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1. 发明授权

US5540548A Redundant blower unit 失效
标题翻译：冗余风机单元
公开(公告)号：US5540548A
公开(公告)日：1996-07-30
申请号：US415176
申请日：1995-03-31
申请人： Anthony N. Eberhardt , Eddie Y. Wong , Chin Y. Cheng , Mario J. Lee
发明人： Anthony N. Eberhardt , Eddie Y. Wong , Chin Y. Cheng , Mario J. Lee
IPC分类号： F04D25/16 , F04D17/00
CPC分类号： F04D25/166
摘要： A redundant blower unit is installed in a rack above another unit containing heat-emitting electrical elements (such as CPU cards) in order to draw air through the underlying unit and out to atmosphere. Four blowers in the blower unit draw air from a plenum, each blower discharging into an individual exhaust duct leading to the exterior. Two blowers are positioned at a first tier relative to the bottom of the plenum and the other two at a second tier higher than the first tier. If one blower fails, its exhaust duct may malfunction as an air inlet, in which case the incoming air is mixed with exhaust air and discharged through the other blower in the same tier as the failed blower. Thus the efficiency of the two blowers in the other tier is not impeded.
摘要翻译：冗余吹风机单元安装在另一个装有发热电气元件（如CPU卡）的单元上方的机架中，以便通过下层单元吸入空气并进入大气。鼓风机组中的四个鼓风机从气室吸入空气，每个鼓风机排放到通向外部的各个排气管道中。两个鼓风机相对于增压室的底部定位在第一层，而另外两个鼓风机位于高于第一层的第二层。如果一个鼓风机发生故障，其排气管道可能作为进气口发生故障，在这种情况下，进入的空气与排气混合，并通过与失效鼓风机相同层级的其他鼓风机排出。因此，另一层的两台鼓风机的效率不受阻碍。

2. 发明授权

US06655917B1 Method and apparatus for serial coolant flow control 有权
标题翻译：连续冷却液流量控制的方法和装置
公开(公告)号：US06655917B1
公开(公告)日：2003-12-02
申请号：US09691483
申请日：2000-10-17
申请人： Mario J. Lee , Anthony N. Eberhardt
发明人： Mario J. Lee , Anthony N. Eberhardt
IPC分类号： H05K720
CPC分类号： H05K7/20727
摘要： The present invention provides a method and apparatus for serial coolant flow control. In one embodiment of the present invention, two or more sets of angled rotating blades are used in series to increase the coolant pressure and flow. In this embodiment, the rotational direction of a set of blades is the reverse of the rotational direction of any set of blades next to it. In one embodiment, the angles of the blades are such that the forward velocity created by a set of blades is in the same direction as forward velocities created by other sets of blades in the system. In one embodiment, the blades of one set form a right angle with the blades of any set next to it. In one embodiment, the coolant flow controller is a fan. In another embodiment, the coolant is air. In yet another embodiment, the system being cooled is an electronic system.
摘要翻译：本发明提供一种串联冷却剂流量控制的方法和装置。在本发明的一个实施例中，串联使用两组或多组成角度的旋转叶片来增加冷却剂的压力和流量。在该实施例中，一组叶片的旋转方向与其旁边的任何一组叶片的旋转方向相反。在一个实施例中，叶片的角度使得由一组叶片产生的向前速度与由系统中的其它组叶片产生的向前速度相同。在一个实施例中，一组叶片与其旁边的任何组的叶片成直角。在一个实施例中，冷却剂流量控制器是风扇。在另一个实施例中，冷却剂是空气。在另一个实施例中，被冷却的系统是电子系统。

3. 发明授权

US5949646A Compact computer having a redundant air moving system and method thereof 失效
标题翻译：具有冗余空气移动系统的紧凑型计算机及其方法
公开(公告)号：US5949646A
公开(公告)日：1999-09-07
申请号：US127258
申请日：1998-07-31
申请人： Mario J. Lee , Anthony N. Eberhardt , Eric R. Eberhardt
发明人： Mario J. Lee , Anthony N. Eberhardt , Eric R. Eberhardt
IPC分类号： H05K7/20
CPC分类号： H05K7/2019
摘要： A computer having a compact enclosure separated into two cooperative compartments, each having a pair of air fans for cooling electrical heat generating elements located in each compartment, the pair of fans being arranged on common sides of the compartments, one fan serving as a redundant fan on the failure of one of the other fans, the compartments are interconnected on opposite sides relative to the fans by an airflow plenum and separated by an airflow blockage wall in a manner that cooling air introduced into one compartment is circulated through both compartments before being exhausted from the other compartment.
摘要翻译：一种具有分离成两个协作室的紧凑型外壳的计算机，每个具有一对空气风扇，用于冷却位于每个隔室中的电热元件，一对风扇布置在隔间的共同侧面上，一个风扇用作冗余风扇在其他风扇之一的故障中，隔室通过气流通风室相对于风扇在相对侧相互连接并且被气流阻塞壁隔开，使得被引入到一个隔室中的冷却空气在被耗尽之前通过两个隔间循环从另一个隔间。

4. 发明授权

US5972736A Integrated circuit package and method 有权
标题翻译：集成电路封装及方法
公开(公告)号：US5972736A
公开(公告)日：1999-10-26
申请号：US205424
申请日：1998-12-04
申请人： Deviprasad Malladi , Mario J. Lee , Ehsan Ettehadieh , Nagaraj Mitty
发明人： Deviprasad Malladi , Mario J. Lee , Ehsan Ettehadieh , Nagaraj Mitty
IPC分类号： H01L23/24 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/24 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181
摘要： An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.
摘要翻译：公开了一种具有热塞的集成电路封装。使用单层高导电性粘合剂将散热块热耦合到一个或多个半导体管芯。本发明的组装方法包括以下步骤：将临时散热块附接到一个或多个半导体管芯附接到封装主体的背面。然后将半导体管芯电连接到封装主体并封装以保持封装腔内的固定位置。然后移动临时热块，并且使用单层高导电性粘合剂将最终的热块附着到封装主体和一个或多个半导体管芯的背面。封装紧凑，复杂性降低，制造成本低廉。

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