专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4925727A Curable temperature indicating composition 失效
标题翻译：可固化温度指示组成
公开(公告)号：US4925727A
公开(公告)日：1990-05-15
申请号：US403451
申请日：1982-07-30
申请人： Andrew V. Brown , Tamar G. Gen , Gary R. Weihe
发明人： Andrew V. Brown , Tamar G. Gen , Gary R. Weihe
IPC分类号： B41M5/28 , G01K11/16
CPC分类号： G01K11/16 , B41M5/284 , Y10T428/24835
摘要： A temperature indicating composition is provided for use on a recoverable article so that heating to produce recovery or to activate a heat-activatable sealant can be monitored. The composition comprises a thermochromic colorant in a binder that can be cured by UV radiation. Such a composition can be applied rapidly to polyolefin substrates by printing.
摘要翻译：提供温度指示组合物用于可回收制品，从而可以监测加热以产生回收或活化可热激活的密封剂。该组合物包含可通过UV辐射固化的粘合剂中的热变色着色剂。这样的组合物可以通过印刷快速地应用于聚烯烃基材。

2. 发明授权

US4655076A Moisture measuring apparatus 失效
标题翻译：水分测量仪
公开(公告)号：US4655076A
公开(公告)日：1987-04-07
申请号：US573230
申请日：1984-01-23
申请人： Gary R. Weihe , Roger D. Lion
发明人： Gary R. Weihe , Roger D. Lion
IPC分类号： G01N19/10
CPC分类号： G01N19/10
摘要： An apparatus for measuring the moisture content of soil includes a chamber having a water-swellable material in the chamber, the chamber being sized so that the water-swellable material can swell to its fully swollen state, with the external resistance, if any, against the swelling being substantially constant. The device includes a device for transmitting water to the water-swellable material so that it is in equilibrium with the environment. A sensor responsive to the volume of the water-swellable material is provided to indicate the water content of the environment exterior of the apparatus. The preferred sensor is a magnet moveable by the water-swellable material and a Hall effect sensing device.
摘要翻译：用于测量土壤含水量的装置包括在室中具有水溶胀材料的室，该室的尺寸使得水溶胀性材料可以膨胀至其完全膨胀的状态，如果有的话，外部阻力肿胀基本上恒定。该装置包括用于将水传递到水可溶胀材料以使其与环境平衡的装置。提供响应于水可溶胀材料的体积的传感器以指示设备外部的环境的含水量。优选的传感器是由水可溶胀材料和霍尔效应感测装置可移动的磁体。

3. 发明授权

US5214000A Thermal transfer posts for high density multichip substrates and formation method 失效
标题翻译：用于高密度多芯片基板的热转印柱和形成方法
公开(公告)号：US5214000A
公开(公告)日：1993-05-25
申请号：US810224
申请日：1991-12-19
申请人： David J. Chazan , Gary R. Weihe , Richard F. Otte
发明人： David J. Chazan , Gary R. Weihe , Richard F. Otte
IPC分类号： H01L23/12 , H01L21/48 , H01L23/367 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/46
CPC分类号： H01L23/367 , H01L21/486 , H01L23/3677 , H05K1/0206 , H01L2224/32225 , H05K1/0306 , H05K2201/0154 , H05K2201/10674 , H05K2203/0733 , H05K3/0035 , H05K3/467
摘要： Thermal post vias are formed within a formed multi-layer, high density interconnect including a base and plural layers of metal conductors separated by dielectric material by the steps of:removing in a single step dielectric material at predetermined sites of the thermal post vias to define substantially cylindrical post holes, andforming the thermal post vias by emplacing conductor material, such as metal, into the post holes so that the material fully occupies and fills up the holes.
摘要翻译：热后通孔形成在形成的多层高密度互连中，包括基底和由电介质材料隔开的多层金属导体，通过以下步骤形成：在单个步骤中去除热后通孔的预定位置的介电材料，以限定基本上圆柱形的孔，并且通过将导体材料（例如金属）放置在柱孔中而形成热柱通孔，使得材料完全占据并填充孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式