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1. 发明授权

US06392145B1 Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals 有权
标题翻译：半导体器件包括集成电路，其容纳在阵列封装中，该阵列封装具有布置在中心位置的电源端子周围的信号端子
公开(公告)号：US06392145B1
公开(公告)日：2002-05-21
申请号：US09570159
申请日：2000-05-11
申请人： Anthony Andric
发明人： Anthony Andric
IPC分类号： H01L2302
CPC分类号： H01L23/50 , H01L23/49838 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15312 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device package, and a semiconductor device employing the package, are described. The semiconductor device package is intended for housing an integrated circuit (IC), and includes a substrate adapted to receive the IC. The substrate includes a surface (e.g., an underside surface) having an outer portion surrounding a center portion. A first group of signal terminals are arranged about the outer portion of the surface, and a second group of power supply terminals are arranged about the center portion. Placing the power supply terminals in the center portion of the surface reduces the lengths of power supply current paths within the substrate, thus reducing IR voltage drops within the substrate. The power supply terminals are made physically larger than the signal terminals such that the electrical resistances of the power supply terminals are lower than the electrical resistances of the signal terminals.
摘要翻译：描述半导体器件封装以及采用封装的半导体器件。半导体器件封装用于容纳集成电路（IC），并且包括适于接收IC的衬底。衬底包括具有围绕中心部分的外部部分的表面（例如，下表面）。第一组信号端子围绕表面的外部部分布置，并且第二组电源端子围绕中心部分布置。将电源端子放置在表面的中心部分减小了衬底内的电源电流路径的长度，从而减少了衬底内的IR电压降。电源端子在物理上大于信号端子，使得电源端子的电阻低于信号端子的电阻。

2. 发明授权

US06551114B2 Semiconductor device having signal contacts and high current power contacts 有权
公开(公告)号：US06551114B2
公开(公告)日：2003-04-22
申请号：US09789141
申请日：2001-02-20
申请人： Anthony Andric , Ruel Hill
发明人： Anthony Andric , Ruel Hill
IPC分类号： H01R1200
CPC分类号： H05K7/1092 , H05K7/1007
摘要： A semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. A circuit assembly includes a printed circuit board, a semiconductor device, and a socket. The semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the semiconductor device. The socket includes a first plurality of contacts adapted to interface with the external contacts of the semiconductor device and at least one base contact adapted to interface with the contact pad.

3. 发明授权

US06504243B1 Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods 有权
标题翻译：针对栅格阵列（PGA）装置的可移动传热装置，以及相关的安装和拆卸方法
公开(公告)号：US06504243B1
公开(公告)日：2003-01-07
申请号：US09544749
申请日：2000-04-07
申请人： Anthony Andric , Lewis M. Eyman
发明人： Anthony Andric , Lewis M. Eyman
IPC分类号： H01L2334
CPC分类号： H01L23/4093 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15174 , H01L2924/15312 , H01L2224/05599
摘要： A heat transfer apparatus is described for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket (e.g., a zero insertion force or ZIF socket). The socket is mounted upon a surface of a printed circuit board (PCB) and includes two latching projections extending from opposite side surfaces. The heat transfer apparatus includes a thermally conductive heat sink and a spring clip for holding the heat sink in position relative to the PGA device. The heat sink may be made from a metal (e.g., aluminum), and may have multiple structures (e.g., fins or pins) extending from an upper surface. The heat sink has an opening in an underside surface for housing the PGA device and the socket. The heat sink also has a lip surrounding the opening for thermally coupling to the PCB about the socket. The heat sink also has a pair of holes extending through the heat sink from the upper surface of the heat sink into the opening. The spring clip has two side members each adapted for attaching to a different one of the two latching projections of the socket. Each of the pair of holes in the heat sink is positioned to receive a different one of the side members of the spring clip. Methods for coupling a heat sink to the PGA device using the spring clip and removing the installed spring clip are also described.
摘要翻译：描述了一种传热装置，用于耦合到包括集成电路并安装在插座（例如，零插入力或ZIF插座）内的引脚格栅阵列（PGA）装置。插座安装在印刷电路板（PCB）的表面上，并且包括从相对侧表面延伸的两个闩锁突起。传热装置包括导热散热器和用于将散热器相对于PGA装置保持就位的弹簧夹。散热器可以由金属（例如铝）制成，并且可以具有从上表面延伸的多个结构（例如，翅片或销）。散热器在下表面具有用于容纳PGA装置和插座的开口。散热器还具有围绕开口的唇缘，用于与插座周围的PCB热耦合。散热器还具有从散热器的上表面延伸穿过散热器进入开口的一对孔。弹簧夹具有两个侧部构件，每个侧部构件适于附接到插座的两个闩锁突起中的不同的一个。散热器中的一对孔中的每一个被定位成接收弹簧夹的不同的一个侧部构件。还描述了使用弹簧夹将散热器连接到PGA装置并移除安装的弹簧夹的方法。

4. 发明授权

US07294976B1 Split power supply subsystem with isolated voltage supplies to satisfy a predetermined power limit 失效
标题翻译：分离电源子系统具有隔离的电源，以满足预定的功率限制
公开(公告)号：US07294976B1
公开(公告)日：2007-11-13
申请号：US11234664
申请日：2005-09-23
申请人： Anthony Andric , David L. Wigton
发明人： Anthony Andric , David L. Wigton
IPC分类号： G05F1/00
CPC分类号： H02J1/102 , G06F1/26
摘要： A power subsystem including a mechanism for satisfying a predetermined power limit in a computer system. The power subsystem may include a split power supply and a voltage regulator. The split power supply may include at least a first voltage supply line and a second voltage supply line. The voltage supply lines may be closely matched voltage sources, each configured to provide relatively the same voltage amount. The voltage regulator may step-down a voltage provided by each of the first and second voltage supply lines to generate a desired voltage for a load. The first voltage supply line may be isolated from the second voltage supply line to limit power provided through either the first or the second voltage supply line from exceeding a predetermined power limit. The predetermined power limit may be a power limit set by U.L. standard #60950, i.e., 250 Watts.
摘要翻译：一种电力子系统，包括用于在计算机系统中满足预定功率极限的机构。电源子系统可以包括分离电源和电压调节器。分离电源可以包括至少第一电压供应线和第二电压供应线。电压供应线可以是紧密匹配的电压源，每个电压源被配置为提供相对相同的电压量。电压调节器可以降压由第一和第二电压供应线中的每一个提供的电压，以产生用于负载的期望电压。第一电压供应线可以与第二电压供应线隔离，以限制通过第一或第二电压供应线提供的功率超过预定功率限制。预定功率限制可以是由U.L.设定的功率限制。标准＃60950，即250瓦。

5. 发明授权

US06439912B1 Method and apparatus for lifting an integrated circuit from a socket 失效
标题翻译：从插座提升集成电路的方法和装置
公开(公告)号：US06439912B1
公开(公告)日：2002-08-27
申请号：US09805869
申请日：2001-03-14
申请人： Anthony Andric , Ruel Hill , Doug Markwardt
发明人： Anthony Andric , Ruel Hill , Doug Markwardt
IPC分类号： H01R13625
CPC分类号： H01R13/6335
摘要： A lift mechanism is provided that facilitates removal of an integrated circuit from a socket. Such a socket includes a base portion and a cover that slidably engages with the base portion. An actuation device moves the cover laterally with respect to the base. A lift mechanism responds to the cover moving in a first lateral direction into an open position in which the integrated circuit can be removed from the socket, by moving at least partially in an upward direction sufficiently to displace the integrated circuit away from the socket, thereby more easily allowing the integrated circuit to be grasped and removed from the socket.
摘要翻译：提供了一种便于从插座移除集成电路的升降机构。这种插座包括基部和与基部可滑动地接合的盖。致动装置相对于基座横向移动盖。提升机构响应于在第一横向方向上移动的盖子到集成电路可以从插座移除的打开位置，通过至少部分地向上移动足够的方式使集成电路远离插座，由此更容易地使集成电路从插座中被抓住并移除。

6. 发明授权

US08498117B2 Variable mount voltage regulator 有权
标题翻译：可变安装稳压器
公开(公告)号：US08498117B2
公开(公告)日：2013-07-30
申请号：US11560481
申请日：2006-11-16
申请人： Anthony Andric , David L. Wigton , Paul Devriendt
发明人： Anthony Andric , David L. Wigton , Paul Devriendt
IPC分类号： H05K7/20
CPC分类号： H05K7/1092 , H01L23/34 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Various integrated circuit voltage regulation apparatus and methods of assembling the same are provided. In one aspect, an apparatus is provided that has a stack that includes a heat sink and a semiconductor chip. The semiconductor chip has a conductive heat transfer pathway to the heat sink. A voltage regulator member is electrically coupled to the semiconductor chip and coupled to the heat sink, but is not positioned in the stack.
摘要翻译：提供各种集成电路电压调节装置及其组装方法。在一个方面，提供一种装置，其具有包括散热器和半导体芯片的堆叠。半导体芯片具有到散热器的导电传热通路。电压调节器构件电耦合到半导体芯片并且耦合到散热器，但是不位于堆叠中。

7. 发明申请

US20080117593A1 Variable Mount Voltage Regulator 有权
标题翻译：可变安装稳压器
公开(公告)号：US20080117593A1
公开(公告)日：2008-05-22
申请号：US11560481
申请日：2006-11-16
申请人： Anthony Andric , David L. Wigton , Paul Devriendt
发明人： Anthony Andric , David L. Wigton , Paul Devriendt
IPC分类号： H05K7/20
CPC分类号： H05K7/1092 , H01L23/34 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Various integrated circuit voltage regulation apparatus and methods of assembling the same are provided. In one aspect, an apparatus is provided that has a stack that includes a heat sink and a semiconductor chip. The semiconductor chip has a conductive heat transfer pathway to the heat sink. A voltage regulator member is electrically coupled to the semiconductor chip and coupled to the heat sink, but is not positioned in the stack.
摘要翻译：提供各种集成电路电压调节装置及其组装方法。在一个方面，提供一种装置，其具有包括散热器和半导体芯片的堆叠。半导体芯片具有到散热器的导电传热通路。电压调节器构件电耦合到半导体芯片并且耦合到散热器，但是不位于堆叠中。

8. 发明授权

US06364669B1 Spring contact for providing high current power to an integrated circuit 有权
标题翻译：用于向集成电路提供高电流功率的弹簧触点
公开(公告)号：US06364669B1
公开(公告)日：2002-04-02
申请号：US09614817
申请日：2000-07-12
申请人： Anthony Andric , Ruel Hill
发明人： Anthony Andric , Ruel Hill
IPC分类号： H01R1200
CPC分类号： H01L23/32 , H01L23/36 , H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit package includes a semiconductor die, a base, and a plurality of external contacts. The base is coupled to the semiconductor die and includes at least one contact pad coupled to the semiconductor die. The plurality of external contacts extend from the base and are coupled to the semiconductor die. A circuit assembly includes a printed circuit board, an integrated circuit package, and a socket. The integrated circuit package includes a semiconductor die, a base coupled to the semiconductor die, and a plurality of external contacts extending from the base and being coupled to the semiconductor die. The base includes at least one contact pad coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the base. A contact is adapted to interface with the contact pad and one of the printed circuit board and the socket.
摘要翻译：集成电路封装包括半导体管芯，基座和多个外部触点。基极耦合到半导体管芯并且包括耦合到半导体管芯的至少一个接触焊盘。多个外部触头从基座延伸并耦合到半导体管芯。电路组件包括印刷电路板，集成电路封装和插座。集成电路封装包括半导体管芯，耦合到半导体管芯的基极以及从基极延伸并耦合到半导体管芯的多个外部触点。基座包括耦合到半导体管芯的至少一个接触焊盘。插座连接到印刷电路板并适于接收基座。接触件适于与接触垫和印刷电路板和插座之一接合。

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