装置,其处理被测试的电子设备,其具有设置有第一设备端子的第一主表面和在其上设置有第二设备端子的第二主表面,所述电子设备处理设备包括:接触臂,具有保持侧接触臂, 连接第一插座和保持被测电子设备的吸盘; 对准装置,其将第一插座和被测电子装置定位; 以及对准装置,其相对于第二插座定位被测试的电子设备由吸盘保持并接触第一插座,其中接触臂将被测试的电子设备的第二设备端子按压到第二插座 。
    • 6. 发明申请
    • ELECTRONIC DEVICE HANDLING APPARATUS AND ELECTRONIC DEVICE POSITION DETECTION METHOD
    • 电子设备处理设备和电子设备位置检测方法
    • US20100310151A1
    • 2010-12-09
    • US12864742
    • 2008-12-22
    • Aritomo KikuchiTatsumi Koike
    • Aritomo KikuchiTatsumi Koike
    • G06K9/48G06K9/00
    • G01R31/2893G01R31/2891
    • An electronic device handling apparatus, wherein an image of terminals of an electronic device to be tested having the terminals at its end edge portions held by a conveyor device is taken, edges of terminals arranged in the X-axis direction are extracted from data of an taken image and binarization processing is performed on the data, while edges of terminals arranged in the Y-axis direction are extracted from data of the taken image and binarization processing is performed on the data, so that positions of edges of respective terminals are located from the obtained two binary images. Then, a positional deviation amount of the electronic device is calculated by comparing with reference positional information of edges of terminals of a reference electronic device and, based thereon, a posture of the electronic device to be tested is corrected.
    • 一种电子装置处理装置,其特征在于,在被传送装置保持的末端部分具有端子的待测试电子装置的端子的图像被取出,沿着X轴方向排列的端子的边缘从 对数据执行拍摄图像和二值化处理,同时从拍摄图像的数据中提取沿Y轴方向布置的终端的边缘,并对数据执行二值化处理,从而使各个终端的边缘位置从 获得两个二进制图像。 然后,通过与参考电子设备的端子的参考位置信息进行比较来计算电子设备的位置偏差量,并且基于此来校正待测试的电子设备的姿势。