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    • 3. 发明授权
    • Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods
    • 针对栅格阵列(PGA)装置的可移动传热装置,以及相关的安装和拆卸方法
    • US06504243B1
    • 2003-01-07
    • US09544749
    • 2000-04-07
    • Anthony AndricLewis M. Eyman
    • Anthony AndricLewis M. Eyman
    • H01L2334
    • H01L23/4093H01L2224/05568H01L2224/05573H01L2224/16H01L2224/32225H01L2224/73204H01L2224/73253H01L2924/00014H01L2924/15174H01L2924/15312H01L2224/05599
    • A heat transfer apparatus is described for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket (e.g., a zero insertion force or ZIF socket). The socket is mounted upon a surface of a printed circuit board (PCB) and includes two latching projections extending from opposite side surfaces. The heat transfer apparatus includes a thermally conductive heat sink and a spring clip for holding the heat sink in position relative to the PGA device. The heat sink may be made from a metal (e.g., aluminum), and may have multiple structures (e.g., fins or pins) extending from an upper surface. The heat sink has an opening in an underside surface for housing the PGA device and the socket. The heat sink also has a lip surrounding the opening for thermally coupling to the PCB about the socket. The heat sink also has a pair of holes extending through the heat sink from the upper surface of the heat sink into the opening. The spring clip has two side members each adapted for attaching to a different one of the two latching projections of the socket. Each of the pair of holes in the heat sink is positioned to receive a different one of the side members of the spring clip. Methods for coupling a heat sink to the PGA device using the spring clip and removing the installed spring clip are also described.
    • 描述了一种传热装置,用于耦合到包括集成电路并安装在插座(例如,零插入力或ZIF插座)内的引脚格栅阵列(PGA)装置。 插座安装在印刷电路板(PCB)的表面上,并且包括从相对侧表面延伸的两个闩锁突起。 传热装置包括导热散热器和用于将散热器相对于PGA装置保持就位的弹簧夹。 散热器可以由金属(例如铝)制成,并且可以具有从上表面延伸的多个结构(例如,翅片或销)。 散热器在下表面具有用于容纳PGA装置和插座的开口。 散热器还具有围绕开口的唇缘,用于与插座周围的PCB热耦合。 散热器还具有从散热器的上表面延伸穿过散热器进入开口的一对孔。 弹簧夹具有两个侧部构件,每个侧部构件适于附接到插座的两个闩锁突起中的不同的一个。 散热器中的一对孔中的每一个被定位成接收弹簧夹的不同的一个侧部构件。 还描述了使用弹簧夹将散热器连接到PGA装置并移除安装的弹簧夹的方法。
    • 4. 发明授权
    • Split power supply subsystem with isolated voltage supplies to satisfy a predetermined power limit
    • 分离电源子系统具有隔离的电源,以满足预定的功率限制
    • US07294976B1
    • 2007-11-13
    • US11234664
    • 2005-09-23
    • Anthony AndricDavid L. Wigton
    • Anthony AndricDavid L. Wigton
    • G05F1/00
    • H02J1/102G06F1/26
    • A power subsystem including a mechanism for satisfying a predetermined power limit in a computer system. The power subsystem may include a split power supply and a voltage regulator. The split power supply may include at least a first voltage supply line and a second voltage supply line. The voltage supply lines may be closely matched voltage sources, each configured to provide relatively the same voltage amount. The voltage regulator may step-down a voltage provided by each of the first and second voltage supply lines to generate a desired voltage for a load. The first voltage supply line may be isolated from the second voltage supply line to limit power provided through either the first or the second voltage supply line from exceeding a predetermined power limit. The predetermined power limit may be a power limit set by U.L. standard #60950, i.e., 250 Watts.
    • 一种电力子系统,包括用于在计算机系统中满足预定功率极限的机构。 电源子系统可以包括分离电源和电压调节器。 分离电源可以包括至少第一电压供应线和第二电压供应线。 电压供应线可以是紧密匹配的电压源,每个电压源被配置为提供相对相同的电压量。 电压调节器可以降压由第一和第二电压供应线中的每一个提供的电压,以产生用于负载的期望电压。 第一电压供应线可以与第二电压供应线隔离,以限制通过第一或第二电压供应线提供的功率超过预定功率限制。 预定功率限制可以是由U.L.设定的功率限制。 标准#60950,即250瓦。
    • 8. 发明授权
    • Spring contact for providing high current power to an integrated circuit
    • 用于向集成电路提供高电流功率的弹簧触点
    • US06364669B1
    • 2002-04-02
    • US09614817
    • 2000-07-12
    • Anthony AndricRuel Hill
    • Anthony AndricRuel Hill
    • H01R1200
    • H01L23/32H01L23/36H01L23/49811H01L2924/0002H01L2924/00
    • An integrated circuit package includes a semiconductor die, a base, and a plurality of external contacts. The base is coupled to the semiconductor die and includes at least one contact pad coupled to the semiconductor die. The plurality of external contacts extend from the base and are coupled to the semiconductor die. A circuit assembly includes a printed circuit board, an integrated circuit package, and a socket. The integrated circuit package includes a semiconductor die, a base coupled to the semiconductor die, and a plurality of external contacts extending from the base and being coupled to the semiconductor die. The base includes at least one contact pad coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the base. A contact is adapted to interface with the contact pad and one of the printed circuit board and the socket.
    • 集成电路封装包括半导体管芯,基座和多个外部触点。 基极耦合到半导体管芯并且包括耦合到半导体管芯的至少一个接触焊盘。 多个外部触头从基座延伸并耦合到半导体管芯。 电路组件包括印刷电路板,集成电路封装和插座。 集成电路封装包括半导体管芯,耦合到半导体管芯的基极以及从基极延伸并耦合到半导体管芯的多个外部触点。 基座包括耦合到半导体管芯的至少一个接触焊盘。 插座连接到印刷电路板并适于接收基座。 接触件适于与接触垫和印刷电路板和插座之一接合。