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    • 2. 发明授权
    • Electronic device with foam antenna carrier
    • 带泡沫天线载体的电子设备
    • US09520643B2
    • 2016-12-13
    • US13860437
    • 2013-04-10
    • Apple Inc.
    • Boon W. ShiuChun-Lung Chen
    • H01Q1/38H01Q1/24H01Q9/04
    • H01Q1/38H01Q1/243H01Q9/0421Y10T29/49016
    • Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dielectric carrier such as a foam carrier. The foam carrier may be formed from a material that can withstand elevated temperatures. Metal traces for antennas can be formed on the foam carrier by selectively activating areas on a powder coating with a laser and plating the laser-activated areas. Metal for the antennas may also be formed by attaching layers such as flexible printed circuit layers and metal foil layers to the foam carrier. Solder may be used to attach a coaxial cable or other transmission line, electrical components, and other electrical structures to the metal antenna structures on the foam carrier. The foam carrier may be formed from open cell or closed cell foam. The surface of the foam may be smoothed to facilitate formation of metal antenna structures.
    • 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括介电载体,例如泡沫载体。 泡沫载体可以由能够承受高温的材料形成。 通过用激光选择性地激活粉末涂层上的区域并镀覆激光激活区域,可以在泡沫载体上形成用于天线的金属迹线。 用于天线的金属也可以通过将诸如柔性印刷电路层和金属箔层的层附着到泡沫载体上而形成。 焊料可用于将同轴电缆或其它传输线,电气部件和其他电气结构连接到泡沫载体上的金属天线结构。 泡沫载体可以由开孔或闭孔泡沫形成。 泡沫的表面可以被平滑以便于形成金属天线结构。
    • 3. 发明申请
    • Electronic Devices with Light Sensors
    • 带光传感器的电子设备
    • US20140166867A1
    • 2014-06-19
    • US13718850
    • 2012-12-18
    • APPLE INC.
    • Boon W. ShiuDavid Lin LeeMichael DiVincent
    • G01J1/02
    • G01J1/0271G01J1/0425G01J1/0444G01J1/4204G01J1/4228H04M1/22
    • Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure.
    • 电子设备可以设置有光传感器。 光传感器可以是接近传感器或环境光传感器。 接近传感器可以包括发光部件和感光部件。 电子设备可以包括由壳体结构形成的外壳和用于该装置的显示器的部分或全部。 外壳可以包括开口,例如由较小开口的簇形成的开口。 每个光传感器可以通过一组开口接收光。 光传感器可以直接通过开口接收光,或者可以接收穿过开口的光,并通过光导结构被引导到光传感器。 光引导结构可以包括光纤结构或光反射结构。 光纤结构可以填充或部分填充开口。 光反射结构可以在内部支撑结构中被加工成腔。
    • 6. 发明申请
    • Methods and Apparatus for Testing Electronic Devices with Antenna Arrays
    • 用天线阵列测试电子设备的方法和装置
    • US20140370821A1
    • 2014-12-18
    • US13916090
    • 2013-06-12
    • Apple Inc.
    • Jerzy GutermanJoshua G. NickelBoon W. ShiuMattia Pascolini
    • H04B17/00H04W24/00
    • H04W24/00H04W24/06
    • A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements formed along its periphery. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The electronic device may be tested using a test system for detecting the presence of manufacturing/assembly defects. The test system may include an RF tester and a test fixture. The device under test (DUT) may be attached to the test fixture during testing. Multiple test probes arranged along the periphery of the DUT may be used to transmit and receive RF test signals for gathering scattering parameter measurements on the device under test. The scattering parameter measurements may then be compared to predetermined threshold values to determine whether the DUT contains any defects.
    • 无线电子设备可以设置有天线结构。 天线结构可以由天线接地和沿其周边形成的天线谐振元件的阵列形成。 天线谐振元件可以由围绕天线接地的电介质支撑结构上的金属迹线形成。 可以使用用于检测制造/组装缺陷的存在的测试系统来测试电子设备。 测试系统可以包括RF测试器和测试夹具。 被测设备(DUT)可以在测试期间连接到测试夹具。 沿着DUT周边布置的多个测试探头可用于发送和接收RF测试信号,用于在被测器件上采集散射参数测量。 然后可以将散射参数测量与预定阈值进行比较,以确定DUT是否包含任何缺陷。